MPC755BPX350LE vs SC755BPX350LE Vergleich

Detaillierter Direktvergleich von MPC755BPX350LE von NXP Semiconductors und SC755BPX350LE von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

NXP Semiconductors
MPC755BPX350LE MPC755BPX350LE - PowerPC 350MHz MPU, 360-FCPBGA | NXP

MPC755BPX350LE - PowerPC 350MHz MPU, 360-FCPBGA | NXP

MPC755BPX350LE Nrnd

Spezifikationsvergleich

Parameter MPC755BPX350LE SC755BPX350LE
Marke NXP Semiconductors NXP Semiconductors
Kategorie Microcontrollers Microcontrollers
Lebenszyklusstatus NRND NRND
Lagerstatus In Stock In Stock
Stückpreis (USD) $49,90 $65,85
Product Type Microprocessor (MPU) —
Architecture RISC, PowerPC MPC7xx Power Architecture (PowerPC) 32-bit RISC
Core Count 1 —
Datenbusbreite 64-Bit —
Clock Speed (Core) 350 MHz —
Supply Voltage (Core) 2 V —
I/O Supply Voltage 3.3 V —
Gehäuse 360-FCPBGA (25x25 mm, 1.27 mm pitch) BGA (high-density, surface-mount)
Terminal Form Ball —
Number of Terminals 360 —
L1 Instruction Cache 32 KB —
L1 Data Cache 32 KB —
Process Technology 0.22 micrometer CMOS CMOS (process node not publicly disclosed)
Feuchtigkeitsempfindlichkeitsgrad (MSL) 3 —
Package Type FCBGA-360, Plastic, 25x25 mm, 2.77 mm height —
RoHS-Status [DATA_NEEDED: RoHS compliance] [DATA_NEEDED]
Core Frequency — 350 MHz
Bus Frequency — 360 MHz
Instruction Set — Power Architecture 32-bit
L1 Cache — [DATA_NEEDED: L1 instruction/data split and size]
Bus Interface — 60x/MPX bus
MMU — Yes - hardware memory management
Endianness — Big- and little-endian support
Floating Point Unit — [DATA_NEEDED: FPU presence/configuration]
Multiprocessing — Hardware-assisted SMP support
Montageart — Surface Mount
Betriebstemperatur — [DATA_NEEDED: industrial/extended grade]

Datenblätter & Ressourcen

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