K4A8G165WC-BCRC vs H5AN8G8NCJR-PBC Vergleich
Detaillierter Direktvergleich von K4A8G165WC-BCRC von Samsung Electronics und H5AN8G8NCJR-PBC von SK hynix. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | K4A8G165WC-BCRC | H5AN8G8NCJR-PBC |
|---|---|---|
| Marke | Samsung Electronics | SK hynix |
| Kategorie | Memory ICs | Memory ICs |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $23,00 | $2,40 |
| Speichertyp | DDR4 SDRAM | DDR4 SDRAM |
| Density | 8 Gb | — |
| Speicherorganisation | 512M x 16 | 1G x 8 (x8) |
| Datenrate | 2400 Mbps | [DATA_NEEDED: data rate for -PBC speed grade (Mbps/MT/s)] |
| Supply Voltage (VDD) | 1.2 V (1.14V to 1.26V) | 1.2 V |
| VPP Voltage | 2.5 V | — |
| Betriebstemperatur | 0°C to +95°C (case) | [DATA_NEEDED: operating temperature range] |
| Gehäuse | 96-ball FBGA (9mm x 13mm) | 78-ball FBGA |
| Schnittstelle | 16-bit I/O | — |
| Banks | 16 (4 bank groups) | — |
| Burst Length | 8 (BL8) | BL8 |
| CAS-Latenz | Programmable (e.g., 16, 17, 18) | — |
| Refresh | Temperature-compensated self-refresh (TCSR) | Auto-refresh and self-refresh |
| RoHS | Compliant | — |
| Montageart | Surface Mount | Surface Mount |
| Speichergröße | — | 8 Gb (1 GB) |
| Interface Voltage (VDDQ) | — | 1.2 V (SSTL12) |
| Architecture | — | CMOS, fully synchronous, dual-edge clocked |
| Bank Structure | — | 8 internal banks, bank-group architecture |
| Eigenschaften | — | ODT, DM, DQS strobes, programmable CAS latency, self-refresh |
| Die Revision Family | — | CJR (H5AN8G8NCJR-xxC) |
| RoHS-Status | — | Lead-Free & Halogen-Free |
| Typical Applications | — | PC/server main memory, embedded solder-down memory |