MPC5554MVR80 vs MPC5554AZP132 Perbandingan

Perbandingan bersamaan detil MPC5554MVR80 dari NXP Semiconductors dan MPC5554AZP132 dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.

Perbandingan Spesifikasi

Parameter Umum MPC5554MVR80 MPC5554AZP132
Merek NXP Semiconductors NXP Semiconductors
Kategori Microcontrollers Microcontrollers
Status Lingkungan Hidup NRND NRND
Core e200z6 (Power Architecture) —
CPU Architecture 32-bit RISC, 7-stage pipeline —
Maximum CPU Frequency 80 MHz —
Program Flash Memory 2 MB (2M x 8) —
Paket 416-ball PBGA, 27 mm x 27 mm, 1 mm pitch 416-PBGA (TEPBGA-416), 27 x 27 mm
Tipe Mounting Surface Mount Surface Mount (BGA)
Suhu Kerja -40C to +125C (Automotive Grade) —
Tegangan Pemuat 1.8 V / 2.5 V / 3.3 V / 5 V (per datasheet) [DATA_NEEDED: supply voltage range]
Series MPC55xx Qorivva —
RAM Size [DATA_NEEDED: RAM size] [DATA_NEEDED: on-chip SRAM size]
Data Converters [DATA_NEEDED: ADC/DAC channels] —
Number of I/O [DATA_NEEDED: I/O count] —
Connectivity CAN, FlexRay, eMIOS, eTPU —
Status RoHS Lead-Free (MS-034AAL-1 TEPBGA-416) Compliant (lead-free PBGA)
Lifecycle Stage NRND (Not Recommended for New Designs) NRND (Not Recommended for New Designs)
Core Architecture — Power Architecture e200z6
Core Bit Width — 32-bit
Maximum Core Frequency — 132 MHz
Program Memory (Flash) — 2 MB (2M x 8)
Ball Pitch — 1.0 mm
Lead-Free Status — Lead free (per package marking MS-034AAL-1)
Product Family — Qorivva MPC55xx
Peripheral Integration — FlexCAN, eMIOS, eQADC, DSPI (per datasheet reference manual)
Instruction Set — Power Architecture with VLE extension
Rentang Suhu Kerja — [DATA_NEEDED: operating temperature range]

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