EP3C55F484C8 vs EP3C55F484C6 Vergleich
Detaillierter Direktvergleich von EP3C55F484C8 von Intel und EP3C55F484C6 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3C55F484C8 | EP3C55F484C6 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $138,40 | $222,00 |
| Device Family | Cyclone® III | — |
| Logic Elements (LEs) | 55,856 | — |
| Logic Array Blocks (LABs) | 3,491 | — |
| Embedded Memory Bits | 2,396,160 bits | — |
| Embedded 18x18 Multipliers | 312 | 56 |
| User I/Os | 327 | — |
| PLLs | 4 | — |
| Global Clock Networks | 20 | 20 |
| Maximum Core Frequency | 472.5 MHz | — |
| Process Technology | 65 nm low-power CMOS | 65 nm low-power CMOS |
| Gehäuse | 484-ball FBGA (FBGA-484), 23 x 23 mm, 1.0 mm pitch, 2.60 mm height | 484-FBGA (F484) |
| Speed Grade | C8 (commercial, -8) | 6 (commercial) |
| Betriebstemperatur | Commercial (0C to +85C) | 0C to +85C (commercial) |
| Configuration Modes | JTAG, Active Serial (AS), Active Parallel (AP), Passive Serial (PS) | — |
| Lead-Free / RoHS | Yes (Pb-free FBGA) | — |
| Versorgungsspannung | Core 1.2 V typical, I/O bank dependent | — |
| I/O Standards Supported | LVCMOS, LVTTL, LVDS, SSTL, HSTL, PCI, and others | — |
| Family | — | Cyclone III |
| Series | — | EP3C55 |
| Logic Elements | — | 55,856 LE |
| Embedded Memory | — | 2,396,160 bits (2.4 Mbit) |
| Maximum User I/O | — | 327 |
| Core Voltage | — | 1.2 V |
| Number of PLLs | — | 4 |
| I/O Banks | — | 8 |
| Supported I/O Standards | — | LVDS, LVTTL, LVCMOS, SSTL, HSTL |
| Configuration | — | JTAG, AS (EPCS), PS, FPP |
| Montageart | — | Surface Mount (BGA) |
| RoHS-Status | — | Compliant |