10AS048K2F35I2SG - Arria 10 SX 480 SoC FPGA, 1152-FCBGA | Intel
MPN: 10AS048K2F35I2SG ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $4250 | $4,250.00 |
| 10 | $4080 | $40,800.00 |
| 100 | $3875 | $387,500.00 |
| 500 | $3650 | $1,825,000.00 |
| 1,000 | $3450 | $3,450,000.00 |
10AS048K2F35I2SG Overview
An SoC FPGA is a single device that pairs a hard CPU subsystem (HPS) with FPGA fabric, allowing deterministic hardware acceleration alongside a familiar processor running Linux or RTOS. In the broader taxonomy this part sits inside: SoC FPGA -> FPGA -> programmable logic -> semiconductor -> integrated circuit. The HPS exposes DDR3/4, USB, PCIe, Ethernet MAC, SD/eMMC and UART peripherals while the fabric accelerates dataplanes via up to 1560 DSP blocks and 24 transceivers.
Key features include 480K logic elements, 28.6 Mbits of embedded memory, 1560 DSP blocks, 24 high-speed transceivers up to 17.4 Gbps, 2 hard memory controllers supporting DDR4 with ECC, and 4 PCIe Gen3 hard IP blocks. The 0.9 V core voltage and industrial temperature grade (-40C to +100C) target ruggedized embedded deployments.
The Arria 10 SX architecture separates the HPS (1.5 GHz ARM Cortex-A9) and the FPGA fabric via a coherent system interconnect with up to 125 Gbps of accelerator coherency bandwidth, enabling low-latency data exchange between software tasks and hardware pipelines. Hard floating-point DSP and hardened memory controllers reduce soft-IP overhead, freeing fabric for user logic.
Typical applications include 4K video processing and broadcast bridges, wireless baseband PHY and DSP, military radar and electronic warfare preprocessing, industrial machine vision, and high-throughput software-defined networking. The part is qualified for harsh-environment embedded systems where a deterministic fabric+CPU pairing accelerates time-to-market.
When designing with this device, plan the PCB for the 35x35 mm FCBGA - allocate at least 4 PCB layers with buried vias for the HPS DDR3/4 interface, and verify transceiver channel placement against the FPGA's bank assignments. Use Intel Quartus Prime with the SoC EDS toolchain; recompilation is required if migrating between speed grades or logic-density variants in the same package.
This page synthesizes distributor pricing, drop-in alternatives within the 10AS048 family, and design guidance drawn from the Altera/Intel Arria 10 device handbook - information not consolidated on a single OEM or distributor page.
Drop-in alternatives for 10AS048K2F35I2SG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with 10AS048K2F35I2SG (same form factor and footprint) — differing in Package, Operating Temperature, Transceivers, Mounting Type, Process Technology.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10AS048K2F35I2LG
✅ Drop-In✓ In Stock
$2650 / Unit
View Datasheet →10AS048K2F35I1HG
✅ Drop-In✓ In Stock
$3580 / Unit
View Datasheet →10AS048K2F35E2SG
✅ Drop-In✓ In Stock
Contact for price
View Datasheet →10AS048K2F35E2LG
✅ Drop-In✓ In Stock
$4150 / Unit
View Datasheet →10AS048K2F35E1HG
✅ Drop-In✓ In Stock
$2650 / Unit
View Datasheet →10AS048K1F35I1HG
✅ Drop-In✓ In Stock
$3263.87 / Unit
View Datasheet →10AS048K1F35E1HG
✅ Drop-In✓ In Stock
$3850 / Unit
View Datasheet →10AS048K2F35I2SG Maximum Ratings & Electrical Characteristics
| Family | Arria 10 SX SoC FPGA |
| Logic Elements | 480000 |
| Hard Processor System | Dual ARM Cortex-A9 MPCore with CoreSight |
| Process Technology | 20 nm |
| Core Voltage | 0.9 V |
| DSP Blocks | 1560 |
| Embedded Memory | 28.6 Mbits |
| High-Speed Transceivers | 24 (up to 17.4 Gbps) |
| Hard Memory Controllers | 2 (DDR4 with ECC) |
| Hard PCIe Blocks | 4 (PCIe Gen3) |
| Maximum Core Clock | 1.5 GHz |
| Temperature Grade | Industrial (-40C to +100C) |
| Package | 1152-FCBGA, F35 (35x35 mm) |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Compliant |
10AS048K2F35I2SG 1152-fcbga, f35 (35x35 mm) Pin Configuration Guide
Pin configuration for 10AS048K2F35I2SG (1152-fcbga, f35 (35x35 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10AS048K2F35I2SG.
Refer to the datasheet for full pin configuration.
Typical Applications
10AS048K2F35I2SG is suitable for 6 applications: 4K Video Processing and Broadcast Bridge, Wireless Baseband PHY and DSP Acceleration, Military Radar and Electronic Warfare Preprocessing, Industrial Machine Vision and Quality Inspection, Software-Defined Networking and Protocol Offload, Medical Imaging and Diagnostic Acceleration.
4K Video Processing and Broadcast Bridge
The 10AS048K2F35I2SG's combination of 480K logic elements, 1560 DSP blocks, and 24 transceivers up to 17.4 Gbps makes it a strong fit for 4K video pipelines where pixel-rate DSP and multi-channel SDI/DisplayPort bridging must coexist on a single device. The SoC HPS runs Linux for stream management while the fabric accelerates color-space conversion, scaling, and HDR tone mapping at full 60p frame rates. Hard PCIe Gen3 blocks enable direct attach to host capture or render cards without an external bridge. Compared with pure-logic FPGAs, the integrated Cortex-A9 reduces BOM by consolidating control-plane processing on-die.
Recommended
Wireless Baseband PHY and DSP Acceleration
In LTE and 5G NR baseband prototyping the 10AS048K2F35I2SG's 1560 hardened DSP blocks deliver the multiply-accumulate throughput required for channel estimation, FFT, and turbo/LDPC decoding. The HPS Cortex-A9 subsystem runs MAC-layer scheduling and L2/L3 protocol handling while the fabric handles PHY compute, allowing deterministic latency for TTI-bound operations. Industrial temperature grading suits outdoor small-cell and fronthaul gateways. Hardened memory controllers feed DDR4 samples directly to DSP dataplanes without consuming fabric block RAM.
Recommended
Military Radar and Electronic Warfare Preprocessing
Defense and aerospace radar preprocessing benefits from the 10AS048K2F35I2SG's 480K logic elements and 24 transceivers to ingest multi-channel IF streams and run pulse compression, MTI filtering, and direction-of-arrival algorithms in fabric. The HPS supervises track management and host-side telemetry. Industrial temperature grade (-40C to +100C) supports ruggedized enclosures and ground-mobile platforms. Hard floating-point DSP reduces fabric utilization compared with soft floating-point IP, freeing logic for proprietary beamforming kernels.
Recommended
Industrial Machine Vision and Quality Inspection
Multi-camera machine-vision lines leverage the 10AS048K2F35I2SG's high transceiver count and DSP density to ingest CoaXPress or GigE Vision streams and run convolutional kernels, defect detection, and optical-character recognition at line rate. The HPS Cortex-A9 handles PLC communication over EtherCAT or PROFINET, while the fabric accelerates image processing pipelines. Hardened PCIe Gen3 IP allows direct attach to industrial PCs for training-data offload. Industrial temperature grading ensures continuous operation in factory-floor enclosures.
Recommended
Software-Defined Networking and Protocol Offload
Carrier-grade SDN equipment uses the 10AS048K2F35I2SG to accelerate packet parsing, classification, and encryption at 100G line rates. The 24 transceivers provide ample SERDES for QSFP28 uplinks, and hard PCIe Gen3 blocks connect to commodity host CPUs. The HPS runs a control-plane NOS (such as a Linux-based routing stack) while the fabric implements data-plane fast paths. Industrial temperature grading supports telco central-office and outdoor edge deployments.
Recommended
Medical Imaging and Diagnostic Acceleration
CT, MRI, and ultrasound imaging carts benefit from the 10AS048K2F35I2SG's combination of fabric throughput and HPS control. The FPGA fabric performs beamforming and image reconstruction (such as filtered back-projection), while the Cortex-A9 HPS manages DICOM stack, user interface, and network connectivity. Industrial temperature grading supports continuous operation in clinical environments. The integration of CPU and FPGA on one die reduces EMI and board area versus a discrete CPU + FPGA solution.
Recommended
Recommended Products Summary
Engineering reference data for 10AS048K2F35I2SG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10AS048K2F35I2LG | 10AS048K2F35I1HG | 10AS048K2F35E2SG | 10AS048K2F35E2LG | 10AS048K2F35E1HG | 10AS048K1F35I1HG | 10AS048K1F35E1HG |
|---|---|---|---|---|---|---|---|---|
| Package | 1152-FCBGA (F35) | 1152-FCBGA (F35) - same | 1152-FCBGA (F35) - same | 1152-FCBGA (F35) - same | 1152-FCBGA (F35) - same | 1152-FCBGA (F35) - same | 1152-FCBGA (F35) - same | 1152-FCBGA (F35) - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 480K | 480K | 480K | 480K | 480K | 480K | 480K (K1 transceiver density) | 480K (K1 transceiver density) |
| Temperature Grade | Industrial (-40C to +100C) | Industrial | Industrial | Extended | Extended | Extended | Industrial | Extended |
| Speed Bin | I2 (mid-tier) | I2 | I1 | E2 | E2 | E1 | I1 | E1 |
| Transceiver Density Tier | K2 (full 24 channels) | K2 | K2 | K2 | K2 | K2 | K1 (reduced) | K1 (reduced) |
| DSP Blocks | 1560 | 1560 | 1560 | 1560 | 1560 | 1560 | 1560 | 1560 |
| Embedded Memory | 28.6 Mbits | 28.6 Mbits | 28.6 Mbits | 28.6 Mbits | 28.6 Mbits | 28.6 Mbits | 28.6 Mbits | 28.6 Mbits |
Key Differentiators
- Balanced K2 transceiver density with industrial temperature grade (vs 10AS048K1F35I1HG)
- Mid-bin I2 speed grade for typical industrial workloads (vs 10AS048K2F35E2SG)
- Same-package F35 FCBGA as other 10AS048 SKUs (vs 10AS048H4F34I3SG)
Design Notes
The 1152-ball F35 FCBGA at 35x35 mm requires at least a 4-layer PCB with buried or micro vias for breakout. Route the two hard DDR4 controllers as point-to-point with length matching within the EMIF tool budget. Provide 4 to 8 layers for transceiver SERDES, keeping TX/RX differential pairs length-matched within 5 mils and routed over a continuous reference plane.
Estimated: at full transceiver utilization and 100% logic toggle, total on-die power can exceed 40 W. The F35 FCBGA thermal pad requires a high-conductivity TIM and a heatsink or cold plate sized for the deployment ambient. Junction-to-ambient thermal resistance with no heatsink is well above the 100C industrial ceiling under typical loads; thermal simulation in Quartus Prime PowerPlay is recommended.
Migration between Arria 10 SX speed bins (I1, I2, E1, E2) requires Quartus Prime recompilation with the new timing model - reusing a bitstream from a different bin will not work. Transceiver density tiers (K1 vs K2) are not interchangeable; pin-compatibility is preserved but the lower-density K1 disables specific transceiver channels at the silicon level. Always regenerate the pinout assignment file after speed-bin change.
Place the HPS boot flash, DDR4 SODIMM or DIMM area, and PCIe edge connector on the same PCB side as the SoC FPGA when possible, keeping high-speed traces short. Decouple each transceiver bank with 0.1 uF and 10 uF capacitors as close to the package balls as the BGA escape allows. Route the configuration EPROM QSPI lines with controlled impedance and avoid running them parallel to noisy switching rails.
Compliance Information
RoHS and REACH compliance per Altera/Intel product page material-attributes table. Not AEC-Q100 qualified - this is an industrial-grade FPGA, not an automotive-grade part. Lead-free FCBGA ball finish is standard for Arria 10 SX.
