SC755BPX350LE vs MPC755BPX350LE Vergleich

Detaillierter Direktvergleich von SC755BPX350LE von NXP Semiconductors und MPC755BPX350LE von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

NXP Semiconductors
MPC755BPX350LE MPC755BPX350LE - PowerPC 350MHz MPU, 360-FCPBGA | NXP

MPC755BPX350LE - PowerPC 350MHz MPU, 360-FCPBGA | NXP

MPC755BPX350LE Nrnd

Spezifikationsvergleich

Parameter SC755BPX350LE MPC755BPX350LE
Marke NXP Semiconductors NXP Semiconductors
Kategorie Microcontrollers Microcontrollers
Lebenszyklusstatus NRND NRND
Lagerstatus In Stock In Stock
Stückpreis (USD) $65,85 $49,90
Architecture Power Architecture (PowerPC) 32-bit RISC RISC, PowerPC MPC7xx
Core Frequency 350 MHz —
Bus Frequency 360 MHz —
Instruction Set Power Architecture 32-bit —
L1 Cache [DATA_NEEDED: L1 instruction/data split and size] —
Bus Interface 60x/MPX bus —
MMU Yes - hardware memory management —
Endianness Big- and little-endian support —
Floating Point Unit [DATA_NEEDED: FPU presence/configuration] —
Multiprocessing Hardware-assisted SMP support —
Gehäuse BGA (high-density, surface-mount) 360-FCPBGA (25x25 mm, 1.27 mm pitch)
Montageart Surface Mount —
Betriebstemperatur [DATA_NEEDED: industrial/extended grade] —
RoHS-Status [DATA_NEEDED] [DATA_NEEDED: RoHS compliance]
Process Technology CMOS (process node not publicly disclosed) 0.22 micrometer CMOS
Product Type — Microprocessor (MPU)
Core Count — 1
Datenbusbreite — 64-Bit
Clock Speed (Core) — 350 MHz
Supply Voltage (Core) — 2 V
I/O Supply Voltage — 3.3 V
Terminal Form — Ball
Number of Terminals — 360
L1 Instruction Cache — 32 KB
L1 Data Cache — 32 KB
Feuchtigkeitsempfindlichkeitsgrad (MSL) — 3
Package Type — FCBGA-360, Plastic, 25x25 mm, 2.77 mm height

Datenblätter & Ressourcen

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