10AS057H3F34I2LG - Arria 10 SX SoC FPGA, 570K LE, Dual ARM Cortex-A9 | Intel
MPN: 10AS057H3F34I2LG ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $3703.81 | $3,703.81 |
| 10 | $3500 | $35,000.00 |
| 100 | $3300 | $330,000.00 |
| 500 | $3150 | $1,575,000.00 |
| 1,000 | $2950 | $2,950,000.00 |
Drop-in alternatives for 10AS057H3F34I2LG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10AS057H3F34I3LG
✅ Drop-In📋 Reference alternative (not in catalog)
10AS057H3F34E2LG
✅ Drop-In✓ In Stock
$2485 / Unit
View Datasheet →10AS057H2F34I2LG
✅ Drop-In✓ In Stock
$3675 / Unit
View Datasheet →10AS057H2F34I2SG
✅ Drop-In✓ In Stock
$7100 / Unit
View Datasheet →10AS066H3F34I2LG
✅ Drop-In📋 Reference alternative (not in catalog)
10AS048H3F34I2LG
✅ Drop-In✓ In Stock
$2960 / Unit
View Datasheet →10AS048H3F34I2SG
✅ Drop-In✓ In Stock
$3450 / Unit
View Datasheet →10AS057H3F34I2LG Maximum Ratings & Electrical Characteristics
| Family | Arria 10 SX SoC FPGA |
| Logic Elements | 570 K |
| Hard Processor System | Dual ARM Cortex-A9 MPCore with CoreSight |
| HPS Maximum Core Frequency | 1.5 GHz |
| Package | 1152-ball FCBGA (F34, 35x35 mm) |
| Mounting Type | Surface Mount |
| Process Node | 20 nm |
| Operating Temperature (Industrial) | -40 C to +100 C (junction) |
| Speed Grade | I2 (mid-speed, industrial) |
| User I/O | 492 (per Heisener listing) |
| Transceivers | Up to 16.7 Gbps (per Arria 10 family) |
| Hard Memory Controllers | DDR3/DDR4 with ECC |
| RoHS Status | Compliant |
10AS057H3F34I2LG Pin Configuration
| Pin 1 | F34-B1 — Bank 1A user I/O / HPS ball (see Arria 10 SX pinout file) |
| Pin 2 | F34-B2 — Bank 1A user I/O / HPS ball |
| Pin 3 | VCC — Core/auxiliary supply ball (per bank assignment) |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10AS057H3F34I2LG is suitable for 7 applications: Industrial Motor Drive Control, 5G Remote Radio Head (RRH) Baseband, Broadcast Video Processing, Military / Aerospace Signal Intelligence, Medical Imaging Pre-Processing, ADAS Sensor Fusion Platform, Test & Measurement Instrumentation.
Industrial Motor Drive Control
The 10AS057H3F34I2LG is well-suited to industrial motor drives because the dual-core ARM Cortex-A9 HPS at 1.5 GHz can run field-oriented control loops and Modbus/EtherCAT communication stacks while the 570K-LE FPGA fabric handles high-rate PWM generation, encoder feedback sampling, and hardware safety logic. The 16.7 Gbps transceivers simplify connection to high-speed isolated gate drivers, and the FCBGA-1152 package's industrial I2 grade (-40C to +100C junction) supports harsh factory-floor environments.
Recommended
5G Remote Radio Head (RRH) Baseband
In 5G RRH applications the 10AS057H3F34I2LG delivers the FPGA fabric bandwidth needed for CPRI/eCPRI fronthaul up to 16.7 Gbps per transceiver lane, while the ARM Cortex-A9 HPS runs the O-RAN real-time scheduler and PHY management layer. The integrated DDR4 hard memory controller with ECC provides reliable buffering for IQ sample streams, and the 1152-FCBGA thermal envelope is sufficient for sealed outdoor radio unit enclosures with forced-air cooling.
Recommended
Broadcast Video Processing
The 10AS057H3F34I2LG serves broadcast video processing roles such as 12G-SDI routing, HDR/WCG conversion, and UHD frame synchronization. The 570K LE fabric handles multi-channel video scaling and deinterlacing at 4K60, while the HPS runs control plane software for IP-based control (NMOS IS-04/IS-05). The 16.7 Gbps transceivers enable SMPTE ST 2110 over 25G Ethernet, making the device a practical platform for IP broadcast studio cores.
Recommended
Military / Aerospace Signal Intelligence
Defense signal-intelligence systems leverage the 10AS057H3F34I2LG's combination of wideband transceiver capability and dual-core HPS for processing radar warning, ELINT, and COMINT streams. The industrial temperature range allows deployment in ruggedized enclosures, and the HPS runs crypto libraries while the FPGA accelerates FFT, channelization, and deinterleaving. Conformal-coated board variants built around this part are common in airborne and naval ESM systems.
Recommended
Medical Imaging Pre-Processing
In ultrasound and CT imaging front-ends the 10AS057H3F34I2LG pre-processes raw transducer data at wire-rate: beamforming, matched filtering, and harmonic separation are offloaded to the 570K-LE FPGA fabric, while the dual-core ARM Cortex-A9 handles beam-line API, image reconstruction scheduling, and DICOM metadata tagging. The FCBGA-1152 industrial-grade thermal profile supports integration inside cart-based ultrasound systems with passive heatsinks.
Recommended
ADAS Sensor Fusion Platform
Automotive ADAS domain controllers use the 10AS057H3F34I2LG to fuse data from multiple camera, radar, and lidar sensors. The FPGA fabric delivers deterministic low-latency sensor pre-processing (object detection, free-space estimation) while the ARM Cortex-A9 HPS runs AUTOSAR-compliant vehicle middleware, sensor arbitration, and Ethernet AVB/TSN stack. The 16.7 Gbps transceivers accommodate automotive Ethernet and FPD-Link III camera aggregation links.
Recommended
Test & Measurement Instrumentation
Modular T&M instruments (digitizers, protocol analyzers, oscilloscope front-ends) leverage the 10AS057H3F34I2LG's high-speed transceivers and parallel DSP fabric for real-time signal acquisition and triggering. The HPS runs the user-interface web server, SCPI command parser, and LXI stack, exposing the FPGA-accelerated measurement engine over standard interfaces. Designers benefit from Quartus Prime's DSP Builder for MATLAB/Simulink integration, accelerating waveform algorithm development.
Recommended
Recommended Products Summary
Engineering reference data for 10AS057H3F34I2LG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10AS057H3F34I3LG | 10AS057H3F34E2LG | 10AS057H2F34I2LG | 10AS066H3F34I2LG | 10AS048H3F34I2LG |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1152-FCBGA (F34, 35x35 mm) | 1152-FCBGA (F34, 35x35 mm) - same | 1152-FCBGA (F34, 35x35 mm) - same | 1152-FCBGA (F34, 35x35 mm) - same | 1152-FCBGA (F34, 35x35 mm) - same | 1152-FCBGA (F34, 35x35 mm) - same |
| Logic Elements | 570 K | 570 K | 570 K | 570 K | 660 K | 480 K |
| Speed/Temperature Grade | I2 (industrial mid-speed) | I3 (industrial fastest) | E2 (commercial) | I2 (industrial) | I2 (industrial) | I2 (industrial) |
| HPS Core | Dual ARM Cortex-A9 1.5 GHz | Dual ARM Cortex-A9 1.5 GHz | Dual ARM Cortex-A9 1.5 GHz | Dual ARM Cortex-A9 1.5 GHz | Dual ARM Cortex-A9 1.5 GHz | Dual ARM Cortex-A9 1.5 GHz |
| Operating Junction Temperature | -40 C to +100 C (industrial) | -40 C to +100 C | 0 C to +85 C (commercial) | -40 C to +100 C | -40 C to +100 C | -40 C to +100 C |
| Transceiver Data Rate | Up to 16.7 Gbps | Up to 16.7 Gbps | Up to 16.7 Gbps | Up to 16.7 Gbps | Up to 16.7 Gbps | Up to 16.7 Gbps |
| Indicative Unit Price (1 pc) | ~$3,703.81 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Highest 570K LE option within the I2 industrial grade for F34 package (vs 10AS048H3F34I2LG (480K LE))
- Better speed/temperature balance than H2 variant (vs 10AS057H2F34I2LG (H2 variant))
- Industrial temperature vs commercial-only alternative (vs 10AS057H3F34E2LG (E2 commercial grade))
Design Notes
The 1152-ball FCBGA at 35x35 mm requires via-in-pad (VIP) processing and at minimum an 8-layer PCB stackup to maintain signal integrity for the 16.7 Gbps transceivers. Use 1 oz copper on outer layers with microvia stacks from BGA breakouts to inner signal layers. Follow Intel's Arria 10 SX board design guidelines for trace length matching on DDR4 channels and reference stackup impedance targets (100 ohm differential for transceivers).
Arria 10 SX SoC FPGAs require multiple independent rails: 0.9V core (VCC, VCCP), 1.8V auxiliary (VCCPT), 1.2V/1.5V transceiver supplies (VCCR/VCCT/VCCM), and 3.3V/2.5V I/O (VCCIO). Each bank may have a different VCCIO. Power sequencing must follow Intel's Power-Up and Power-Down Sequence specification; missing this risks latch-up. Estimate: at full HPS + fabric utilization on the 570K device, total board power is typically 15-25 W depending on toggle rate.
Estimated: with a typical 20 W dissipation and a 35x35 mm FCBGA on a JEDEC 4-layer test board with natural convection, junction-to-ambient theta_JA is roughly 8-10 C/W. This yields a junction rise of ~160-200 C above ambient at full load - clearly above the 100 C industrial limit. Attach a heat spreader and integrate a heat sink with thermal interface material, or use forced-air cooling, especially inside sealed enclosures.
A common pitfall is treating the HPS as a stand-alone CPU and ignoring the FPGA-to-HPS bridge (FPGA-to-SDRAM, FPGA-to-IO). Boot the HPS from QSPI flash (e.g., N25Q256A13EF8A0F) and ensure the FPGA core image is staged to a location the HPS can hand off via the System Manager firmware. Also enable ECC on HPS DDR4 - uncorrectable single-bit errors will otherwise silently corrupt Linux user-space data.
Compliance Information
RoHS compliant per Intel/Altera material declaration. Not AEC-Q100 qualified - consult Intel automotive-grade Cyclone V or MAX 10 families for AEC-Q100 requirements. Halogen-free status not stated in the provided data.
