EP3C55F484C8 vs EP3C55F484C6 Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3C55F484C8 disebabkan oleh Intel dan EP3C55F484C6 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Pengandingan Spesifikasi

Parametr EP3C55F484C8 EP3C55F484C6
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Aktif Aktif
Device Family Cyclone® III —
Logic Elements (LEs) 55,856 —
Logic Array Blocks (LABs) 3,491 —
Embedded Memory Bits 2,396,160 bits —
Embedded 18x18 Multipliers 312 56
User I/Os 327 —
PLLs 4 —
Global Clock Networks 20 20
Maximum Core Frequency 472.5 MHz —
Process Technology 65 nm low-power CMOS 65 nm low-power CMOS
Kemasan 484-ball FBGA (FBGA-484), 23 x 23 mm, 1.0 mm pitch, 2.60 mm height 484-FBGA (F484)
Speed Grade C8 (commercial, -8) 6 (commercial)
Suhu Operasi Commercial (0C to +85C) 0C to +85C (commercial)
Configuration Modes JTAG, Active Serial (AS), Active Parallel (AP), Passive Serial (PS) —
Lead-Free / RoHS Yes (Pb-free FBGA) —
Tegangan Pemberi Arus Core 1.2 V typical, I/O bank dependent —
I/O Standards Supported LVCMOS, LVTTL, LVDS, SSTL, HSTL, PCI, and others —
Family — Cyclone III
Series — EP3C55
Logic Elements — 55,856 LE
Embedded Memory — 2,396,160 bits (2.4 Mbit)
Maximum User I/O — 327
Core Voltage — 1.2 V
Number of PLLs — 4
I/O Banks — 8
Supported I/O Standards — LVDS, LVTTL, LVCMOS, SSTL, HSTL
Configuration — JTAG, AS (EPCS), PS, FPP
Jenis Pemasangan — Surface Mount (BGA)
Status RoHS — Compliant

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