MPC885VR66 vs MPC885CZP66 Сравнение
Подробное сравнение бок о бок MPC885VR66 от NXP Semiconductors и MPC885CZP66 от NXP Semiconductors. Сравните ключевые характеристики, электрические параметры, упаковку, статус жизненного цикла, цены и наличие, чтобы выбрать лучший компонент для ваших требований.
NXP Semiconductors
MPC885VR66 - 66MHz 32-Bit PowerQUICC MPU | NXP Semiconductors
MPC885VR66 ✗ Снят с производства
Сравнение характеристик
| Параметр | MPC885VR66 | MPC885CZP66 |
|---|---|---|
| Бренд | NXP Semiconductors | NXP Semiconductors |
| Категория | Microcontrollers | Microcontrollers |
| Статус жизненного цикла | Снято с производства | NRND |
| Manufacturer | NXP Semiconductors | NXP Semiconductors |
| Product Type | PowerQUICC Communications Processor | — |
| Processor Architecture | 32-Bit Power Architecture | — |
| Core Count | 1 core | 1 |
| Максимальная тактовая частота | 66 MHz | — |
| Advertised Performance | 87 MIPS | — |
| Напряжение питания | 3.3 V | 3.3 V (typical) |
| Process Technology | 0.18 um | 0.18 micrometer CMOS |
| Корпус | 357-PBGA (25 x 25 mm) | — |
| Package Family | 357-BBGA | — |
| Тип монтажа | Surface Mount | Surface Mount |
| Packaging | Tray | — |
| Диапазон рабочих температур | 0°C to 95°C | — |
| Статус жизненного цикла | End of Life | — |
| Lead-Free Status | Lead Free | — |
| Статус RoHS | RoHS Compliant | [DATA_NEEDED: RoHS compliance status] |
| REACH Status | [DATA_NEEDED: REACH compliance status] | — |
| AEC-Q100 Qualification | [DATA_NEEDED: AEC-Q100 qualification status] | — |
| Internal Memory Configuration | [DATA_NEEDED: cache, SRAM, and ROM configuration] | — |
| External Memory Interfaces | [DATA_NEEDED: supported external memory interfaces] | — |
| Ethernet Capability | [DATA_NEEDED: Ethernet controller configuration] | — |
| Serial Interface Configuration | [DATA_NEEDED: UART, SPI, I2C, and CAN interface details] | — |
| Series | — | PowerQUICC, MPC8xx |
| Core Architecture | — | Power Architecture, 32-bit |
| Разрядность шины данных | — | 32 bit |
| Core Clock Speed | — | 66 MHz |
| Package Type | — | PBGA (Plastic Ball Grid Array) |
| Package Pin Count | — | 357 |
| Package Size | — | 25 x 25 mm |
| Moisture Sensitivity Level | — | MSL 3 |
| Рабочая температура | — | -40C to +100C |
| Terminal Form | — | Ball |
| Package Code | — | BGA |
| Package Shape | — | Square |
| Lead-Free | — | [DATA_NEEDED: lead-free status] |