MPC885VR66 vs MPC885CZP66 Comparaison
Comparaison détaillée côte à côte de MPC885VR66 par NXP Semiconductors et MPC885CZP66 par NXP Semiconductors. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
NXP Semiconductors
MPC885VR66 - 66MHz 32-Bit PowerQUICC MPU | NXP Semiconductors
MPC885VR66 ✗ Fin de vie
Comparaison des spécifications
| Paramètre | MPC885VR66 | MPC885CZP66 |
|---|---|---|
| Marque | NXP Semiconductors | NXP Semiconductors |
| Catégorie | Microcontrollers | Microcontrollers |
| Statut du cycle de vie | Fin de vie | NRND |
| Manufacturer | NXP Semiconductors | NXP Semiconductors |
| Product Type | PowerQUICC Communications Processor | — |
| Processor Architecture | 32-Bit Power Architecture | — |
| Core Count | 1 core | 1 |
| Fréquence d'horloge maximale | 66 MHz | — |
| Advertised Performance | 87 MIPS | — |
| Tension d'alimentation | 3.3 V | 3.3 V (typical) |
| Process Technology | 0.18 um | 0.18 micrometer CMOS |
| Boîtier | 357-PBGA (25 x 25 mm) | — |
| Package Family | 357-BBGA | — |
| Type de montage | Surface Mount | Surface Mount |
| Packaging | Tray | — |
| Plage de température de fonctionnement | 0°C to 95°C | — |
| Statut du cycle de vie | End of Life | — |
| Lead-Free Status | Lead Free | — |
| Statut RoHS | RoHS Compliant | [DATA_NEEDED: RoHS compliance status] |
| REACH Status | [DATA_NEEDED: REACH compliance status] | — |
| AEC-Q100 Qualification | [DATA_NEEDED: AEC-Q100 qualification status] | — |
| Internal Memory Configuration | [DATA_NEEDED: cache, SRAM, and ROM configuration] | — |
| External Memory Interfaces | [DATA_NEEDED: supported external memory interfaces] | — |
| Ethernet Capability | [DATA_NEEDED: Ethernet controller configuration] | — |
| Serial Interface Configuration | [DATA_NEEDED: UART, SPI, I2C, and CAN interface details] | — |
| Series | — | PowerQUICC, MPC8xx |
| Core Architecture | — | Power Architecture, 32-bit |
| Largeur du bus de données | — | 32 bit |
| Core Clock Speed | — | 66 MHz |
| Package Type | — | PBGA (Plastic Ball Grid Array) |
| Package Pin Count | — | 357 |
| Package Size | — | 25 x 25 mm |
| Moisture Sensitivity Level | — | MSL 3 |
| Température de fonctionnement | — | -40C to +100C |
| Terminal Form | — | Ball |
| Package Code | — | BGA |
| Package Shape | — | Square |
| Lead-Free | — | [DATA_NEEDED: lead-free status] |