10CX105YF780E6G - Cyclone 10 GX FPGA, 104K LE, 780-FCBGA | Altera/Intel
Teilenummer: 10CX105YF780E6G ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $720 | $720,00 |
| 10 | $685 | $6.850,00 |
| 50 | $645 | $32.250,00 |
| 100 | $615 | $61.500,00 |
| 500 | $580 | $290.000,00 |
10CX105YF780E6G Übersicht
A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit containing programmable logic blocks, configurable interconnect, and hardened I/O and memory resources. FPGAs sit in the broader taxonomy of programmable logic devices -> programmable logic -> logic ICs -> integrated circuits -> semiconductors. The Cyclone 10 GX family uses a 20 nm TSMC fabrication process and embeds dedicated transceiver and PCIe Gen2 hard IP blocks, giving system architects a balanced trade-off between low power, mid-range density, and high-speed serial connectivity compared to ASICs and CPLDs.
Key features include 8,641,536 bits (approximately 8.5 Mb) of embedded SRAM, 156 18x19 multipliers (or DSP blocks), up to 284 user I/O pins, six 12.5 Gbps transceivers, and one PCIe Gen2 hard IP block. The device also integrates a hard memory controller, 3.0 Gbps external memory interface, configuration via fast passive parallel (FPP), and active serial (AS) modes. With a 1.0 V core voltage and 0.9 V auxiliary supply, the part is optimized for sub-1.5 W typical power consumption in industrial temperature operation.
Architecturally, the Cyclone 10 GX uses a logic-array-block (LAB)-based fabric with adaptive logic modules (ALMs) and a multi-tier routing hierarchy. Hardened transceiver PHY blocks support protocols such as PCIe Gen1/Gen2 x1/x2/x4, 10 GbE (10GBASE-R), and CPRI. The embedded hard memory controllers support DDR3, DDR3L, and LPDDR2 external memory, allowing high-throughput buffering for video, packet processing, and DSP pipelines without consuming fabric resources.
Typical applications include industrial machine vision over 10 GbE, wireless backhaul baseband preprocessing, PCIe endpoint cards, broadcast video processing, and low-cost ASIC prototyping. The combination of 12.5 Gbps transceivers, hardened PCIe, and 104K LE makes the 10CX105YF780E6G well-suited for designs where low-end Cyclone V or Spartan-6 parts lack transceivers but full Arria 10 or Kintex-7 devices are over-budget.
When designing with this device, ensure signal-integrity simulation for the 12.5 Gbps serial links, and verify PCB stackup meets Intel's transceiver routing guidelines (lossy PCB channel compliance). Power-rail decoupling should follow the Intel Cyclone 10 GX Pin Connection Guidelines for proper POR and configuration sequence.
This page synthesizes distributor pricing, drop-in same-package alternatives, comparison data against 10CX085/Cyclone V and Xilinx Artix-7 competitors, and PCB-layout design notes not collected in a single datasheet reference.
Drop-in-Alternativen für 10CX105YF780E6G – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit 10CX105YF780E6G (gleiche Bauform und Footprint) – abweichend in Transceivers, Package, Mounting Type, Speed Grade, PCIe Hard IP.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
10CX105YF780E5G
✅ Drop-In✓ Auf Lager
$350 / Stück
Datenblatt ansehen →10CX105YF780I6G
✅ Drop-In✓ Auf Lager
$1495 / Stück
Datenblatt ansehen →10CX105YF780I5G
✅ Drop-In✓ Auf Lager
$115 / Stück
Datenblatt ansehen →10CX105YU484E6G
✅ Drop-In✓ Auf Lager
$65.8 / Stück
Datenblatt ansehen →10CX105YU484I6G
✅ Drop-In✓ Auf Lager
$372 / Stück
Datenblatt ansehen →10CX105YF780E6G Grenzwerte & elektrische Eigenschaften
| Family | Cyclone 10 GX |
| Series / Model | 10CX105 |
| Logic Elements (LE) | 104,000 |
| Embedded Memory Bits | 8,641,536 (8.5 Mb) |
| DSP Blocks / 18x19 Multipliers | 156 |
| User I/O Count | 284 |
| Transceivers | 6 channels, up to 12.5 Gbps |
| PCIe Hard IP | 1 x PCIe Gen2 (x1/x2/x4) |
| LVDS SERDES | Up to 1.4 Gbps |
| External Memory Interface | DDR3/DDR3L/LPDDR2 up to 3.0 Gbps |
| Process Node | 20 nm TSMC |
| Core Voltage | 1.0 V |
| Auxiliary Voltage | 0.9 V |
| Gehäuse | 780-ball FCBGA (F780) |
| Betriebstemperatur | -40C to +100C (industrial) |
| RoHS-Status | Compliant |
| Configuration Mode | FPP and AS |
10CX105YF780E6G 780-ball fcbga (f780) Pinbelegungsleitfaden
Pinbelegung für 10CX105YF780E6G (780-ball fcbga (f780)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für 10CX105YF780E6G.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
10CX105YF780E6G ist geeignet für 7 Anwendungs: Industrial Machine Vision over 10 GbE, Wireless Backhaul Baseband Preprocessing, PCIe Endpoint Card (Gen2 x4), Broadcast Video Processing (12G-SDI / HDMI 2.0), ASIC Prototyping Platform, Industrial IoT Edge Gateway, Test & Measurement Instrumentation.
Industrial Machine Vision over 10 GbE
The 10CX105YF780E6G's six 12.5 Gbps transceivers enable a single-chip 10GBASE-R interface for high-speed industrial cameras and machine-vision frame grabbers. Its 104K LE fabric can host 4K/8K image-processing pipelines while the 8.5 Mb embedded SRAM absorbs line buffers without external memory. Unlike Spartan-6, the part supports 10G natively, eliminating an external PHY and saving roughly 3 W of board power in a vision head.
Empfohlen
Wireless Backhaul Baseband Preprocessing
In small-cell and 5G FWA backhaul units, the 10CX105YF780E6G serves as a baseband preprocessing engine with CPRI/eCPRI fronthaul links via its 12.5 Gbps transceivers. The hardened PCIe Gen2 block interfaces to a baseband SoC, while the 156 DSP blocks accelerate FFT and channel-estimation kernels. Compared to a Cyclone V SoC, this part delivers roughly 2x the DSP throughput per Watt, reducing cooling in sealed outdoor enclosures.
Empfohlen
PCIe Endpoint Card (Gen2 x4)
The 10CX105YF780E6G's integrated PCIe Gen2 hard IP block allows direct connection to a host CPU as a PCIe x1/x2/x4 endpoint without an external bridge ASIC. Designers implement DMA engines, custom drivers, and protocol accelerators in the 104K LE fabric, achieving 2 GB/5G sustained throughput over a Gen2 x4 link. The 780-FCBGA package exposes all PCIe lanes and side-band signals, simplifying PCB routing.
Empfohlen
Broadcast Video Processing (12G-SDI / HDMI 2.0)
For broadcast routers and video processing, the 10CX105YF780E6G's high-speed transceivers can drive 12G-SDI links at 11.88 Gbps for uncompressed 4K UHD transport. Its 8.5 Mb embedded SRAM holds chroma-key buffers and frame-sync FIFOs. The 156 DSP blocks accelerate scaling, blending, and overlay operations in real time. The 1.0 V core and 0.9 V aux supply keep board power under 8 W for a fully loaded 4K pipeline.
Empfohlen
ASIC Prototyping Platform
Designers use the 10CX105YF780E6G to prototype mid-complexity ASICs in a single chip, taking advantage of 104K LE plus 6 transceivers at 12.5 Gbps for fast bring-up. The hardened PCIe block and DDR3 controller remove ambiguity from prototype I/O. Compared to ASIC NRE, a single FPGA prototype at USD 580-720 list price avoids $1M+ mask costs for sub-100K-gate designs.
Empfohlen
Industrial IoT Edge Gateway
Edge gateways in industrial IoT benefit from the 10CX105YF780E6G's mix of logic density, transceivers for fieldbus (EtherCAT, PROFINET) over MII/RGMII, and hardware floating-point DSP for analytics. The PCIe block attaches to an ARM SoC over M.2 form factors, while the embedded SRAM buffers time-critical control loops. Industrial -40C to +100C operation supports outdoor DIN-rail mounting.
Empfohlen
Test & Measurement Instrumentation
In T&M equipment (logic analyzers, protocol exercisers, BERT testers), the 10CX105YF780E6G provides the transceivers and DSP for high-speed pattern generation and error injection. Its 284 user I/O and 156 multipliers support 8+ channel simultaneous acquisition at sample rates beyond 1 Gsps when paired with high-speed ADCs over LVDS. The Cyclone 10 GX architecture is well-supported by Quartus Prime for rapid instrument design cycles.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für 10CX105YF780E6G – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | 10CX105YF780E5G | 10CX105YF780I6G | 10CX105YF780I5G | 10CX105YU484E6G |
|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 780-ball FCBGA (F780) | 780-ball FCBGA (F780) - same | 780-ball FCBGA (F780) - same | 780-ball FCBGA (F780) - same | 484-ball UBGA (U484) - smaller footprint |
| Logic Elements (LE) | 104,000 | 104,000 | 104,000 | 104,000 | 104,000 |
| Speed Grade | -6 (commercial) | -5 (commercial) | -6 (industrial) | -5 (industrial) | -6 (commercial) |
| Operating Temperature | Commercial (0C to +85C) | Commercial (0C to +85C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (0C to +85C) |
| PCIe Hard IP | 1 x PCIe Gen2 | 1 x PCIe Gen2 | 1 x PCIe Gen2 | 1 x PCIe Gen2 | 1 x PCIe Gen2 |
| Embedded Memory | 8,641,536 bits | 8,641,536 bits | 8,641,536 bits | 8,641,536 bits | 8,641,536 bits |
Wichtigste Unterscheidungsmerkmale
- Highest density Cyclone 10 GX member in F780 package (vs. 10CX085YF672E5G)
- Industrial temperature option in same F780 footprint (vs. 10CX105YF780I6G)
- 780-ball FCBGA package provides 284 user I/O (vs. 10CX105YU484E6G)
- Cyclone 10 GX fabric with 12.5 Gbps transceivers at 20 nm (vs. Xilinx Artix-7 XC7A100T)
Designhinweise
The 6 transceivers in the 10CX105YF780E6G operate at up to 12.5 Gbps and require controlled-impedance routing with target differential impedance of 100 ohm +/- 10%. Use a stackup with at least 4 layers and dedicate stripline layers to high-speed serial lanes. Reference plane continuity under transceiver channels is critical; missing reference pours cause ISI and link errors at 10G.
Power-rail decoupling for the 10CX105YF780E6G follows the Intel Cyclone 10 GX Pin Connection Guidelines: place 0.1uF + 10uF ceramics on every VCC/VCCPT/VCCAUX/VCCIO ball, with vias connecting to a continuous ground plane. Power-on reset (POR) sequencing requires VCCIO, VCCPT, and VCC to ramp together within 100 ms; out-of-sequence ramp triggers configuration failure.
The 780-ball FCBGA package has 1.0 mm ball pitch and requires microvia or stacked-via PCB fabrication for breakout routing. Fanout should use a dog-bone or via-in-pad pattern with the manufacturer-recommended 0.4 mm via diameter. Reserve top and bottom layers for high-speed routing while inner stripline layers carry slow control and user I/O.
Common mistakes when designing with the 10CX105YF780E6G: (1) omitting the JTAG pull-up resistors on TCK/TMS/TDO; (2) using 1.8V VCCIO with 3.3V configuration memory - check EPCQ memory VCC rail; (3) ignoring MSL3 moisture sensitivity requires bake before reflow if the package has been exposed for more than 168 hours; (4) mixing E6 (commercial) and I6 (industrial) parts across a board causes timing variation. Always confirm device variant before PCB assembly.
Estimated: at maximum junction temperature 100C, with a typical 0.9 W quiescent and 6 transceivers at 12.5 Gbps carrying traffic, total power is approximately 4-5 W for the FCBGA package. The 780-FCBGA thermal resistance theta_JC is roughly 0.4 C/W when the die is bonded to the substrate, but overall board cooling requires at least 6 cm^2 of copper pour or a heatsink for sealed enclosures.
Compliance-Informationen
RoHS and REACH compliance per Altera/Intel product page. AEC-Q100 not applicable for this commercial-grade FPGA; choose industrial (I6/I5) variants for harsh environments.
