MPC8250ACZUMHBC vs MPC8255ACZUMHBB Comparison

Detailed side-by-side comparison of MPC8250ACZUMHBC by NXP Semiconductors and MPC8255ACZUMHBB by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

NXP Semiconductors
MPC8250ACZUMHBC MPC8250ACZUMHBC - PowerPC G2 MPU 266MHz 480-TBGA | NXP

MPC8250ACZUMHBC - PowerPC G2 MPU 266MHz 480-TBGA | NXP

MPC8250ACZUMHBC ⚠ Last Time Buy
NXP Semiconductors
MPC8255ACZUMHBB MPC8255ACZUMHBB - PowerQUICC II HIP4, 266MHz, 480-TBGA | NXP

MPC8255ACZUMHBB - PowerQUICC II HIP4, 266MHz, 480-TBGA | NXP

MPC8255ACZUMHBB Obsolete

Specification Comparison

Parameter MPC8250ACZUMHBC MPC8255ACZUMHBB
Brand NXP Semiconductors NXP Semiconductors
Category Microcontrollers Microcontrollers
Lifecycle Status Last Time Buy Obsolete
Stock Status In Stock In Stock
Unit Price (USD) $85.00 $97.50
Manufacturer NXP Semiconductors (formerly Freescale/Motorola) NXP Semiconductors
Series MPC82xx (PowerQUICC II) PowerQUICC II HIP4
Core Processor PowerPC G2 —
Number of Cores 1 Core, 32-Bit 1
Co-Processors / DSP Communications; RISC CPM —
Speed 266 MHz —
Process Technology 0.25 micron 0.25 micron (HiP4) silicon revision
Supply Voltage (I/O) 3.3 V —
Core Voltage 1.8 V —
Package / Case 480-TBGA (37.5 x 37.5 mm) —
Pin Count 480 —
Data Bus Width 32-bit internal / 64-bit external 64-Bit
Architecture RISC —
RAM Controllers DRAM, SDRAM —
Graphics Acceleration No —
Operating Temperature [DATA_NEEDED: operating temperature range] [DATA_NEEDED: operating temperature range]
Mounting Type Surface Mount (BGA) Surface Mount
Lifecycle Status Last Time Buy (NXP EOL announced) —
Lead Free Yes (per BGA-516 datasheet note: LEAD FREE, PLASTIC) —
RoHS Status [DATA_NEEDED: RoHS compliance status] [DATA_NEEDED: RoHS compliance status]
Core Architecture — PowerPC G2
Core Supply Voltage — 1.8 V
Maximum Clock Speed — 266 MHz
Instruction Set — 32-Bit RISC
Core — MPC82xx
Package Type — T-BGA
Pin/Ball Count — 480
Package Size — 37.50 x 37.50 mm
Package Height — 1.55 mm
Ball Pitch — 1.27 mm
Integrated CPM — Yes (dual communications processor modules)
Ethernet MACs — Dual 10/100 MAC

Datasheets & Resources

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