SC755BPX350LE vs MPC755BPX350LE Comparison

Detailed side-by-side comparison of SC755BPX350LE by NXP Semiconductors and MPC755BPX350LE by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

NXP Semiconductors
MPC755BPX350LE MPC755BPX350LE - PowerPC 350MHz MPU, 360-FCPBGA | NXP

MPC755BPX350LE - PowerPC 350MHz MPU, 360-FCPBGA | NXP

MPC755BPX350LE Nrnd

Specification Comparison

Parameter SC755BPX350LE MPC755BPX350LE
Brand NXP Semiconductors NXP Semiconductors
Category Microcontrollers Microcontrollers
Lifecycle Status NRND NRND
Stock Status In Stock In Stock
Unit Price (USD) $65.85 $49.90
Architecture Power Architecture (PowerPC) 32-bit RISC RISC, PowerPC MPC7xx
Core Frequency 350 MHz —
Bus Frequency 360 MHz —
Instruction Set Power Architecture 32-bit —
L1 Cache [DATA_NEEDED: L1 instruction/data split and size] —
Bus Interface 60x/MPX bus —
MMU Yes - hardware memory management —
Endianness Big- and little-endian support —
Floating Point Unit [DATA_NEEDED: FPU presence/configuration] —
Multiprocessing Hardware-assisted SMP support —
Package BGA (high-density, surface-mount) 360-FCPBGA (25x25 mm, 1.27 mm pitch)
Mounting Type Surface Mount —
Operating Temperature [DATA_NEEDED: industrial/extended grade] —
RoHS Status [DATA_NEEDED] [DATA_NEEDED: RoHS compliance]
Process Technology CMOS (process node not publicly disclosed) 0.22 micrometer CMOS
Product Type — Microprocessor (MPU)
Core Count — 1
Data Bus Width — 64-Bit
Clock Speed (Core) — 350 MHz
Supply Voltage (Core) — 2 V
I/O Supply Voltage — 3.3 V
Terminal Form — Ball
Number of Terminals — 360
L1 Instruction Cache — 32 KB
L1 Data Cache — 32 KB
Moisture Sensitivity Level (MSL) — 3
Package Type — FCBGA-360, Plastic, 25x25 mm, 2.77 mm height

Datasheets & Resources

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