EP3C55F484C8 vs EP3C55F484C6 Perbandingan
Perbandingan bersamaan detil EP3C55F484C8 dari Intel dan EP3C55F484C6 dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP3C55F484C8 | EP3C55F484C6 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Device Family | Cyclone® III | — |
| Logic Elements (LEs) | 55,856 | — |
| Logic Array Blocks (LABs) | 3,491 | — |
| Embedded Memory Bits | 2,396,160 bits | — |
| Embedded 18x18 Multipliers | 312 | 56 |
| User I/Os | 327 | — |
| PLLs | 4 | — |
| Global Clock Networks | 20 | 20 |
| Maximum Core Frequency | 472.5 MHz | — |
| Process Technology | 65 nm low-power CMOS | 65 nm low-power CMOS |
| Paket | 484-ball FBGA (FBGA-484), 23 x 23 mm, 1.0 mm pitch, 2.60 mm height | 484-FBGA (F484) |
| Speed Grade | C8 (commercial, -8) | 6 (commercial) |
| Suhu Kerja | Commercial (0C to +85C) | 0C to +85C (commercial) |
| Configuration Modes | JTAG, Active Serial (AS), Active Parallel (AP), Passive Serial (PS) | — |
| Lead-Free / RoHS | Yes (Pb-free FBGA) | — |
| Tegangan Pemuat | Core 1.2 V typical, I/O bank dependent | — |
| I/O Standards Supported | LVCMOS, LVTTL, LVDS, SSTL, HSTL, PCI, and others | — |
| Family | — | Cyclone III |
| Series | — | EP3C55 |
| Logic Elements | — | 55,856 LE |
| Embedded Memory | — | 2,396,160 bits (2.4 Mbit) |
| Maximum User I/O | — | 327 |
| Core Voltage | — | 1.2 V |
| Number of PLLs | — | 4 |
| I/O Banks | — | 8 |
| Supported I/O Standards | — | LVDS, LVTTL, LVCMOS, SSTL, HSTL |
| Configuration | — | JTAG, AS (EPCS), PS, FPP |
| Tipe Mounting | — | Surface Mount (BGA) |
| Status RoHS | — | Compliant |