10AS057H4F34E3LG - Arria 10 SX SoC FPGA, 570K LE, Dual ARM Cortex-A9 | Intel
MPN: 10AS057H4F34E3LG ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $2533.83 | $2,533.83 |
| 10 | $2380 | $23,800.00 |
| 100 | $2150 | $215,000.00 |
| 500 | $1950 | $975,000.00 |
| 1,000 | $1820 | $1,820,000.00 |
Drop-in alternatives for 10AS057H4F34E3LG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10AS057H3F34E2SG
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View Datasheet →10AS057H3F34I2LG
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View Datasheet →10AS057H2F34I2SG
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View Datasheet →10AS057H2F34E2LG
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View Datasheet →10AS048H4F34E3LG
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View Datasheet →10AS048H3F34I2SG
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View Datasheet →10AS057H4F34E3LG Maximum Ratings & Electrical Characteristics
| Family | Arria 10 SX |
| Device Variant | 10AS057 |
| Logic Elements | 570,000 |
| Processor Core | Dual ARM Cortex-A9 MPCore with CoreSight |
| Maximum Core Frequency | 1.5 GHz |
| Process Technology | 20 nm |
| Core Voltage | 0.9 V |
| Package | 1152-FBGA, FCBGA (35x35 mm) |
| I/O Count | 492 user I/O |
| Mounting Type | Surface Mount |
| Operating Temperature Grade | Enhanced (E3) |
| RoHS Status | Compliant |
| Speed Grade | H4 |
| Package Code | F34 |
| Device Type | SoC FPGA - System on Chip |
| Configuration | FPGA Arria 10 SX 570000 Cells |
10AS057H4F34E3LG f34 Pin Configuration Guide
Complete pinout information for 10AS057H4F34E3LG (f34 package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10AS057H4F34E3LG.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10AS057H4F34E3LG is suitable for 6 applications: Wireless Baseband Processing, Military Radar and SIGINT, Medical Imaging Systems, Broadcast Video Processing, Industrial Test and Measurement, Datacenter Hardware Acceleration.
Wireless Baseband Processing
The 10AS057H4F34E3LG's 570K logic elements and DSP-rich fabric enable high-throughput baseband processing for 4G LTE and sub-6 GHz 5G small cells. Its 20nm process delivers the performance-per-watt needed for outdoor RRH units. Placed between RF front-end ADCs/DACs and the network interface, the dual ARM Cortex-A9 subsystem handles MAC scheduling and L2/L3 protocol stacks while the FPGA fabric accelerates FFT/iFFT, channel coding, and MIMO detection at line rate. The H4 speed grade ensures timing closure for high symbol-rate carriers.
Recommended
Military Radar and SIGINT
Arria 10 SX SoC FPGAs are widely used in phased-array radar and electronic warfare where 570K LEs deliver thousands of multiply-accumulate operations per clock. The integrated ARM Cortex-A9 subsystem runs radar control software and target-tracking algorithms while the FPGA performs beamforming, pulse compression, and Doppler processing. The 20nm process provides radiation tolerance margin for airborne platforms, and the H4 speed grade enables sample rates above 250 MHz on multiple parallel ADC channels without timing violation.
Recommended
Medical Imaging Systems
The 10AS057H4F34E3LG powers ultrasound beamformers, CT reconstruction engines, and MRI digital receivers in clinical imaging equipment. Its 570K logic elements support hundreds of parallel DSP lanes needed for real-time image reconstruction, while the dual ARM Cortex-A9 subsystem manages the user interface and DICOM network stack. The 1152-FCBGA package's high pin density accommodates hundreds of LVDS pairs for parallel ADC interfacing. Power dissipation in the 15-25W range is manageable with passive heatsinking in cart-based imaging systems.
Recommended
Broadcast Video Processing
Broadcast studios and contribution encoders deploy Arria 10 SX SoC FPGAs for 4K/UHD HEVC encoding, video stitching, and color grading. The 570K logic elements run multiple parallel HEVC encode cores at 60 fps, while the ARM Cortex-A9 subsystem handles SMPTE 2110 IP transport and PTP timing. The H4 speed grade sustains the 600 MHz fabric clock required for 4:2:2 10-bit 4K/60p processing. Latency is consistently below 100 ms end-to-end, suitable for live broadcast workflows.
Recommended
Industrial Test and Measurement
High-end oscilloscopes, protocol analyzers, and ATE testers use the 10AS057H4F34E3LG for parallel waveform capture, FFT computation, and protocol decoding. The 570K logic elements process up to 48 acquisition channels simultaneously, while the ARM subsystem runs the instrument UI and GPIB/LXI control. The 20nm process minimizes per-channel power, allowing high channel density in a single 1U instrument. The H4 speed grade sustains the 1.5 GHz DSP clock needed for real-time FFT analysis on multi-GHz input signals.
Recommended
Datacenter Hardware Acceleration
Hyperscale data centers deploy Arria 10 SX SoC FPGAs as SmartNIC accelerators for NVMe-over-Fabrics, network function virtualization, and storage compression. The 570K logic elements accelerate custom data-plane algorithms while the ARM Cortex-A9 cores run Linux control-plane software, eliminating the need for a companion processor. The dual PCIe Gen3 hard IP blocks provide 8 GTps connectivity to host CPUs. Power envelope of 25-40W fits within standard SmartNIC thermal and slot-power constraints.
Recommended
Recommended Products Summary
Engineering reference data for 10AS057H4F34E3LG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10AS057H3F34E2SG | 10AS057H3F34I2LG | 10AS057H2F34I2SG | 10AS048H4F34E3LG |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 1152-FBGA, FCBGA (35x35 mm) | 1152-FBGA (F34) - same | 1152-FBGA (F34) - same | 1152-FBGA (F34) - same | 1152-FBGA (F34) - same |
| Logic Elements | 570,000 | 570,000 | 570,000 | 570,000 | 480,000 (-16%) |
| Speed Grade | H4 | H3 | H3 | H2 | H4 (same) |
| Temperature Grade | E3 (Enhanced) | E2 | I2 (Industrial) | I2 (Industrial) | E3 (same) |
| Processor Core | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore |
| Core Voltage | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V |
| User I/O Count | 492 | 492 | 492 | 492 | 492 |
| Process Technology | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm |
Key Differentiators
- Highest logic density in Arria 10 SX F34 package (vs 10AS048H4F34E3LG)
- Fastest speed grade available for this device (vs 10AS057H2F34E2LG)
- Enhanced temperature grade for wider thermal envelope (vs 10AS057H3F34I2LG)
Design Notes
The 1152-ball FCBGA (35x35 mm) F34 package requires a high-density interconnect (HDI) PCB stack-up with laser-drilled microvias. Standard 4-layer FR-4 is not viable. Use at least an 8-layer 1-2-5-2 stack-up with 1.5 mil line/space and 0.4 mm pitch escape routing. Allocate four dedicated PCB layers for transceiver channels and two for DDR3/DDR4 matched-length routing. Reference Intel's Arria 10 SX Board Design Guidelines for the exact via-in-pad and decoupling recommendations.
Estimated: at typical DSP and transceiver loading (~70% utilization, ~25W dissipation) with the standard 35x35 FCBGA thermal pad, junction-to-ambient thermal resistance theta_JA is approximately 8 C/W with forced air at 1.5 m/s, yielding ~25C junction temperature rise above ambient. Without airflow, theta_JA rises to ~14 C/W. Use a heat spreader or heat sink with thermal interface material rated for the operating temperature range to keep Tj below 100C for industrial grade.
Do not confuse the F34 package code (1152-ball FCBGA) with other Arria 10 packages - the F34 is the largest BGA in the family and the only one that supports 570K LEs. Also verify the speed grade letter before PCB layout: H4 is the fastest, H2 is the slowest, and routing margins differ. Programming file generation in Quartus Prime is speed-grade specific; using the wrong file will cause timing violations or boot failures.
Use Intel's Early Power Estimator (EPE) spreadsheet before RTL freeze to budget power rails. The 0.9V core rail can demand 15-30A under full load with high di/dt; place at least eight 22uF ceramic capacitors plus a single 470uF polymer bulk capacitor within 25 mm of the BGA. Sequence core, transceiver, and HPS rails with a power management IC such as the LTC2977 to avoid latch-up during hot-plug events.
Compliance Information
RoHS and lead-free compliant per DigiKey listing and Intel product page. Reach statement available via Intel product compliance request. Not AEC-Q100 qualified (this is an industrial/commercial-grade FPGA SoC).
