H5ANAG6NCR-VKC vs H5ANAG6NAMR-UHC Vergleich
Detaillierter Direktvergleich von H5ANAG6NCR-VKC von SK hynix und H5ANAG6NAMR-UHC von SK hynix. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | H5ANAG6NCR-VKC | H5ANAG6NAMR-UHC |
|---|---|---|
| Marke | SK hynix | SK hynix |
| Kategorie | Memory ICs | Memory ICs |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $0,00 | $4,50 |
| Speichertyp | DDR4 SDRAM | DDR4 SDRAM |
| Memory Density | 16 Gbit | 16 Gbit (2 GB) |
| Speicherorganisation | 2G x 8 | 1G x 16 |
| Schnittstelle | DDR4 (Double Data Rate 4) | — |
| Supply Voltage VDD | 1.2 V | — |
| Supply Voltage VDDQ | 1.2 V | — |
| Datenrate | [DATA_NEEDED: verified speed grade in Mbps] | — |
| Gehäuse | 96-ball FBGA | FBGA-96 (PBGA96) |
| Montageart | Surface Mount | Surface Mount (BGA solder ball) |
| Banks | 16 banks (4 bank groups x 4) | — |
| Burst Length | BL8 | — |
| Refresh Mode | 1x / 2x / 4X per JEDEC DDR4 | — |
| Betriebstemperatur | [DATA_NEEDED: temperature suffix range confirmation] | [DATA_NEEDED: operating temperature range] |
| Technology | CMOS | — |
| Application | Main memory (PC / server / embedded) | — |
| RoHS-Status | [DATA_NEEDED: RoHS compliance statement] | [DATA_NEEDED: RoHS status] |
| Speed Grade / Data Rate | — | DDR4-2400 (UHC bin, PC4-19200) |
| Supply Voltage (VDD) | — | 1.2 V |
| Architecture | — | CMOS DDR4 with bank groups |
| Power Class | — | Normal Power |
| Refresh | — | Self-refresh and auto-refresh (DDR4 standard 64 ms) |
| CAS-Latenz | — | [DATA_NEEDED: CL for UHC bin] |
| Schnittstellentyp | — | Parallel, synchronous, double data rate |
| Available Speed Bins (family) | — | PB / RD / TF / UH / VK |
| Application Class | — | Main memory, embedded, industrial |
| Lebenszyklusstatus | — | Active production |