MPC885VR66 vs MPC885CZP66 Perbandingan
Perbandingan bersamaan detil MPC885VR66 dari NXP Semiconductors dan MPC885CZP66 dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
NXP Semiconductors
MPC885VR66 - 66MHz 32-Bit PowerQUICC MPU | NXP Semiconductors
MPC885VR66 ✗ Akhir Hidup
Perbandingan Spesifikasi
| Parameter Umum | MPC885VR66 | MPC885CZP66 |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Akhir Hidup | NRND |
| Manufacturer | NXP Semiconductors | NXP Semiconductors |
| Product Type | PowerQUICC Communications Processor | — |
| Processor Architecture | 32-Bit Power Architecture | — |
| Core Count | 1 core | 1 |
| Frekuensi Bawah Maximum | 66 MHz | — |
| Advertised Performance | 87 MIPS | — |
| Tegangan Pemuat | 3.3 V | 3.3 V (typical) |
| Process Technology | 0.18 um | 0.18 micrometer CMOS |
| Paket | 357-PBGA (25 x 25 mm) | — |
| Package Family | 357-BBGA | — |
| Tipe Mounting | Surface Mount | Surface Mount |
| Packaging | Tray | — |
| Rentang Suhu Kerja | 0°C to 95°C | — |
| Status Lingkungan Hidup | End of Life | — |
| Lead-Free Status | Lead Free | — |
| Status RoHS | RoHS Compliant | [DATA_NEEDED: RoHS compliance status] |
| REACH Status | [DATA_NEEDED: REACH compliance status] | — |
| AEC-Q100 Qualification | [DATA_NEEDED: AEC-Q100 qualification status] | — |
| Internal Memory Configuration | [DATA_NEEDED: cache, SRAM, and ROM configuration] | — |
| External Memory Interfaces | [DATA_NEEDED: supported external memory interfaces] | — |
| Ethernet Capability | [DATA_NEEDED: Ethernet controller configuration] | — |
| Serial Interface Configuration | [DATA_NEEDED: UART, SPI, I2C, and CAN interface details] | — |
| Series | — | PowerQUICC, MPC8xx |
| Core Architecture | — | Power Architecture, 32-bit |
| Lebar Bus Data | — | 32 bit |
| Core Clock Speed | — | 66 MHz |
| Package Type | — | PBGA (Plastic Ball Grid Array) |
| Package Pin Count | — | 357 |
| Package Size | — | 25 x 25 mm |
| Moisture Sensitivity Level | — | MSL 3 |
| Suhu Kerja | — | -40C to +100C |
| Terminal Form | — | Ball |
| Package Code | — | BGA |
| Package Shape | — | Square |
| Lead-Free | — | [DATA_NEEDED: lead-free status] |