H5ANAG6NCR-VKC vs H5ANAG6NAMR-UHC Comparison

Detailed side-by-side comparison of H5ANAG6NCR-VKC by SK hynix and H5ANAG6NAMR-UHC by SK hynix. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter H5ANAG6NCR-VKC H5ANAG6NAMR-UHC
Brand SK hynix SK hynix
Category Memory ICs Memory ICs
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $0.00 $4.50
Memory Type DDR4 SDRAM DDR4 SDRAM
Memory Density 16 Gbit 16 Gbit (2 GB)
Organization 2G x 8 1G x 16
Interface DDR4 (Double Data Rate 4) —
Supply Voltage VDD 1.2 V —
Supply Voltage VDDQ 1.2 V —
Data Rate [DATA_NEEDED: verified speed grade in Mbps] —
Package 96-ball FBGA FBGA-96 (PBGA96)
Mounting Type Surface Mount Surface Mount (BGA solder ball)
Banks 16 banks (4 bank groups x 4) —
Burst Length BL8 —
Refresh Mode 1x / 2x / 4X per JEDEC DDR4 —
Operating Temperature [DATA_NEEDED: temperature suffix range confirmation] [DATA_NEEDED: operating temperature range]
Technology CMOS —
Application Main memory (PC / server / embedded) —
RoHS Status [DATA_NEEDED: RoHS compliance statement] [DATA_NEEDED: RoHS status]
Speed Grade / Data Rate — DDR4-2400 (UHC bin, PC4-19200)
Supply Voltage (VDD) — 1.2 V
Architecture — CMOS DDR4 with bank groups
Power Class — Normal Power
Refresh — Self-refresh and auto-refresh (DDR4 standard 64 ms)
CAS Latency — [DATA_NEEDED: CL for UHC bin]
Interface Type — Parallel, synchronous, double data rate
Available Speed Bins (family) — PB / RD / TF / UH / VK
Application Class — Main memory, embedded, industrial
Lifecycle Status — Active production

Datasheets & Resources

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