10AS048K2F35E2LG - Arria 10 SX SoC FPGA 480K LE | Intel
MPN: 10AS048K2F35E2LG β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $4850 | $4,850.00 |
| 10 | $4650 | $46,500.00 |
| 25 | $4500 | $112,500.00 |
| 50 | $4350 | $217,500.00 |
| 100 | $4150 | $415,000.00 |
Drop-in alternatives for 10AS048K2F35E2LG β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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10AS048K1F35E1HG
β Drop-Inβ In Stock
$3850 / Unit
View Datasheet β10AS048H2F35E2LG
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10AS048H1F35E1HG
β Drop-Inπ Reference alternative (not in catalog)
10AS048K2F35E1HG
β Drop-Inβ In Stock
$2650 / Unit
View Datasheet β10AS048K2F35E2LG Maximum Ratings & Electrical Characteristics
| Product Type | FPGA - SoC (System-on-Chip) |
| Series | Arria 10 SX |
| Logic Elements | 480,000 |
| Hard Processor Subsystem | Dual ARM Cortex-A9 MPCore with CoreSight |
| HPS Maximum Frequency | 1.5 GHz |
| Process Technology | 20 nm |
| Core Voltage | 0.9 V |
| Package | 1152-FBGA, FC (35x35 mm) |
| Mounting Type | Surface Mount (Flip-Chip BGA) |
| Number of Pins | 1152 |
| Package Code | BGA (Flip-Chip) |
| Terminal Form | Ball |
| Embedded Memory | 28.05 Mbits (MLAB + M20K blocks) |
| DSP Blocks | Variable-precision, fixed/floating point |
| Transceivers | Up to 24 channels, up to 17.4 Gbps |
| Operating Temperature | Extended (per device grade) |
| RoHS Status | Compliant |
10AS048K2F35E2LG bga (flip-chip) Pin Configuration Guide
Complete pinout information for 10AS048K2F35E2LG (bga (flip-chip) package) with 1152 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10AS048K2F35E2LG.
Refer to the datasheet for full pin configuration.
Estimated pin count: 1152 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10AS048K2F35E2LG is suitable for 7 applications: Wireless Baseband and Radio Remote Unit (RRU), Industrial Machine Vision and Video Processing, Software Defined Radio (SDR) Platform, Military Secure Communications, Medical Imaging Acceleration, Avionics and Industrial Ethernet Switching, High-Performance Computing (HPC) Offload.
Wireless Baseband and Radio Remote Unit (RRU)
The 10AS048K2F35E2LG's 480K logic elements and 17.4 Gbps transceivers make it ideal for wireless baseband processing in LTE/5G radio remote units. The hardened dual ARM Cortex-A9 MPCore subsystem running up to 1.5 GHz handles Layer 2/3 protocols, MAC scheduling, and OAM, while the FPGA fabric accelerates PHY-layer functions: CPRI/OBSAI framer, FFT/iFFT (768/1024/2048-point), channel estimation, and crest-factor reduction (CFR). The device's variable-precision DSP blocks deliver up to 1.5 TFLOPS for fixed/floating-point math. With 24 transceiver channels at 17.4 Gbps, a single Arria 10 SX SoC FPGA can support multiple CPRI links (option 3/5/7/8), replacing a previous-generation DSP plus FPGA plus processor trio. Per Intel Arria 10 SX datasheet, the HPS supports up to 4 GB DDR4 via dedicated hard memory controllers, sufficient for HARQ buffers and protocol stacks. Designers should plan PCB stackup for 17.4 Gbps transceivers (Intel provides reference channel models), and budget thermal dissipation (~8-12W typical for fully loaded RRU designs) with a heatsink plus airflow above 200 LFM.
Recommended
Industrial Machine Vision and Video Processing
The 10AS048K2F35E2LG supports multi-camera machine vision systems where the FPGA fabric performs real-time image processing (Sobel, morphology, color space conversion, Bayer demosaic) while the ARM Cortex-A9 subsystem runs industrial vision algorithms, camera link aggregation, and protocol stacks (GigE Vision, USB3 Vision, CoaXPress). The 480K logic elements and ~28 Mbits of embedded memory (M20K + MLAB) handle 4K@60 fps pipelines with multiple pipeline stages. Embedded variable-precision DSP blocks accelerate convolutional operations and image transforms. The hardened HPS eliminates the need for a companion external processor, reducing BOM and enabling Linux/VxWorks-based control plane on the same device. The 1.5 GHz Cortex-A9 core with NEON media engines accelerates H.264/H.265 decode for preview/monitoring. Per Intel's design examples, Arria 10 SX SoC FPGAs in industrial machine vision achieve <40 ms end-to-end latency for 4K image processing. PCB thermal design must sustain 10-15W typical load with the 35x35 mm FBGA package.
Recommended
Software Defined Radio (SDR) Platform
The 10AS048K2F35E2LG provides an excellent single-chip SoC for Software Defined Radio platforms: the FPGA fabric handles wideband ADC/DAC interfacing, channelization, digital down-conversion (DDC), digital up-conversion (DUC), and waveform-specific DSP, while the dual ARM Cortex-A9 MPCore subsystem at 1.5 GHz runs a Linux or VxWorks RTOS-based waveform management stack, network protocols, and control. Per the Arria 10 SX datasheet, the device integrates up to 24 high-speed transceiver channels up to 17.4 Gbps, sufficient for multi-band RF front-end digitization. The 480K logic elements support multiple parallel channels simultaneously. Embedded memory totaling 28.05 Mbits (M20K + MLAB) provides buffering for ADC sample streams at hundreds of MSPS. Variable-precision DSP blocks deliver 1.5+ TFLOPS for FFT, channelization, and demodulation. With hardened memory controllers supporting DDR4/DDR3/QDR IV, designers can implement sample buffers of several gigabytes per board. The HPS-to-FPGA bridges enable sub-microsecond accelerator invocation for real-time waveform switching.
Recommended
Military Secure Communications
The 10AS048K2F35E2LG is widely used in tactical radio and secure communications systems where size, weight, power, and SWaP-C optimization is critical. The integrated HPS subsystem eliminates a separate processor companion, reducing PCB area by 50-60% versus previous-generation FPGA + external ARM designs. FPGA-side fabric accelerates Link 16, SINCGARS, and modern wideband tactical waveforms with encryption offload via AES/SHA cores. The dual Cortex-A9 MPCore subsystem runs secure communications stacks (HAIPE, vIPer) on Linux or a hardened RTOS. Per Intel Arria 10 SX datasheet, the device supports extended temperature operation (-40C to +100C TJ) suitable for Mil-Std-810 environments. Transceiver rates up to 17.4 Gbps enable high-rate bulk encryption data paths. FPGA fabric partial reconfiguration supports runtime waveform switching. Hardware security features include bitstream AES-256 encryption and JTAG disable for tamper resistance. Designers should budget for a robust heatsink with conductive/forced convection for sustained 15-20W operating power in MIL environments.
Recommended
Medical Imaging Acceleration
Medical imaging systems (CT, MRI, ultrasound, PET) use the 10AS048K2F35E2LG to accelerate image reconstruction in real time. The FPGA fabric runs reconstruction algorithms (filtered backprojection, iterative reconstruction, beamforming) while the HPS subsystem manages patient interface, image rendering, and network connectivity (DICOM, HL7). Per Intel datasheet, the 480K logic elements and ~28 Mbits of embedded memory handle reconstruction pipelines at 30+ frames per second. Variable-precision DSP blocks accelerate Fourier transforms, convolutions, and matrix operations critical to CT/MR reconstruction. The hardened ARM Cortex-A9 MPCore subsystem with CoreSight debug accelerates development of medical user interfaces and hospital information system integration. Embedded memory controllers support DDR4/DDR3/QDR IV with up to 1.5 GT/s per pin, sufficient for large 3D image volume buffering. The HPS subsystem can run FDA-validated Linux distributions and supports real-time extensions for deterministic image acquisition control.
Recommended
Avionics and Industrial Ethernet Switching
The 10AS048K2F35E2LG is well-suited for Time-Sensitive Networking (TSN) and avionics-grade Ethernet switches/routers. The hardened ARM Cortex-A9 MPCore subsystem running an RTOS or TSN-aware Linux manages control plane, telemetry, and network management (SNMP, NETCONF/YANG). The FPGA fabric implements TSN scheduling (IEEE 802.1Qbv, 802.1Qcc), cut-through switching, and line-rate packet processing on multiple 10G/25G interfaces. Per the Arria 10 SX datasheet, transceiver rates up to 17.4 Gbps support 10GbE/25GbE KR backplane interfaces and ARINC 818/664 high-speed avionics links. The 480K logic elements implement multi-port TSN switches with up to 12 ports. Variable-precision DSP blocks accelerate IPSec/AES encryption for secure avionics buses. Designers should plan heatsink plus airflow for ~12-15W sustained operation in DO-160 thermal envelopes. The HPS subsystem provides IEEE 1588v2 hardware timestamping for sub-microsecond synchronization required in TSN and ARINC networks.
Recommended
High-Performance Computing (HPC) Offload
High-performance computing clusters and edge data centers use the 10AS048K2F35E2LG as a compute acceleration offload engine. The FPGA fabric accelerates HPC kernels (matrix multiply, FFT, convolutions, genomics alignment) using variable-precision DSP blocks, while the ARM Cortex-A9 HPS subsystem runs HPC framework libraries, scheduling, and data marshaling. The 1.5 GHz HPS core with NEON engines accelerates Java/Python wrappers and OpenCL host code. Per Intel Arria 10 SX documentation, the device's OpenCL SDK enables code portability between Arria 10 SX and Stratix 10. PCI Express Gen2/Gen3 hard IP blocks provide high-bandwidth host communication for offload workloads. With ~28 Mbits of embedded memory, working sets fit on-chip for many HPC kernels; larger datasets spill to attached DDR4. The HPS subsystem runs Linux with HPC cluster management stacks (SLURM, MPI) directly on the FPGA. Designers should plan 15+W thermal dissipation; the 35x35 mm FBGA package handles this with a passive heatsink plus airflow.
Recommended
Recommended Products Summary
Engineering reference data for 10AS048K2F35E2LG β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10AS048K1F35E1HG | 10AS048H2F35E2LG | 10AS048H1F35E1HG | 10AS048K2F35E1HG |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 1152-FBGA, FC (35x35) | 1152-FBGA, FC (35x35) - same | 1152-FBGA, FC (35x35) - same | 1152-FBGA, FC (35x35) - same | 1152-FBGA, FC (35x35) - same |
| Logic Elements | 480,000 | 480,000 | 480,000 | 480,000 | 480,000 |
| HPS Maximum Frequency | 1.5 GHz | 1.5 GHz | 1.5 GHz | 1.5 GHz | 1.5 GHz |
| Speed/Power Grade | K2 | K1 (-10% fMAX) | H2 (-20% fMAX) | H1 (-30% fMAX) | K2 (identical) |
| Temperature Grade | Extended (E2) | Extended (E1) | Extended (E2) | Extended (E1) | Industrial (I1) |
| Process Technology | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm |
| Embedded Memory | 28.05 Mbits | 28.05 Mbits | 28.05 Mbits | 28.05 Mbits | 28.05 Mbits |
| Estimated Unit Price (qty-1) | $4,850 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Higher speed/power grade K2 delivers maximum fMAX margin (vs 10AS048K1F35E1HG)
- Extended temperature grade (E2) supports wider thermal envelopes (vs 10AS048K2F35E1HG)
- Higher fMAX headroom than H-speed variants for tight timing (vs 10AS048H2F35E2LG)
Design Notes
Estimated: At typical FPGA utilization (~70% LE, 60% DSP, all 24 transceivers active), the 10AS048K2F35E2LG dissipates approximately 12-18W. With the 35x35 mm 1152-FBGA FCBGA package having theta_JA in the range of 8-12 C/W (with thermal balls soldered), junction temperature rise would be approximately 100-220C above ambient. A passive heatsink plus airflow above 200 LFM is required for sustained operation; for hot industrial or MIL envelopes (-40C to +85C ambient), active cooling (heatsink + small fan) is recommended. Verify thermal performance against the Arria 10 thermal management application note, and validate via production board thermal testing.
Per Intel Arria 10 SX design guidelines, the PCB stackup must support 17.4 Gbps transceiver rates with differential trace impedance of 100 ohm +/-10%, and the inner PCB layers must provide continuous reference ground planes beneath transceiver channels. The 1152-FBGA FCBGA requires at least an 8-layer stackup with 0.8 mm ball pitch; below this, breakout routing cannot escape the BGA. Use microvia (laser-drilled stacked vias) for inner-row BGA signals. HPS DDR4/3 routing requires matched-length traces and dedicated ground shielding. For transceiver reference clock routing, follow Intel's reference clock layout rules with 100 ohm differential and isolated grounds.
Common pitfalls when designing with the 10AS048K2F35E2LG: (1) Forgetting to power-up HPS and FPGA in the correct sequence - the HPS must come up before the FPGA fabric configuration if it is the master, otherwise use passive serial mode; (2) Using the wrong configuration mode - AS (active serial) requires QSPI/NAND, JTAG requires an external programmer, and passive mode requires an external master; (3) Underestimating transceiver PCB losses - 17.4 Gbps signals require low-loss PCB material (Isola FR408HR, Rogers, or Megtron) for backplane lengths above 10 inches; (4) Bypassing the encryption engine check - leave bitstream AES-256 encryption on for tamper resistance, particularly in field-deployable applications.
Compliance Information
RoHS compliant per Intel ordering code LG suffix. AEC-Q100 not applicable (this is an SoC FPGA, not an automotive IC). For AEC-Q100 automotive FPGAs, see Cyclone V Auto or PolarFire SoC.
