EP3C55F484C8 vs EP3C55F484C6 Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP3C55F484C8 sa pamamagitan ng Intel at EP3C55F484C6 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP3C55F484C8 EP3C55F484C6
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Aktibo Aktibo
Device Family Cyclone® III —
Logic Elements (LEs) 55,856 —
Logic Array Blocks (LABs) 3,491 —
Embedded Memory Bits 2,396,160 bits —
Embedded 18x18 Multipliers 312 56
User I/Os 327 —
PLLs 4 —
Global Clock Networks 20 20
Maximum Core Frequency 472.5 MHz —
Process Technology 65 nm low-power CMOS 65 nm low-power CMOS
Packhaging 484-ball FBGA (FBGA-484), 23 x 23 mm, 1.0 mm pitch, 2.60 mm height 484-FBGA (F484)
Speed Grade C8 (commercial, -8) 6 (commercial)
Temperature na Operasyon Commercial (0C to +85C) 0C to +85C (commercial)
Configuration Modes JTAG, Active Serial (AS), Active Parallel (AP), Passive Serial (PS) —
Lead-Free / RoHS Yes (Pb-free FBGA) —
Volte ng Pagbibigay Core 1.2 V typical, I/O bank dependent —
I/O Standards Supported LVCMOS, LVTTL, LVDS, SSTL, HSTL, PCI, and others —
Family — Cyclone III
Series — EP3C55
Logic Elements — 55,856 LE
Embedded Memory — 2,396,160 bits (2.4 Mbit)
Maximum User I/O — 327
Core Voltage — 1.2 V
Number of PLLs — 4
I/O Banks — 8
Supported I/O Standards — LVDS, LVTTL, LVCMOS, SSTL, HSTL
Configuration — JTAG, AS (EPCS), PS, FPP
Uri ng Pagpapasok — Surface Mount (BGA)
Tindminan RoHS — Compliant

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