10AS048K2F35E2SG - 480K Logic Elements SoC FPGA | Intel
MPN: 10AS048K2F35E2SG ✓ Active| Qty | Unit Price | Extended |
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Drop-in alternatives for 10AS048K2F35E2SG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10AS048K2F35E2LG
✅ Drop-In✓ In Stock
$4150 / Unit
View Datasheet →10AS048K2F35E1HG
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View Datasheet →10AS048K1F35E1HG
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$3850 / Unit
View Datasheet →10AS048K1F35I1HG
✅ Drop-In✓ In Stock
$3263.87 / Unit
View Datasheet →10AS048H4F34E3SG
✅ Drop-In✓ In Stock
$2250 / Unit
View Datasheet →10AS048K2F35E2SG Maximum Ratings & Electrical Characteristics
| Product Type | System On Chip (SoC) IC Arria 10 SX FPGA |
| Processor Cores | Dual ARM Cortex-A9 MPCore |
| Debug Technology | ARM CoreSight |
| Logic Elements | 480000 |
| Specified Frequency | 1.5 GHz |
| Memory | 256 KB |
| Technology | CMOS |
| Package | 1152-FBGA, FC (35x35 mm) |
| Package Category | FCBGA |
| Terminal Count | 1152 |
| Terminal Form | Ball |
| Package Code | BGA |
| Package Shape | Square |
| Nominal Supply | 0.95 V |
| RoHS Status | Compliant |
| Mounting Type | Surface Mount |
10AS048K2F35E2SG square Pin Configuration Guide
Complete pinout information for 10AS048K2F35E2SG (square package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10AS048K2F35E2SG.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10AS048K2F35E2SG is suitable for 6 applications: Industrial Automation Controller, Communications Infrastructure, Medical Diagnostic Equipment, Test and Measurement Platform, Aerospace and Defense Signal Processing, High-Performance Embedded Computing.
Industrial Automation Controller
10AS048K2F35E2SG fits industrial automation controllers that need parallel hardware control and embedded software on one device. Its 480000 logic elements can implement real-time interface conversion, filtering, motor-control datapaths, protocol bridges, and safety-oriented monitoring logic. Dual ARM Cortex-A9 MPCore processors provide a platform for supervisory control, communications, diagnostics, and operating-system services, while CoreSight technology supports system-level debug. The 1152-ball FCBGA package offers 1152 terminals for dense I/O and high-speed connectivity, but it requires a full via field, controlled escape routing, and robust assembly. The verified sources do not state an industrial temperature grade or complete I/O counts, so those parameters remain [DATA_NEEDED: industrial temperature and I/O details] before deployment in a production controller.
Recommended
Communications Infrastructure
10AS048K2F35E2SG can support communications infrastructure requiring deterministic parallel processing, high-density interfaces, and processor-based management. The 480000 logic elements are suitable for packet processing, protocol termination, traffic shaping, encryption assistance, and custom high-speed datapaths, while dual ARM Cortex-A9 MPCore cores can run control-plane software, network management, and diagnostics. The 1.5 GHz stated frequency supports substantial processing bandwidth, although the complete transceiver count, maximum data rate, and supported electrical standards are [DATA_NEEDED: communications electrical specifications]. A 1152-ball FCBGA device also permits extensive connectivity but demands impedance-controlled routing, clean power distribution, reference-clock planning, and careful signal-integrity validation. Use the official Intel pinout and device handbook to map transceiver and general-purpose I/O resources before board implementation.
Recommended
Medical Diagnostic Equipment
10AS048K2F35E2SG is relevant to medical diagnostic equipment where acquisition, filtering, image processing, and control functions must operate under strict timing constraints. The 480000 logic elements can implement sensor-interface logic, digital filtering, beamforming assistance, data compression, and other parallel processing functions. Dual ARM Cortex-A9 MPCore processors can manage user interfaces, device control, data storage, and communications. CoreSight technology provides a structured processor debug platform during development. However, medical use requires system-level validation beyond component specifications, including noise, thermal behavior, reliability, lifecycle, and applicable regulatory requirements. The supplied data does not provide medical-grade certification, operating-temperature limits, radiation behavior, or safety documentation. Those values remain [DATA_NEEDED: medical qualification parameters], and designers must perform the required system validation before clinical deployment.
Recommended
Test and Measurement Platform
10AS048K2F35E2SG suits a test and measurement platform that combines instrument-level signal processing with embedded control. Its 480000 logic elements can accelerate waveform analysis, correlation, filtering, encoding, trigger logic, and custom measurement algorithms. Dual ARM Cortex-A9 MPCore processors can run calibration routines, user interfaces, data logging, and remote-control software, while CoreSight technology supports processor debugging. The 1.5 GHz stated frequency and 256 KB listed memory provide a starting point for architecture planning, but usable memory architecture, external-memory interfaces, and signal-integrity limits are not fully specified in the supplied data. Use controlled-impedance PCB design, low-noise power, deterministic clocking, and calibration-aware signal paths. Values for ADC or DAC interfaces, analog bandwidth, and measurement accuracy are system-level requirements and remain [DATA_NEEDED: measurement-interface specifications].
Recommended
Aerospace and Defense Signal Processing
10AS048K2F35E2SG can be considered for aerospace and defense signal-processing systems requiring high programmable density and embedded control. The 480000 logic elements support multiple parallel channels, sensor fusion preprocessing, communications functions, and custom signal-analysis datapaths. Dual ARM Cortex-A9 MPCore processors can execute control, monitoring, and communications software, while CoreSight technology assists system debug. The 1152-ball FCBGA package is appropriate for high-complexity boards but creates substantial assembly, inspection, thermal, and counterfeit-screening obligations. The verified sources do not provide military temperature grade, radiation tolerance, packaging qualification, or reliability data. Those attributes remain [DATA_NEEDED: aerospace and defense qualification data]. Program teams should obtain the applicable Intel quality documents, conduct component-level screening, and validate the complete design for shock, vibration, temperature, radiation, and long-term availability requirements.
Recommended
High-Performance Embedded Computing
10AS048K2F35E2SG is applicable to high-performance embedded-computing platforms that partition work between software and programmable hardware. The dual ARM Cortex-A9 MPCore subsystem can run operating systems, device management, file services, and control applications, while 480000 logic elements accelerate algorithms that benefit from parallelism. This architecture is useful for data acquisition, machine-vision preprocessing, protocol conversion, and deterministic control. The 1.5 GHz stated frequency helps define system expectations, but the supplied evidence does not specify processor performance, internal-memory capacity, external-memory support, or power consumption. Those values remain [DATA_NEEDED: embedded-computing performance and power details]. Design the power tree, clock network, boot and configuration paths, and thermal solution from official documentation, while preserving signal integrity through the 1152-ball FCBGA package and high-density PCB implementation.
Recommended
Recommended Products Summary
Engineering reference data for 10AS048K2F35E2SG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10AS048K2F35E2LG | 10AS048K2F35E1HG | 10AS048K1F35E1HG | 10AS048K1F35I1HG | 10AS048H4F34E3SG |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1152-FBGA, FC (35x35 mm) | 1152-FBGA, FC (35x35 mm) | 1152-FBGA, FC (35x35 mm) | 1152-FBGA, FC (35x35 mm) | 1152-FBGA, FC (35x35 mm) | BGA |
| Device Class | Arria 10 SX SoC FPGA | Arria 10 SX family ordering variant | Arria 10 SX family ordering variant | Arria 10 SX family ordering variant | Arria 10 SX family ordering variant | Arria 10 SoC family ordering variant |
| Logic Elements | 480000 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
| Processor Subsystem | Dual ARM Cortex-A9 MPCore | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
| CoreSight Technology | Present | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
| Specified Frequency | 1.5 GHz | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
| Memory | 256 KB | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
| Technology | CMOS | CMOS family; exact specification [DATA_NEEDED] | CMOS family; exact specification [DATA_NEEDED] | CMOS family; exact specification [DATA_NEEDED] | CMOS family; exact specification [DATA_NEEDED] | CMOS family; exact specification [DATA_NEEDED] |
| RoHS Status | Compliant | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
| Price Tier | [DATA_NEEDED: current unit price] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Verified high-density SoC-FPGA identity (vs 10AS048H4F34E3SG)
- Explicit processor and debug integration (vs 10AS048K2F35E2LG)
- Large stated logic capacity for parallel functions (vs 10AS048K1F35E1HG)
- Large high-density package for complex systems (vs 10AS048K2F35E1HG)
Design Notes
Treat the 1152-ball FCBGA package as a system-level interconnect and power-design problem. Use the official Intel package drawing to create the land pattern, then verify escape routing, via fields, antipads, plane splits, and reference-plane continuity. Keep high-speed differential pairs over a continuous reference plane, control impedance, and avoid unnecessary layer transitions. Verify the complete ball map because the supplied web evidence confirms the 1152-terminal package but does not expose individual ball functions.
The verified result identifies CMOS technology and a 0.95 V nominal supply feature, but complete current consumption, rail tolerances, sequencing, and transient limits are not supplied. Do not estimate these values from the feature listing. Obtain the official Intel power-supply design guidance, identify every required rail, size the power tree for worst-case current plus margin, and place local decoupling at the package entry and logic clusters. Validate startup and shutdown sequencing with the processor system, FPGA configuration logic, clocks, and memory interfaces before layout sign-off.
A 35 mm by 35 mm FCBGA package can support high functional density but requires an explicit thermal path. The supplied data does not provide junction-to-air or junction-to-case resistance, maximum power, or operating temperature. Obtain those values from the official datasheet and thermal documentation, then create a package-aware heat-spreader, heatsink, or board-copper strategy as appropriate. Use worst-case FPGA, processor, I/O, and memory-interface activity for thermal analysis, not only the nominal 1.5 GHz figure.
High-speed SoC-FPGA designs require coordinated clock, power, and signal-integrity planning. Define clock-source accuracy and jitter budgets, provide low-noise power rails, use controlled-impedance routes for high-speed signals, and confirm differential-pair polarity and receiver constraints against the official pinout. The supplied results do not specify transceiver count, supported I/O standards, maximum data rate, or external-memory performance. Those values remain [DATA_NEEDED: high-speed interface specifications] and must be resolved before assigning pins or closing timing budgets.
Do not infer a drop-in replacement from a similar 10AS048 prefix, package description, or family name. The 10AS048K2F35E2LG, 10AS048K2F35E1HG, 10AS048K1F35E1HG, 10AS048K1F35I1HG, and 10AS048H4F34E3SG candidates require exact ordering-code and official-datasheet validation. For production, check the package ball map, processor and FPGA resource identity, power rails, configuration scheme, boot and software support, temperature grade, lifecycle, pin-compatible sourcing, and errata before treating any candidate as interchangeable.
Compliance Information
RoHS compliant is stated by the verified Ampheo result. REACH, lead-free, halogen-free, conflict-minerals, temperature-grade, and automotive-qualification data were not supplied. AEC-Q100 is not applicable based on the available product description, but no automotive certification claim is made.
