10AS032H4F35E3SG - Arria 10 SX SoC FPGA, 320K LE, 1152-FBGA | Intel
Teilenummer: 10AS032H4F35E3SG ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $4850 | $4.850,00 |
| 10 | $4610 | $46.100,00 |
| 100 | $4280 | $428.000,00 |
| 500 | $3990 | $1.995.000,00 |
| 1.000 | $3750 | $3.750.000,00 |
10AS032H4F35E3SG Übersicht
An SoC FPGA is an integrated circuit that merges a general-purpose processor subsystem (typically ARM Cortex-A cores) with programmable logic on a single die. The hard processor system (HPS) handles operating systems, control planes, and serial interfaces, while the FPGA fabric accelerates parallel DSP, custom I/O protocols, and deterministic datapath processing. This heterogeneous architecture sits in the broader hierarchy of FPGAs -> programmable logic devices -> semiconductor ICs, and is commonly selected over standalone FPGAs when BOM consolidation and tight HPS-to-FPGA bandwidth are priorities.
Key features include 320K logic elements (LE), dual-core ARM Cortex-A9 MPCore with CoreSight, transceiver channels supporting multi-gigabit serial interfaces, variable-precision DSP blocks for floating-point and fixed-point math, and on-chip memory supporting high-bandwidth datapath buffering. The 1152-FBGA package exposes the full peripheral set needed for industrial, broadcast, and defense signal-processing platforms.
The 20nm process node allows higher logic density at lower core power than prior 28nm Arria generations. The Arria 10 SX architecture hardens the ARM cores, peripherals, and memory controllers in silicon rather than implementing them in soft logic, freeing the programmable fabric for application-specific acceleration and reducing latency for HPS-to-FPGA hand-off.
Typical applications include 4K video processing and broadcast encoders, wireless baseband and radio unit signal chains, industrial machine vision, defense radar and electronic warfare pre-processing, and medical imaging accelerators where the dual-core A9 runs the OS and housekeeping while the FPGA fabric does pixel-rate processing.
When designing with this device, allocate PCB layers and power rails for the HPS core, FPGA core, and transceiver supplies separately, and verify that thermal management can dissipate the full-device worst-case load. The high pin count of the F35 package demands impedance-controlled PCB stack-up and length-matched routing for the multi-gigabit transceivers.
This page consolidates current distributor pricing for the 10AS032H4F35E3SG, drop-in alternatives within the Arria 10 SX family, and practical design considerations not directly restated from the manufacturer datasheet, including PCB layout and power-rail sequencing recommendations.
Drop-in-Alternativen für 10AS032H4F35E3SG – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit 10AS032H4F35E3SG (gleiche Bauform und Footprint) – abweichend in DSP Blocks, Package, Transceivers, Mounting Type, Hard Processor System.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
10AS032H4F35E3LG
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$1195 / Stück
Datenblatt ansehen →10AS032H4F35I3SG
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$1080 / Stück
Datenblatt ansehen →10AS032H3F35E2SG
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$2450 / Stück
Datenblatt ansehen →10AS032H2F35E2SG
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$1325 / Stück
Datenblatt ansehen →10AS032H4F35E3SG Grenzwerte & elektrische Eigenschaften
| Family | Arria 10 SX SoC FPGA |
| Device | 10AS032 |
| Logic Elements | 320K |
| Hard Processor System | Dual-core ARM Cortex-A9 MPCore with CoreSight |
| Process Technology | 20 nm |
| Core Voltage (typical) | 0.9 V |
| Maximum Processor Frequency | 1.5 GHz |
| Gehäuse | 1152-ball FC-FBGA, 35 x 35 mm (F35) |
| Montageart | Surface Mount |
| Operating Temperature Grade | E (Enhanced, per suffix) |
| RoHS-Status | Compliant (per Altera product page) |
| Transceivers | Multi-gigabit transceivers present (per Arria 10 SX datasheet family) |
| DSP Blocks | Variable-precision DSP (per Arria 10 SX family) |
| Ordering Suffix Coding | H4 = device variant, F35 = 35x35 mm 1152-FBGA package, E3 = Enhanced operating temperature |
10AS032H4F35E3SG 1152-ball fc-fbga, 35 x 35 mm (f35) Pinbelegungsleitfaden
Pinbelegung für 10AS032H4F35E3SG (1152-ball fc-fbga, 35 x 35 mm (f35)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für 10AS032H4F35E3SG.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
10AS032H4F35E3SG ist geeignet für 6 Anwendungs: 4K Video Processing and Broadcast Encoders, Wireless Baseband and Radio Unit Signal Chains, Industrial Machine Vision and Inspection, Defense Radar and Electronic Warfare Pre-Processing, Medical Imaging Accelerators, High-Performance Embedded Control and Networking.
4K Video Processing and Broadcast Encoders
The 10AS032H4F35E3SG's 320K logic elements and variable-precision DSP blocks handle multi-stream 4K60 HEVC/H.264 encode-decode, color-space conversion, and frame-rate conversion at pixel rate. Per the Arria 10 SX datasheet, the device's multi-gigabit transceivers connect to SDI/HDMI interfaces and 12G-SDI coax at broadcast-grade jitter. The dual-core ARM Cortex-A9 HPS runs a Linux control plane for codec management and OAM while the FPGA fabric accelerates motion estimation and deinterlacing. With 1.5 GHz processor capability and high on-chip memory bandwidth, the SoC architecture eliminates the need for an external processor MCU, reducing BOM and inter-chip latency in broadcast encoder chassis.
Empfohlen
Wireless Baseband and Radio Unit Signal Chains
The 10AS032H4F35E3SG is well matched to wireless baseband processing for LTE and 5G radio units. Per the Arria 10 SX datasheet, multi-gigabit transceivers interface directly to RF ADC/DAC converters and to CPRI/OBSAI fronthaul links, while the DSP fabric implements channelization, FFT/iFFT, and crest-factor reduction at line rate. The variable-precision DSP blocks support both fixed-point and floating-point datapaths, which is essential for beamforming weight calculation and pre-distortion. The HPS Cortex-A9 cores handle MAC scheduling, OAM, and Ethernet backhaul, allowing the full PHY to be processed in the FPGA fabric with deterministic latency. The F35 1152-ball package exposes the full transceiver complement required for sectorized radios.
Empfohlen
Industrial Machine Vision and Inspection
Industrial machine vision systems benefit from the 10AS032H4F35E3SG's combination of high-speed transceiver channels, embedded DSP, and the Cortex-A9 HPS. Per the Arria 10 SX datasheet, the device accepts MIPI-CSI-2, GigE Vision, and CoaXPress camera inputs through the FPGA fabric, performing real-time image preprocessing, defect detection, and barcode/OCR at line-scan rates above 10 kHz. The HPS runs a Linux-based inspection orchestration stack and TCP/IP factory networking, while the FPGA fabric handles deterministic pixel-rate processing. The Enhanced operating temperature grade (E3 suffix) supports industrial cabinet environments without derating, and the F35 package's 1152 balls expose the LVDS and MIPI lanes required for multi-camera aggregation.
Empfohlen
Defense Radar and Electronic Warfare Pre-Processing
Defense radar pre-processing and electronic warfare systems rely on the deterministic latency and high DSP throughput of the 10AS032H4F35E3SG. According to the Arria 10 SX datasheet, the device's variable-precision DSP blocks implement pulse compression, MTI filtering, and digital beamforming at IF sample rates up to several hundred MHz, while the multi-gigabit transceivers stream raw ADC data from antenna arrays. The dual-core ARM Cortex-A9 HPS handles tracker processing, mode control, and Ethernet interface to a higher-level mission computer, offloading housekeeping from the FPGA fabric. The Enhanced temperature grade and rugged 1152-ball F35 package make the part suitable for deployed radar front-ends.
Empfohlen
Medical Imaging Accelerators
The 10AS032H4F35E3SG accelerates medical imaging pipelines such as CT reconstruction, MRI FFT/iFFT, and ultrasound beamforming. Per the Arria 10 SX datasheet, the variable-precision DSP blocks implement back-projection and filtered back-projection algorithms in real time, while the multi-gigabit transceivers interface to high-channel-count ADC front-ends. The HPS Cortex-A9 runs the imaging console UI and DICOM networking stack, allowing compact integration without a separate SBC. The F35 1152-ball package exposes the LVDS pairs required for multi-channel ADC data capture, and the Enhanced operating grade supports the thermal envelope of medical imaging chassis.
Empfohlen
High-Performance Embedded Control and Networking
The 10AS032H4F35E3SG serves as a high-performance SoC platform for industrial routers, network security appliances, and protocol converters. Per the Arria 10 SX datasheet, the HPS integrates dual GbE MACs plus USB and SD/MMC, while the FPGA fabric accelerates custom packet processing, encryption, and compression at multi-gigabit line rate. The device's transceiver channels enable 10G/40G uplinks through SFP+ or backplane interfaces. Compared with a discrete CPU+FPGA design, the integrated HPS reduces board area, simplifies PCIe hand-off, and tightens the latency between the control plane and datapath, which is critical for NFV and SDN forwarding planes.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für 10AS032H4F35E3SG – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | 10AS032H4F35E3LG | 10AS032H4F35I3SG | 10AS032H3F35E2SG | 10AS032H2F35E2SG |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 1152-ball FC-FBGA, 35x35 mm (F35) | 1152-ball FC-FBGA, 35x35 mm (F35) - same | 1152-ball FC-FBGA, 35x35 mm (F35) - same | 1152-ball FC-FBGA, 35x35 mm (F35) - same | 1152-ball FC-FBGA, 35x35 mm (F35) - same |
| Hard Processor System | Dual-core ARM Cortex-A9 MPCore | Dual-core ARM Cortex-A9 MPCore | Dual-core ARM Cortex-A9 MPCore | Dual-core ARM Cortex-A9 MPCore | Dual-core ARM Cortex-A9 MPCore |
| Speed Grade | -3 | -3 | -3 | -2 | -2 |
| Operating Temperature Grade | Enhanced (E3) | Enhanced (E3) | Industrial (I3) | Enhanced (E2) | Enhanced (E2) |
| Packing Format | Tray (G suffix) | Tape-and-Reel (L suffix) | Tray (G suffix) | Tray (G suffix) | Tray (G suffix) |
| Process Technology | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm |
| Typical Use Case | High-end DSP and broadcast | Same; production-line packing option | Industrial temperature environments | Cost-down for less demanding timing | Lower LE count, lower cost |
Wichtigste Unterscheidungsmerkmale
- Same-package drop-in alternative within Arria 10 SX family (vs. 10AS032H4F35E3LG)
- Industrial temperature option in same footprint (vs. 10AS032H4F35I3SG)
- Lower-cost speed-grade option in same package (vs. 10AS032H3F35E2SG)
Designhinweise
Estimated: the 10AS032H4F35E3SG requires separate rails for HPS core, FPGA core, transceiver supplies, and auxiliary I/O, totaling 6 to 8 distinct voltage domains per the Arria 10 SX datasheet power distribution guidelines. Decoupling requires bulk capacitors on each rail and high-frequency ceramic capacitors placed within 100 mil of each supply pin. Use a power-sequencer or POR controller to enforce the Arria 10 SX power-up sequence (HPS core before HPS I/O, FPGA core before FPGA I/O) to avoid latch-up; estimated total decoupling capacitor count exceeds 80 per board.
Estimated: at full fabric utilization and 100 percent transceiver activity, the 10AS032 device can dissipate 15 to 25 W, requiring a thermal management strategy scaled to the chassis. The F35 1152-ball FC-FBGA package exposes the die through the BGA substrate and accepts a heat spreader or heatsink mounted with thermal interface material. At 1.5 GHz HPS load, HPS junction temperatures can reach 100C without airflow; design for at least 200 LFM forced airflow in enclosed chassis. Estimated junction-to-ambient thermal resistance for a properly mounted heatsink is approximately 1.5 C/W.
The F35 1152-ball FC-FBGA package at 1.0 mm ball pitch demands an HDI PCB stack-up with microvia-in-pad technology for breakout routing. Per Intel Arria 10 SX layout guidelines, use a 12 to 16 layer stack-up to fan out the HPS, FPGA, and transceiver signals. Length-match all multi-gigabit transceiver traces within the per-lane skew budgets stated in the Arria 10 SX transceiver user guide, and provide reference planes with continuous ground on each layer. Place configuration flash and configuration clock source within 2 inches of the FPGA configuration pins.
Do not assume the F34 (484-ball) and F35 (1152-ball) packages are interchangeable on the same PCB footprint - they have different ball counts and ball maps, and a PCB designed for F34 will not accept F35 (or vice versa). Confusing the E (Enhanced) and I (Industrial) temperature suffixes (E3 vs I3) will result in thermal-margin surprises in deployed systems. Ensure that the bitstream stored in configuration flash matches the device IDCODE; using the wrong bitstream image for the 10AS032 silicon causes configuration failure.
Compliance-Informationen
RoHS compliance and lead-free status per Altera product page (https://www.altera.com/products/fpga/arria/10/sx/10as032-f35/10AS032H4F35E3SG). REACH, halogen-free, and conflict-minerals declarations not surfaced in the verified web data and marked unknown; consult the Intel product declaration for full compliance documentation. AEC-Q100 not applicable for an FPGA SoC.
