MPC8250ACZUMHBC vs MPC8255ACZUMHBB 对比

详细并排对比 MPC8250ACZUMHBC 出自 NXP Semiconductors 和 MPC8255ACZUMHBB 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

NXP Semiconductors
MPC8250ACZUMHBC MPC8250ACZUMHBC - PowerPC G2 MPU 266MHz 480-TBGA | NXP

MPC8250ACZUMHBC - PowerPC G2 MPU 266MHz 480-TBGA | NXP

MPC8250ACZUMHBC ⚠ 最后一次采购
NXP Semiconductors
MPC8255ACZUMHBB MPC8255ACZUMHBB - PowerQUICC II HIP4, 266MHz, 480-TBGA | NXP

MPC8255ACZUMHBB - PowerQUICC II HIP4, 266MHz, 480-TBGA | NXP

MPC8255ACZUMHBB Obsolete

规格对比

参数 MPC8250ACZUMHBC MPC8255ACZUMHBB
品牌 NXP Semiconductors NXP Semiconductors
分类 Microcontrollers Microcontrollers
生命周期状态 最后采购期 Obsolete
库存状态 有库存 有库存
单价(USD) $85.00 $97.50
Manufacturer NXP Semiconductors (formerly Freescale/Motorola) NXP Semiconductors
Series MPC82xx (PowerQUICC II) PowerQUICC II HIP4
Core Processor PowerPC G2 —
Number of Cores 1 Core, 32-Bit 1
Co-Processors / DSP Communications; RISC CPM —
Speed 266 MHz —
Process Technology 0.25 micron 0.25 micron (HiP4) silicon revision
Supply Voltage (I/O) 3.3 V —
Core Voltage 1.8 V —
封装 / 外壳 480-TBGA (37.5 x 37.5 mm) —
引脚数量 480 —
数据总线宽度 32-bit internal / 64-bit external 64-Bit
Architecture RISC —
RAM Controllers DRAM, SDRAM —
Graphics Acceleration No —
工作温度 [DATA_NEEDED: operating temperature range] [DATA_NEEDED: operating temperature range]
安装类型 Surface Mount (BGA) Surface Mount
生命周期状态 Last Time Buy (NXP EOL announced) —
Lead Free Yes (per BGA-516 datasheet note: LEAD FREE, PLASTIC) —
RoHS 状态 [DATA_NEEDED: RoHS compliance status] [DATA_NEEDED: RoHS compliance status]
Core Architecture — PowerPC G2
Core Supply Voltage — 1.8 V
Maximum Clock Speed — 266 MHz
Instruction Set — 32-Bit RISC
Core — MPC82xx
Package Type — T-BGA
Pin/Ball Count — 480
Package Size — 37.50 x 37.50 mm
Package Height — 1.55 mm
Ball Pitch — 1.27 mm
Integrated CPM — Yes (dual communications processor modules)
Ethernet MACs — Dual 10/100 MAC

数据手册与资源

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