MPC885VR66 vs MPC885CZP66 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng MPC885VR66 sa pamamagitan ng NXP Semiconductors at MPC885CZP66 sa pamamagitan ng NXP Semiconductors. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
NXP Semiconductors
MPC885VR66 - 66MHz 32-Bit PowerQUICC MPU | NXP Semiconductors
MPC885VR66 ✗ Tapus ng Buhay
Pagsanggunian na paghahambing
| Parametro | MPC885VR66 | MPC885CZP66 |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Kategorya | Microcontrollers | Microcontrollers |
| Katayuan ng Lifecycle | Tapus ng Buhay | NRND |
| Manufacturer | NXP Semiconductors | NXP Semiconductors |
| Product Type | PowerQUICC Communications Processor | — |
| Processor Architecture | 32-Bit Power Architecture | — |
| Core Count | 1 core | 1 |
| Maksimum na Taktiko ng Oras | 66 MHz | — |
| Advertised Performance | 87 MIPS | — |
| Volte ng Pagbibigay | 3.3 V | 3.3 V (typical) |
| Process Technology | 0.18 um | 0.18 micrometer CMOS |
| Packhaging | 357-PBGA (25 x 25 mm) | — |
| Package Family | 357-BBGA | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Packaging | Tray | — |
| Hanay ng Temperature na Operasyon | 0°C to 95°C | — |
| Katayuan ng Lifecycle | End of Life | — |
| Lead-Free Status | Lead Free | — |
| Tindminan RoHS | RoHS Compliant | [DATA_NEEDED: RoHS compliance status] |
| REACH Status | [DATA_NEEDED: REACH compliance status] | — |
| AEC-Q100 Qualification | [DATA_NEEDED: AEC-Q100 qualification status] | — |
| Internal Memory Configuration | [DATA_NEEDED: cache, SRAM, and ROM configuration] | — |
| External Memory Interfaces | [DATA_NEEDED: supported external memory interfaces] | — |
| Ethernet Capability | [DATA_NEEDED: Ethernet controller configuration] | — |
| Serial Interface Configuration | [DATA_NEEDED: UART, SPI, I2C, and CAN interface details] | — |
| Series | — | PowerQUICC, MPC8xx |
| Core Architecture | — | Power Architecture, 32-bit |
| Width ng Data Bus | — | 32 bit |
| Core Clock Speed | — | 66 MHz |
| Package Type | — | PBGA (Plastic Ball Grid Array) |
| Package Pin Count | — | 357 |
| Package Size | — | 25 x 25 mm |
| Moisture Sensitivity Level | — | MSL 3 |
| Temperature na Operasyon | — | -40C to +100C |
| Terminal Form | — | Ball |
| Package Code | — | BGA |
| Package Shape | — | Square |
| Lead-Free | — | [DATA_NEEDED: lead-free status] |