10AS048E1F29I1HG - Arria 10 SX SoC FPGA, 480K LE, 1.5GHz | Intel
Teilenummer: 10AS048E1F29I1HG ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $2850 | $2.850,00 |
| 10 | $2620 | $26.200,00 |
| 100 | $2380 | $238.000,00 |
| 500 | $2150 | $1.075.000,00 |
| 1.000 | $1920 | $1.920.000,00 |
10AS048E1F29I1HG Übersicht
An SoC FPGA is a heterogeneous computing device that tightly couples a general-purpose processor subsystem (typically ARM Cortex-A cores) with programmable FPGA fabric on a single die, enabling deterministic, low-latency hardware acceleration alongside software programmability. Within the broader taxonomy, this places the part in: SoC FPGA -> FPGA with embedded HPS -> programmable logic device -> integrated circuit -> semiconductor.
Key features include dual ARM Cortex-A9 MPCore up to 1.5 GHz with CoreSight, 480K logic elements, embedded HPS peripherals (EMAC, USB, NAND, SD/MMC, I2C, SPI, UART), high-speed transceivers supporting multi-protocol serial interfaces up to 12.5 Gbps (GX), hardware DSP blocks for fixed- and floating-point signal processing, partial reconfiguration, and secure configuration via AES-256. The Arria 10 architecture combines a high-performance fabric with low-power 20 nm process technology.
The Arria 10 architecture employs a logic element structure built on adaptive logic modules (ALMs) with eight inputs each, eight 18x19 variable-precision multipliers per DSP block, and a hierarchical interconnect optimized for high-utilization designs. The hard processor system (HPS) connects to the FPGA fabric via AXI bridges that deliver up to 125 Gbps aggregate bandwidth, eliminating the throughput bottleneck typical of two-chip solutions.
Typical applications include high-performance digital signal processing for wireless baseband (LTE, 5G NR), high-end video processing and broadcast equipment, radar and electronic warfare front-end processing, industrial motor control with deterministic latency, and aerospace telemetry. The dual ARM cores handle protocol stacks and control planes while the FPGA fabric accelerates datapath algorithms.
Design consideration: at 1.5 GHz the HPS can dissipate several watts; deploy a multi-layer PCB with continuous ground planes, thermal vias under the FCBGA, and consider heat-spreader attach for thermally-constrained enclosures. Use the Quartus Prime Arria 10 device family library and the SoC EDS toolkit to integrate the HPS boot flow.
This page synthesizes distributor availability data, parametric alternatives within the same package, and practical thermal and PCB design guidance not aggregated in a single place on Intel's datasheet portal.
Drop-in-Alternativen für 10AS048E1F29I1HG – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit 10AS048E1F29I1HG (gleiche Bauform und Footprint) – abweichend in Package, Speed Grade, Logic Elements, Process Technology, RoHS Status.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
10AS032E4F29I3SG
✅ Drop-In✓ Auf Lager
$2250 / Stück
Datenblatt ansehen →10AS032E4F29I3LG
✅ Drop-In✓ Auf Lager
$1920 / Stück
Datenblatt ansehen →10AS032E4F29E3SG
✅ Drop-In✓ Auf Lager
$1920 / Stück
Datenblatt ansehen →10AS032E4F29E3LG
✅ Drop-In✓ Auf Lager
$2295 / Stück
Datenblatt ansehen →10AS032E4F27I3SG
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$1465 / Stück
Datenblatt ansehen →10AS032E4F27I3LG
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$1085.1 / Stück
Datenblatt ansehen →10AS048E1F29I1HG Grenzwerte & elektrische Eigenschaften
| Family | Arria 10 SX SoC FPGA |
| Logic Elements | 480,000 |
| Hard Processor System | Dual ARM Cortex-A9 MPCore with CoreSight |
| HPS Clock Frequency | Up to 1.5 GHz |
| Process Node | 20 nm |
| Gehäuse | 780-ball FCBGA, 29x29 mm |
| Betriebstemperatur | -40C to +100C (Industrial) |
| Montageart | Surface Mount (Flip-Chip BGA) |
| Number of Terminals | 780 |
| Terminal Form | Ball |
| Package Code | BGA |
| Package Shape | Square |
| RoHS-Status | Compliant |
10AS048E1F29I1HG square Pinbelegungsleitfaden
Pinbelegung für 10AS048E1F29I1HG (square-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für 10AS048E1F29I1HG.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
10AS048E1F29I1HG ist geeignet für 8 Anwendungs: Wireless Baseband / 5G NR PHY Acceleration, High-End Video Processing and Broadcast, Radar and Electronic Warfare Front-End, Industrial Motor Control and Drive, Medical Imaging (Ultrasound / CT Reconstruction), Aerospace Telemetry and Avionics, High-Performance Computing / Datacenter Acceleration, Test & Measurement Instrumentation.
Wireless Baseband / 5G NR PHY Acceleration
The 10AS048E1F29I1HG's 480K logic elements and integrated DSP blocks make it well suited for 4G LTE and 5G NR baseband digital front-end processing. Multi-Gbps CPRI/eCPRI links to remote radio heads run through the Arria 10 transceivers while the fabric accelerates FFT/CRS/channel-estimation datapaths, and the dual 1.5 GHz ARM Cortex-A9 HPS handles the MAC scheduler. Compared with discrete FPGA-plus-asset implementations, the integrated HPS eliminates an inter-chip interface and reduces PCB complexity. Placed at the heart of a DU (distributed unit), it deterministically processes PHY-layer channels at line rate.
Empfohlen
High-End Video Processing and Broadcast
With 480K LE and high-speed transceivers, the 10AS048E1F29I1HG serves broadcast studio equipment (12G-SDI/quad-link 3G-SDI routers, UHD video encoders, contribution encoders) and professional video walls. The HPS cores run a Linux control plane for IP-based broadcast glue (SMPTE 2022, SMPTE 2110), while the FPGA fabric processes uncompressed 4K/8K pixel streams with sub-frame latency. Power dissipation of the 20 nm Arria 10 at full load is lower than older 28 nm FPGAs, simplifying cooling in broadcast racks. Designers should pair it with external HDMI 2.0/2.1 PHYs and DP 1.4 retimers for consumer-side interfaces.
Empfohlen
Radar and Electronic Warfare Front-End
The 10AS048E1F29I1HG's combination of hardware DSP blocks, high-speed transceivers, and the dual 1.5 GHz ARM HPS supports phased-array radar front-end digital beamforming and electronic-warfare channelized receivers. The FPGA fabric performs beamforming weights, FFT, pulse compression, and Doppler filtering at the line rate required by modern AESA radars. The HPS controls mode scheduling, calibration, and external Ethernet-based data forwarding. Industrial temperature grade allows deployment on outdoor radar masts and tactical EW platforms.
Empfohlen
Industrial Motor Control and Drive
The Arria 10 SX SoC FPGA delivers deterministic sub-microsecond control loop latency for high-precision servo drives and multi-axis CNC controllers. The 480K LE fabric hosts multi-axis field-oriented control (FOC) algorithms running at 100 kHz+ switching frequency, while the HPS runs the motion controller and EtherCAT/CIP-Safety stack. Industrial temperature grade and 20 nm process efficiency make the device viable for the fan-less cabinet enclosures typical of modern servo amplifiers.
Empfohlen
Medical Imaging (Ultrasound / CT Reconstruction)
Ultrasound beamforming, CT filtered-back-projection, and MRI gradient control benefit from the 10AS048E1F29I1HG's 480K LE fabric and DSP blocks. Per-channel beamformers running on hundreds of FPGA DSP slices achieve deterministic per-beam latency, while the dual Cortex-A9 cores perform patient I/O, control plane, and image post-processing. Industrial temperature grade supports integration into medical cart and rack-mount systems. Designers should validate IEC 60601-1 patient-safety isolation requirements externally; the SoC FPGA itself does not provide isolation.
Empfohlen
Aerospace Telemetry and Avionics
The Arria 10 SX SoC FPGA is suitable for flight-test telemetry aggregation, MIL-STD-1553/ARINC 429 protocol bridging, and UAV command-and-control payloads. Industrial temperature grade tolerates cockpit thermal envelopes when paired with appropriate cold-plate mounting. The HPS runs an RTOS for telemetry packaging while the FPGA fabric handles sensor pre-processing, encryption acceleration, and high-speed serial links to ground stations. Note that fully-qualified MIL-PRF variants would require additional screening beyond the standard industrial part.
Empfohlen
High-Performance Computing / Datacenter Acceleration
Although Arria 10 SX is mid-range, the 10AS048E1F29I1HG is deployed in edge-computing and datacenter acceleration cards where the HPS handles PCIe endpoint management and the fabric accelerates compression, cryptography, or packet processing at line rate. The integrated HPS removes an external BMC or co-processor on SmartNIC reference designs. For higher-throughput acceleration, designers typically move to Stratix 10 or Agilex 7 FPGAs, but the Arria 10 SX remains attractive for cost-sensitive edge nodes.
Empfohlen
Test & Measurement Instrumentation
PXI-based protocol analyzers, high-speed serial protocol testers, and oscilloscope DSP engines leverage the 10AS048E1F29I1HG's transceiver and DSP resources. The HPS manages the host-side API, while the FPGA fabric implements real-time eye-diagram analysis, BER counters, and protocol-aware triggers. Compared with discrete-FPGA implementations, the SoC form factor reduces BOM count and simplifies USB-C/PCIe host connectivity on modular instruments.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für 10AS048E1F29I1HG – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | 10AS032E4F29I3SG | 10AS032E4F29I3LG | 10AS032E4F29E3SG | 10AS032E4F29E3LG | 10AS032E4F27I3SG |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 780-FCBGA 29x29 mm (F29) | 780-FCBGA 29x29 mm (F29) - same | 780-FCBGA 29x29 mm (F29) - same | 780-FCBGA 29x29 mm (F29) - same | 780-FCBGA 29x29 mm (F29) - same | 780-FCBGA 27x27 mm (F27) |
| Logic Elements | 480,000 | 320,000 | 320,000 | 320,000 | 320,000 | 320,000 |
| Hard Processor System | Dual ARM Cortex-A9 up to 1.5 GHz | Dual ARM Cortex-A9 up to 1.5 GHz | Dual ARM Cortex-A9 up to 1.5 GHz | Dual ARM Cortex-A9 up to 1.5 GHz | Dual ARM Cortex-A9 up to 1.5 GHz | Dual ARM Cortex-A9 up to 1.5 GHz |
| Temperature Grade | Industrial (-40C to +100C) | Industrial | Industrial | Extended | Extended | Industrial |
| Process Node | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm |
| Family | Arria 10 SX SoC | Arria 10 SX SoC | Arria 10 SX SoC | Arria 10 SX SoC | Arria 10 SX SoC | Arria 10 SX SoC |
| AEC-Q100 Automotive Grade | No (industrial) | No | No | No | No | No |
Wichtigste Unterscheidungsmerkmale
- Highest-density Arria 10 SX variant in the 780-ball F29 footprint (vs. 10AS032E4F29I3SG)
- Industrial temperature grade in same pinout (vs. 10AS032E4F29E3SG)
- H-speed grade vs L-speed grade (vs. 10AS032E4F29I3LG)
- 29x29 mm FCBGA package (vs. 10AS032E4F27I3SG)
Designhinweise
Estimated: at full HPS + fabric utilization, the Arria 10 SX dissipates 12-18 W. With a 780-ball FCBGA, the package junction-to-ambient thermal resistance is ~15 C/W without heat-spreader attachment. Designers must include a heat spreader (copper or graphite) and thermal vias (0.3 mm pitch, 12-16 per cm^2) under the BGA. A 4-layer PCB with continuous ground planes is mandatory; a 6-layer stack-up is preferred for thermal spreading on SoC FPGA designs.
Use a microvia stack-up (laser-drilled microvias to top/bottom layers, 0.2 mm pitch BGA fan-out) to break out the 1.0 mm pitch FCBGA. Match trace impedance for HPS DDR3/DDR4 interfaces (50 ohm single-ended, 100 ohm differential) and transceiver channels (100 ohm differential). Provide independent decoupling: 100 nF X7R per power pin pair, 4.7 uF bulk per rail. Follow Intel's Arria 10 SoC FPGA design guidelines for transceiver channel routing and length matching within 0.127 mm for HPS DDR4 byte lanes.
Estimated: power-supply sequencing follows Intel's Arria 10 SoC power-up order (VCC, VCCPT, VCCPGM, VCCP_HPS, VCC_HPS, then transceiver rails). Use a multi-rail PMIC with sequence control - Linear Technology (ADI) LTC2977 or Renesas ISL68127 are common reference designs. Tolerance on HPS core voltage is +/- 2.5%; VCC is +/- 3%. Decouple each rail with both bulk tantalum/polymer and ceramic X7R MLCCs.
Do not omit the configuration flash - the Arria 10 SX requires external QSPI or parallel flash for FPGA and HPS boot. Common pitfalls: missing JTAG pull-ups (10 kohm to VCCIO), missing HPS reset supervisor (TPS3808 or equivalent), and using wrong speed grade tools in Quartus Prime. Confirm the HPS boot flow (QSPI->NAND->eMMC->SD) is configured for your boot device. Note: cross-tool flow requires Quartus Prime 18.1 or later for SoC EDS HPS integration.
For HPS DDR4/LPDDR4 interfaces, place the SoC FPGA within 50 mm of the DRAM and use fly-by routing with series-termination resistors (33 ohm) at the controller. For transceiver channels operating at 12.5 Gbps, maintain a continuous reference plane under each lane and use a 4-layer PCB minimum with stripline routing for backplane applications. AC-coupling capacitors (100 nF) are required at the transmitter side per Intel's reference design; pre-emphasis and equalization are configured via the Arria 10 transceiver toolkit.
Compliance-Informationen
RoHS compliant per Intel product compliance. Not AEC-Q100 qualified - industrial temperature grade only. Lead-free FCBGA per Intel datasheet. No halogen/PFAS disclosures required for this product family per Intel's documentation.
