10AS048K3F35E2SG - Arria 10 SX SoC FPGA 480K LE 1152-FBGA | Intel
MPN: 10AS048K3F35E2SG ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $3450 | $3,450.00 |
| 10 | $3210 | $32,100.00 |
| 25 | $3050 | $76,250.00 |
| 50 | $2890 | $144,500.00 |
| 100 | $2720 | $272,000.00 |
Drop-in alternatives for 10AS048K3F35E2SG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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10AS048K3F35E2LG
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$3495 / Unit
View Datasheet →10AS048K2F35E2SG
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Contact for price
View Datasheet →10AS048K2F35E2LG
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$4150 / Unit
View Datasheet →10AS048K3F35I2SG
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$1995 / Unit
View Datasheet →10AS048K2F35I2SG
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$3450 / Unit
View Datasheet →10AS048K3F35E2SG Maximum Ratings & Electrical Characteristics
| Family | Arria 10 SX |
| Logic Elements | 480,000 |
| Processor Cores | Dual ARM Cortex-A9 MPCore with CoreSight |
| Processor Frequency | 1.5 GHz |
| Technology Node | 20 nm |
| Core Voltage | 0.9 V |
| Package | 1152-FBGA, FC (35x35 mm) |
| Mounting Type | Surface Mount |
| Hard Processor System (HPS) | Yes (ARM Cortex-A9 dual-core) |
| Transceivers | Yes (multi-gigabit, up to 12.5 Gbps) |
| Memory Interfaces | DDR4/DDR3 with ECC (hard controller) |
| PCIe Hard IP | Gen2 x4 / Gen3 capable |
| Operating Temperature | -40C to +100C (industrial grade E2) |
| MSL Level | 3 |
| RoHS Status | Compliant |
| Speed Grade | 3 |
| Lead-Free | Yes |
10AS048K3F35E2SG 1152-fbga, fc (35x35 mm) Pin Configuration Guide
Complete pinout information for 10AS048K3F35E2SG (1152-fbga, fc (35x35 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10AS048K3F35E2SG.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10AS048K3F35E2SG is suitable for 6 applications: 4K Video Processing & Broadcast Equipment, Radar & Electronic Warfare DSP, 5G Fronthaul Baseband Processing, Industrial Machine Vision Systems, PCIe Accelerator Cards, Medical Imaging & Diagnostic Equipment.
4K Video Processing & Broadcast Equipment
The 10AS048K3F35E2SG's 480K logic elements and high DSP block count enable 4K60 video pipeline processing including scaling, deinterlacing, and color space conversion. Its dual ARM Cortex-A9 at 1.5 GHz handles control plane tasks, network control, and on-screen-display rendering, offloading the FPGA fabric. Multi-gigabit transceivers drive 12G-SDI or HDMI 2.0 fanout, while hard DDR4 controllers buffer uncompressed 4K frames. Compared to a discrete CPU+FPGA board, the SoC integration reduces latency for live broadcast workflows and shrinks BOM for video-over-IP encoders.
Recommended
Radar & Electronic Warfare DSP
The 10AS048K3F35E2SG is well-suited for radar and EW front-end DSP because of 480K LEs, embedded DSP blocks supporting floating-point and fixed-point FFTs, and multi-gigabit transceivers for ADC/DAC data capture. The ARM Cortex-A9 host runs control software, health monitoring, and message formatting without an external SBC. Hard PCIe Gen2/3 IP enables the board to feed digitized data to a host processor at line rate. Compared to GPU-based alternatives, Arria 10 SX offers lower latency and deterministic timing critical for EW pulse processing.
Recommended
5G Fronthaul Baseband Processing
The 10AS048K3F35E2SG's combination of multi-gigabit transceivers (eCPRI and CPRI), hard PCIe Gen3, and dual ARM Cortex-A9 cores makes it a strong fit for 5G fronthaul baseband units. The FPGA fabric handles PHY-layer FFT/iFFT and beamforming, while the ARM host runs MAC scheduling and timing. Hard DDR4 with ECC supports high-bandwidth memory buffering for antenna data. Compared to ASIC-only fronthaul solutions, the SoC FPGA enables field-upgradeable feature sets without respinning silicon.
Recommended
Industrial Machine Vision Systems
The 10AS048K3F35E2SG serves industrial machine vision by providing 480K LEs for image processing pipelines including Bayer demosaicing, defect detection, and conveyor tracking. Multi-gigabit transceivers connect to Camera Link, CoaXPress, or GigE Vision cameras; the hard PCIe Gen3 block streams processed frames to a host PC. The dual ARM Cortex-A9 host runs the Linux-based machine vision application stack with deterministic low latency. Compared to discrete CPU+FPGA boards, the SoC reduces BOM and simplifies EMI compliance.
Recommended
PCIe Accelerator Cards
The 10AS048K3F35E2SG is a strong fit for PCIe accelerator cards where the hard PCIe Gen3 x8 IP block delivers high host-to-FPGA bandwidth. The FPGA fabric offloads compute kernels such as compression, encryption, or AI inference, while the dual ARM Cortex-A9 manages housekeeping and host-facing APIs. Hard DDR4 with ECC provides high-bandwidth working memory. Compared to discrete FPGA cards without a host, the integrated ARM eliminates the need for a board-level microcontroller or external SBC.
Recommended
Medical Imaging & Diagnostic Equipment
The 10AS048K3F35E2SG fits medical imaging equipment such as ultrasound, CT, and MRI front-ends because 480K LEs run beamforming and image reconstruction pipelines with deterministic latency. Multi-gigabit transceivers interface with high-channel-count ADC arrays, while the dual ARM Cortex-A9 host runs control software and display drivers. Hard DDR4 with ECC supports large image buffers with safety-critical error correction. Compared to discrete CPU+FPGA solutions, the SoC consolidation simplifies IEC 60601 compliance and reduces PCB complexity.
Recommended
Recommended Products Summary
Engineering reference data for 10AS048K3F35E2SG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10AS048K3F35E2LG | 10AS048K2F35E2SG | 10AS048K2F35E2LG |
|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel |
| Package | 1152-FBGA, FC (35x35 mm) | 1152-FBGA, FC (35x35 mm) - same | 1152-FBGA, FC (35x35 mm) - same | 1152-FBGA, FC (35x35 mm) - same |
| Speed Grade | 3 | 3 | 2 (slower Fmax) | 2 (slower Fmax) |
| Logic Elements | 480,000 | 480,000 | 480,000 | 480,000 |
| Processor Cores | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore |
| Processor Frequency | 1.5 GHz | 1.5 GHz | 1.5 GHz | 1.5 GHz |
| Temperature Grade | Industrial -40C to +100C (E2) | Industrial -40C to +100C (E2) | Industrial -40C to +100C (E2) | Industrial -40C to +100C (E2) |
| Transceivers | Multi-gigabit (up to 12.5 Gbps) | Multi-gigabit (up to 12.5 Gbps) | Multi-gigabit (lower Fmax at grade 2) | Multi-gigabit (lower Fmax at grade 2) |
| Hard PCIe IP | Gen2 x4 / Gen3 capable | Gen2 x4 / Gen3 capable | Gen2 x4 / Gen3 capable | Gen2 x4 / Gen3 capable |
| Packaging Variant | Standard (SG) | Large reel (LG) | Standard (SG) | Large reel (LG) |
Key Differentiators
- Speed grade 3 timing advantage (vs 10AS048K2F35E2SG)
- Identical silicon, larger reel packaging (vs 10AS048K3F35E2LG)
- Single-chip ARM + FPGA integration (vs Discrete CPU + FPGA board design)
Design Notes
Estimated: at 0.9 V core, full HPS + FPGA activity, and transceiver-heavy workloads, the 10AS048K3F35E2SG can dissipate 25-35 W. The 1152-FBGA 35x35 mm package requires a thermal interface material (TIM) and an active heatsink with at least 1 m/s airflow; under sustained load, passive cooling alone will likely exceed the 100C junction limit.
Estimated: the 1152-ball FC-FBGA at 1.0 mm ball pitch demands a minimum 12-layer PCB with stacked vias, dedicated ground/power planes, and length-matched differential pairs for transceiver channels. Use the Altera/Intel Arria 10 SX F35 board design guidelines for via-in-pad and stackup recommendations to avoid signal-integrity issues.
Do not mix up 10AS048K3F35E2SG (speed grade 3) with 10AS048K2F35E2SG (speed grade 2) when ordering for timing-critical designs; the grade change requires Quartus Prime timing analysis verification. Also verify the HPS boot configuration pins match your boot source (QSPI flash, SD card, or NAND) since the boot mode resistors are sampled at power-on.
Compliance Information
RoHS compliant per Intel/Altera product page; AEC-Q100 not applicable for FPGAs (use Q100-qualified MCUs if automotive functional safety is required).
