10AS032H4F35E3LG - Arria 10 SX SoC FPGA, 320K LE, 1.5GHz, 1152-FBGA | Intel
MPN: 10AS032H4F35E3LG ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1571.83 | $1,571.83 |
| 10 | $1490.5 | $14,905.00 |
| 100 | $1395 | $139,500.00 |
| 500 | $1290 | $645,000.00 |
| 1,000 | $1195 | $1,195,000.00 |
Drop-in alternatives for 10AS032H4F35E3LG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10AS032H4F35I3SG
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$1080 / Unit
View Datasheet →10AS032H4F35E3SG
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$3750 / Unit
View Datasheet →10AS032H4F35I2SG
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
10AS032H4F34E3LG
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$2240 / Unit
View Datasheet →10AS032H3F35E2LG
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$3650 / Unit
View Datasheet →10AS032H3F35I2SG
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$2120 / Unit
View Datasheet →10AS032H4F35E3LG Maximum Ratings & Electrical Characteristics
| Series | Arria 10 SX SoC FPGA |
| Logic Elements | 320,000 |
| Hard Processor System | Dual ARM Cortex-A9 MPCore with CoreSight |
| Processor Clock Speed (Max) | 1.5 GHz |
| Operating Voltage (Core) | 0.87 V (typical per datasheet minimum) |
| Package Type | 1152-ball FCBGA (Flip-Chip BGA) |
| Package Size | 35 x 35 mm |
| Process Technology | 20 nm TSMC |
| Transceiver Speed | Up to 28.05 Gbps |
| Memory Interface | DDR3 / DDR4 with ECC support |
| DSP Blocks | Variable-precision DSP blocks |
| Embedded Memory | MLAB + M20K blocks |
| RoHS Status | Compliant |
| Mounting Type | Surface Mount (BGA) |
10AS032H4F35E3LG 35 x 35 mm Pin Configuration Guide
Complete pinout information for 10AS032H4F35E3LG (35 x 35 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10AS032H4F35E3LG.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10AS032H4F35E3LG is suitable for 7 applications: Industrial Motor Control and Drive Systems, Broadcast Video Processing and Encoding, Military Radar and Electronic Warfare, Medical Imaging Equipment, 5G Wireless Baseband Processing, Test and Measurement Instrumentation, Smart Factory and IIoT Gateways.
Industrial Motor Control and Drive Systems
The 10AS032H4F35E3LG's combination of 320K logic elements and dual ARM Cortex-A9 cores at 1.5 GHz makes it ideal for industrial motor control applications requiring deterministic feedback loops and high-speed PWM generation. The FPGA fabric handles real-time current and voltage loop control with sub-microsecond latency, while the HPS runs Linux-based supervisory control, HMI, and Ethernet protocols such as EtherCAT or PROFINET. Per Arria 10 SX datasheets, the DSP blocks support field-oriented control (FOC) algorithms for permanent magnet synchronous motors, and the 28.05 Gbps transceivers enable multi-axis drive networking. Engineers commonly pair the SoC with external ADCs for current sensing and gate drivers for power stage control.
Recommended
Broadcast Video Processing and Encoding
The 10AS032H4F35E3LG is well-suited for broadcast video infrastructure, including SD/HD/4K video processing, format conversion, and real-time encoding. The 320K logic elements handle parallel pixel processing pipelines for multi-stream video, while the variable-precision DSP blocks accelerate H.264/HEVC codec operations. The dual ARM Cortex-A9 HPS runs embedded Linux with FFmpeg, GStreamer, or vendor SDKs for stream management and metadata processing. Per the Arria 10 SX family datasheet, transceivers support SDI standards up to 12G-SDI, and the DDR4 memory interface provides bandwidth for uncompressed video frame buffers. The F35 35x35 mm package is commonly used in broadcast encoder blades and contribution decoders.
Recommended
Military Radar and Electronic Warfare
Defense systems including radar signal processing and electronic countermeasures benefit from the 10AS032H4F35E3LG's high logic density, transceiver bandwidth, and ARM HPS for sensor fusion. The FPGA fabric performs beamforming, pulse compression, and digital down-conversion across multiple receive channels, while the HPS handles track management, classification algorithms, and Ethernet connectivity to higher-level command systems. Per Arria 10 SX datasheets, transceivers support JESD204B/C interfaces to high-speed ADCs and DACs common in radar front ends. The device's ability to process data in real time with deterministic latency is critical for electronic warfare applications where reaction time determines mission success.
Recommended
Medical Imaging Equipment
Medical imaging modalities including ultrasound, CT, and MRI scanners leverage the 10AS032H4F35E3LG for real-time beamforming, image reconstruction, and high-throughput signal processing. The FPGA fabric accelerates back-end image reconstruction algorithms, while the ARM Cortex-A9 HPS runs embedded Linux for user interface, DICOM networking, and patient database integration. Per the Arria 10 SX family datasheet, the device supports JESD204B interfaces to high-channel-count ADCs typical of ultrasound probes. DDR4 with ECC provides reliable buffering of raw image data, and the F35 package's thermal envelope suits fan-cooled cart-based ultrasound systems.
Recommended
5G Wireless Baseband Processing
5G baseband processing and small-cell infrastructure benefit from the 10AS032H4F35E3LG's parallel processing capability and high-speed transceivers. The FPGA fabric handles PHY-layer operations including channel coding, modulation, and FFT/IFFT for OFDM waveforms, while the ARM HPS runs the 5G stack, MAC scheduler, and management plane. Per the Arria 10 SX family datasheet, transceivers up to 28.05 Gbps support CPRI and eCPRI fronthaul interfaces to radio units. The 320K logic element count enables full PHY-layer implementation of LTE and 5G NR sub-6 GHz waveforms on a single device.
Recommended
Test and Measurement Instrumentation
High-end test and measurement instruments such as oscilloscopes, protocol analyzers, and arbitrary waveform generators leverage the 10AS032H4F35E3LG's processing density and HPS integration. The FPGA fabric performs real-time DSP on sampled waveforms, while the HPS runs the user interface, display rendering, and connectivity layers. Per the Arria 10 SX family datasheet, transceivers support high-speed serial standards for compliance testing interfaces including PCIe Gen3 and USB 3.1. The DDR4 memory subsystem provides deep capture buffering essential for protocol analyzers, and the ARM Cortex-A9 cores enable Linux-based test automation frameworks.
Recommended
Smart Factory and IIoT Gateways
Industrial IoT gateways built around the 10AS032H4F35E3LG combine deterministic protocol handling in the FPGA fabric with edge analytics on the ARM Cortex-A9 HPS. The device supports multiple industrial protocols simultaneously - EtherCAT, PROFINET, Modbus, OPC-UA - via FPGA-implemented MAC layers, while the HPS runs containerized analytics workloads under Linux. Per the Arria 10 SX datasheet, the EMAC and USB peripherals enable direct connectivity to industrial networks without external bridge chips. The 320K logic elements provide headroom for future protocol expansion without device replacement, protecting long-lifecycle industrial deployments.
Recommended
Recommended Products Summary
Engineering reference data for 10AS032H4F35E3LG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10AS032H4F35I3SG | 10AS032H4F35E3SG | 10AS032H4F35I2SG | 10AS032H4F34E3LG | 10AS032H3F35E2LG | 10AS032H3F35I2SG |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1152-FCBGA 35x35 mm (F35) | 1152-FCBGA 35x35 mm (F35) - same | 1152-FCBGA 35x35 mm (F35) - same | 1152-FCBGA 35x35 mm (F35) - same | 1152-FCBGA 34x34 mm (F34) - smaller | 1152-FCBGA 35x35 mm (F35) - same | 1152-FCBGA 35x35 mm (F35) - same |
| Logic Elements | 320,000 | 320,000 | 320,000 | 320,000 | 320,000 | 320,000 | 320,000 |
| Processor | Dual ARM Cortex-A9, 1.5 GHz | Dual ARM Cortex-A9, 1.5 GHz | Dual ARM Cortex-A9, 1.5 GHz | Dual ARM Cortex-A9, 1.5 GHz | Dual ARM Cortex-A9, 1.5 GHz | Dual ARM Cortex-A9, 1.5 GHz | Dual ARM Cortex-A9, 1.5 GHz |
| Temperature Grade | Commercial Extended (E3) | Industrial (I3) | Commercial Extended (E3) | Industrial (I2) | Commercial Extended (E3) | Commercial Extended (E2) | Industrial (I2) |
| Speed Grade | -3 | -3 | -3 | -2 | -3 | -2 | -2 |
| Transceiver Speed | Up to 28.05 Gbps | Up to 28.05 Gbps | Up to 28.05 Gbps | Up to 28.05 Gbps | Up to 28.05 Gbps | Up to 28.05 Gbps | Up to 28.05 Gbps |
| Lead-Free / RoHS | SnPb (L) / Yes | Lead-free (G) / Yes | Lead-free (G) / Yes | Lead-free (G) / Yes | SnPb (L) / Yes | SnPb (L) / Yes | Lead-free (G) / Yes |
Key Differentiators
- Hard ARM Cortex-A9 HPS integrated with 320K logic elements on the same die (vs Non-SoC Arria 10 10AX115N3F40)
- 28.05 Gbps transceiver capability (vs Xilinx Zynq-7045 Z-7045)
- F35 35x35 mm FCBGA package with 1152 balls (vs 10AS032H4F34E3LG (F34 34x34 mm))
Design Notes
The 1152-ball F35 FCBGA at 1.0 mm ball pitch requires microvia or via-in-pad PCB technology for reliable BGA breakout routing. Per Arria 10 SX design guidelines, use a stack-up with HDI (High Density Interconnect) layers and ensure proper thermal via arrays beneath the package center for heat dissipation. Lead-free solder reflow profiles must follow JEDEC J-STD-020 for moisture sensitivity level handling, as 1152-ball BGA devices are highly susceptible to warpage during thermal cycling.
The 10AS032H4F35E3LG requires multiple power rails including 0.87V core, 1.8V auxiliary, and various transceiver and HPS supplies. Per the Arria 10 SX family datasheet, power sequencing must follow the prescribed order to prevent latch-up and device damage. Use the Intel Early Power Estimator (EPE) and PowerPlay Power Analyzer with realistic utilization vectors to obtain design-specific power budgets; typical designs range from 15W to 40W with peak cases exceeding 60W. Decoupling capacitor selection per the reference design schematic is mandatory for power integrity.
The F35 35x35 mm FCBGA package has a junction-to-ambient thermal resistance that requires active cooling in most operating conditions. Per Arria 10 SX thermal documentation, heat spreaders or heatsinks with thermal interface material are mandatory for designs dissipating more than 20W. Estimated: at typical 30W dissipation and 1.0 C/W theta_JA with adequate heatsinking, junction-to-ambient rise is approximately 30C. Always perform thermal simulation with the actual board stack-up and enclosure constraints before committing to a cooling solution.
Common pitfalls in 10AS032H4F35E3LG designs include: (1) failing to configure unused transceiver channels per reference design recommendations, which can cause spurious emissions; (2) ignoring HPS boot mode pin settings, which can leave the device in a non-functional state; (3) underestimating configuration memory size for FPGA bitstreams with HPS firmware images, leading to boot failures; and (4) neglecting DDR4 write leveling and read calibration during board bring-up, causing intermittent memory errors. Reference the Arria 10 SX EMIF Toolkit and the Arria 10 SoC Development Kit user guide for validated bring-up procedures.
Transceiver channels up to 28.05 Gbps require careful PCB routing with controlled impedance (typically 100 ohm differential), length matching within 0.127 mm tolerance for lanes within a group, and continuous reference planes on adjacent layers. Per Intel transceiver layout guidelines, AC coupling capacitors must be placed within 250 mils of the receiver pins. Channel simulation with the Quartus Prime IBIS-AMI models is mandatory for 25 Gbps and higher signaling to validate signal integrity margin before fabrication.
Compliance Information
10AS032H4F35E3LG uses SnPb solder per L suffix per Altera OPN convention; choose G-suffix variants for lead-free compliance. RoHS compliance per Altera product page. Not AEC-Q100 qualified - this device is intended for industrial, commercial, and defense applications, not automotive.
