SC755BPX350LE vs MPC755BPX350LE 对比
详细并排对比 SC755BPX350LE 出自 NXP Semiconductors 和 MPC755BPX350LE 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
NXP Semiconductors
SC755BPX350LE - Power Architecture RISC Microprocessor | NXP | 360MHz
SC755BPX350LE Nrnd
规格对比
| 参数 | SC755BPX350LE | MPC755BPX350LE |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 分类 | Microcontrollers | Microcontrollers |
| 生命周期状态 | 不推荐新设计 | 不推荐新设计 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $65.85 | $49.90 |
| Architecture | Power Architecture (PowerPC) 32-bit RISC | RISC, PowerPC MPC7xx |
| Core Frequency | 350 MHz | — |
| Bus Frequency | 360 MHz | — |
| Instruction Set | Power Architecture 32-bit | — |
| L1 Cache | [DATA_NEEDED: L1 instruction/data split and size] | — |
| Bus Interface | 60x/MPX bus | — |
| MMU | Yes - hardware memory management | — |
| Endianness | Big- and little-endian support | — |
| Floating Point Unit | [DATA_NEEDED: FPU presence/configuration] | — |
| Multiprocessing | Hardware-assisted SMP support | — |
| 封装 | BGA (high-density, surface-mount) | 360-FCPBGA (25x25 mm, 1.27 mm pitch) |
| 安装类型 | Surface Mount | — |
| 工作温度 | [DATA_NEEDED: industrial/extended grade] | — |
| RoHS 状态 | [DATA_NEEDED] | [DATA_NEEDED: RoHS compliance] |
| Process Technology | CMOS (process node not publicly disclosed) | 0.22 micrometer CMOS |
| Product Type | — | Microprocessor (MPU) |
| Core Count | — | 1 |
| 数据总线宽度 | — | 64-Bit |
| Clock Speed (Core) | — | 350 MHz |
| Supply Voltage (Core) | — | 2 V |
| I/O Supply Voltage | — | 3.3 V |
| Terminal Form | — | Ball |
| Number of Terminals | — | 360 |
| L1 Instruction Cache | — | 32 KB |
| L1 Data Cache | — | 32 KB |
| 湿敏等级（MSL） | — | 3 |
| Package Type | — | FCBGA-360, Plastic, 25x25 mm, 2.77 mm height |