MPC885VR66 vs MPC885CZP66 Comparison
Detailed side-by-side comparison of MPC885VR66 by NXP Semiconductors and MPC885CZP66 by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
NXP Semiconductors
MPC885VR66 - 66MHz 32-Bit PowerQUICC MPU | NXP Semiconductors
MPC885VR66 ✗ End of Life
Specification Comparison
| Parameter | MPC885VR66 | MPC885CZP66 |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Category | Microcontrollers | Microcontrollers |
| Lifecycle Status | End of Life | NRND |
| Manufacturer | NXP Semiconductors | NXP Semiconductors |
| Product Type | PowerQUICC Communications Processor | — |
| Processor Architecture | 32-Bit Power Architecture | — |
| Core Count | 1 core | 1 |
| Maximum Clock Frequency | 66 MHz | — |
| Advertised Performance | 87 MIPS | — |
| Supply Voltage | 3.3 V | 3.3 V (typical) |
| Process Technology | 0.18 um | 0.18 micrometer CMOS |
| Package | 357-PBGA (25 x 25 mm) | — |
| Package Family | 357-BBGA | — |
| Mounting Type | Surface Mount | Surface Mount |
| Packaging | Tray | — |
| Operating Temperature Range | 0°C to 95°C | — |
| Lifecycle Status | End of Life | — |
| Lead-Free Status | Lead Free | — |
| RoHS Status | RoHS Compliant | [DATA_NEEDED: RoHS compliance status] |
| REACH Status | [DATA_NEEDED: REACH compliance status] | — |
| AEC-Q100 Qualification | [DATA_NEEDED: AEC-Q100 qualification status] | — |
| Internal Memory Configuration | [DATA_NEEDED: cache, SRAM, and ROM configuration] | — |
| External Memory Interfaces | [DATA_NEEDED: supported external memory interfaces] | — |
| Ethernet Capability | [DATA_NEEDED: Ethernet controller configuration] | — |
| Serial Interface Configuration | [DATA_NEEDED: UART, SPI, I2C, and CAN interface details] | — |
| Series | — | PowerQUICC, MPC8xx |
| Core Architecture | — | Power Architecture, 32-bit |
| Data Bus Width | — | 32 bit |
| Core Clock Speed | — | 66 MHz |
| Package Type | — | PBGA (Plastic Ball Grid Array) |
| Package Pin Count | — | 357 |
| Package Size | — | 25 x 25 mm |
| Moisture Sensitivity Level | — | MSL 3 |
| Operating Temperature | — | -40C to +100C |
| Terminal Form | — | Ball |
| Package Code | — | BGA |
| Package Shape | — | Square |
| Lead-Free | — | [DATA_NEEDED: lead-free status] |