5CSEBA2U23C8N - Cyclone V SE SoC FPGA 25K LE Dual A9 | Altera
Teilenummer: 5CSEBA2U23C8N ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $75.91 | $75,91 |
| 10 | $70.5 | $705,00 |
| 100 | $65.2 | $6.520,00 |
| 500 | $60 | $30.000,00 |
| 1.000 | $55.5 | $55.500,00 |
5CSEBA2U23C8N Übersicht
An SoC FPGA is a device class that combines a programmable FPGA fabric with one or more hard processor cores on a single die, enabling hardware/software co-design for performance-critical embedded systems. In the broader taxonomy, an SoC FPGA belongs to the field-programmable logic family, which sits under programmable logic devices and ultimately under digital integrated circuits. The 5CSEBA2U23C8N is positioned within the Cyclone V family for cost- and power-sensitive applications.
Key features include 188 general-purpose I/O pins, integrated high-speed transceivers for serial connectivity, variable-precision digital signal processing (DSP) blocks, and the dual ARM Cortex-A9 cores with CoreSight debug. The Cyclone V SE family is built on a low-power process technology, delivering a balance of functionality, flexibility, and power efficiency for high-volume applications.
Architecturally, the device combines a robust FPGA fabric with a hardened application processor subsystem, eliminating the need for a discrete companion processor in many embedded designs. The Cortex-A9 cores support symmetric multiprocessing, NEON media processing, and floating-point unit extensions, while the FPGA fabric provides custom accelerators and glue logic at hardware speed.
Typical applications include industrial motor control, video surveillance and processing, factory automation controllers, automotive driver assistance platforms, software-defined radio, and machine vision systems. The integration of ARM cores with programmable logic enables deterministic real-time response alongside rich operating system support.
When designing with the 5CSEBA2U23C8N, consider power sequencing requirements for the multi-rail SoC supply, thermal dissipation across the large 23x23 mm package, and PCB layout for high-speed transceiver channels. Quartus Prime or Platform Designer is required for HDL and HPS configuration.
This page synthesizes distributor pricing tiers, verified drop-in alternatives from the same Cyclone V SE family, parameter comparison tables, and PCB design notes that complement - not duplicate - the official Altera/Intel Cyclone V datasheet.
Drop-in-Alternativen für 5CSEBA2U23C8N – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit 5CSEBA2U23C8N (gleiche Bauform und Footprint) – abweichend in Package, Process Technology, HPS Maximum Frequency, Logic Elements, Speed Grade.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
5CSEBA2U23C7SN
✅ Drop-In✓ Auf Lager
$13.73 / Stück
Datenblatt ansehen →5CSEBA2U23C7N
✅ Drop-In✓ Auf Lager
$76.9 / Stück
Datenblatt ansehen →5CSEBA2U23C6N
✅ Drop-In✓ Auf Lager
$88.4 / Stück
Datenblatt ansehen →5CSEBA2U23A7N
✅ Drop-In✓ Auf Lager
$99.5 / Stück
Datenblatt ansehen →5CSEBA2U23C8N Grenzwerte & elektrische Eigenschaften
| Family | Cyclone V SE SoC FPGA |
| Logic Elements | 25,000 |
| Hard Processor Core | Dual ARM Cortex-A9 MPCore with CoreSight |
| Maximum User I/O | 188 |
| Gehäuse | 672-UBGA (23x23 mm) |
| Core Voltage | 1.1 V |
| Speed Grade | 8 |
| Process Technology | Low-power TSMC process |
| DSP Blocks | Variable-precision DSP |
| Memory Interfaces | DDR2/DDR3/LPDDR2 support |
| Transceivers | Integrated high-speed transceivers |
| Montageart | Surface Mount (BGA) |
| RoHS-Status | Compliant |
| Lead-Free | Yes |
5CSEBA2U23C8N 672-ubga (23x23 mm) Pinbelegungsleitfaden
Pinbelegung für 5CSEBA2U23C8N (672-ubga (23x23 mm)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für 5CSEBA2U23C8N.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
5CSEBA2U23C8N ist geeignet für 7 Anwendungs: Industrial Motor Control, Video Surveillance and Machine Vision, Automotive Driver Assistance (ADAS), Software Defined Radio (SDR), Factory Automation and PLC Controllers, Medical Imaging and Diagnostic Equipment, Communications and Networking Edge.
Industrial Motor Control
The 5CSEBA2U23C8N fits industrial motor control by combining 25K logic elements with a dual ARM Cortex-A9 hard processor running real-time control loops at deterministic latencies. The FPGA fabric accelerates current-loop PWM generation and encoder decoding in hardware, while the Cortex-A9 cores run higher-level motion profiling and fieldbus protocols such as EtherCAT or PROFINET. The 672-UBGA package offers 188 user I/O, ample for multi-axis drive signal routing and isolation interfaces. Variable-precision DSP blocks accelerate Park/Clarke transforms and SVPWM modulation. Compared with discrete MCU + CPLD architectures, this SoC integration reduces board area, BOM cost, and improves loop bandwidth.
Empfohlen
Video Surveillance and Machine Vision
The 5CSEBA2U23C8N suits video surveillance because its FPGA fabric implements parallel pixel pipelines for image preprocessing (debayer, noise reduction, edge detection) while the dual Cortex-A9 cores run Linux-based analytics and network streaming. With 188 user I/O, multiple MIPI or parallel camera interfaces can be aggregated. The integrated transceivers support gigabit Ethernet for streaming compressed video. Variable-precision DSP blocks accelerate convolutional kernels for on-device inference. The U23 package's thermal envelope (23x23 mm) provides sufficient copper area for sustained vision workloads without active cooling in enclosed housings.
Empfohlen
Automotive Driver Assistance (ADAS)
The 5CSEBA2U23C8N is selected for ADAS prototyping where dual ARM Cortex-A9 cores handle sensor fusion from radar/camera inputs while the FPGA fabric preprocesses raw sensor streams at line rate. The 672-UBGA U23 footprint supports PCB layouts with controlled-impedance routing for high-speed transceivers. Note that AEC-Q100 automotive-grade Cyclone V variants are recommended for production vehicles; the 5CSEBA2U23C8N is suitable for engineering validation and development. The 25K LE fabric is well-matched to mid-tier ADAS functions such as lane departure warning and forward-collision warning pre-screens.
Empfohlen
Software Defined Radio (SDR)
The 5CSEBA2U23C8N supports SDR platforms by hosting DDC/DUC (digital up/down conversion) and channelization filters in the FPGA fabric while the dual Cortex-A9 cores run waveform stacks (LTE, TETRA, custom waveforms) on Linux. The integrated high-speed transceivers connect directly to RF ADC/DAC front-ends such as the AD9361 family. Variable-precision DSP blocks enable cost-efficient wideband FFT and channelization. The 188 user I/O supports multi-band antenna switching and reference clock distribution. This is the same architecture Altera documented in their Cyclone V SoC SDR reference design.
Empfohlen
Factory Automation and PLC Controllers
The 5CSEBA2U23C8N enables compact PLC controllers where the FPGA fabric implements deterministic IEC 61131-3 logic, encoder counters, and high-speed pulse-train outputs, while the dual Cortex-A9 cores execute an industrial-grade OS for HMI, recipe management, and fieldbus communication (EtherCAT, PROFINET, Modbus TCP). With 188 user I/O and integrated transceivers, a single device replaces discrete MCU + FPGA designs, shrinking PCB footprint. The U23 package's thermal headroom supports fanless DIN-rail mounting. According to the Cyclone V SoC datasheet, the HPS subsystem supports both Linux and real-time operating systems via SMP/AMP configurations.
Empfohlen
Medical Imaging and Diagnostic Equipment
The 5CSEBA2U23C8N is applicable to medical imaging subsystems such as ultrasound front-ends and endoscopy processors. The FPGA fabric performs beamforming, envelope detection, and image reconstruction in hardware at deterministic latency, while the dual ARM Cortex-A9 cores manage user interface, DICOM networking, and storage. The 188 user I/O supports multi-channel transducer arrays. Variable-precision DSP blocks accelerate FFT-based Doppler processing. Note that medical devices require IEC 60601-1 system-level certification; the SoC FPGA itself is not pre-certified but provides the deterministic performance needed for safety-critical signal chains.
Empfohlen
Communications and Networking Edge
The 5CSEBA2U23C8N targets small-cell and industrial gateway edge nodes where the dual Cortex-A9 cores run networking stacks (TCP/IP, IPSec, QUIC) and the FPGA fabric accelerates packet classification, encryption offload, and traffic shaping. Integrated high-speed transceivers connect directly to SFP+ cages for 1G/10G uplinks. The 25K logic element fabric is sufficient for moderate-complexity forwarding pipelines and protocol conversion. Compared with discrete NPU + FPGA designs, the integrated SoC lowers BOM cost and simplifies PCB routing of high-speed serial links in space-constrained edge enclosures.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für 5CSEBA2U23C8N – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | 5CSEBA2U23C7SN | 5CSEBA2U23C7N | 5CSEBA2U23C6N | 5CSEBA2U23A7N |
|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 672-UBGA (23x23 mm) | 672-UBGA (23x23 mm) - same | 672-UBGA (23x23 mm) - same | 672-UBGA (23x23 mm) - same | 672-UBGA (23x23 mm) - same |
| Logic Elements | 25,000 | 25,000 | 25,000 | 25,000 | 25,000 |
| Hard Processor Core | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 |
| Speed Grade | 8 | 7 (faster) | 7 (faster) | 6 (fastest) | 7 (A low-power variant) |
| Maximum User I/O | 188 | 188 | 188 | 188 | 188 |
| Family Variant | Cyclone V SE (standard) | Cyclone V SE | Cyclone V SE | Cyclone V SE | Cyclone V SE 'A' low-power |
Wichtigste Unterscheidungsmerkmale
- Speed grade 8 offers lowest-cost entry to Cyclone V SE 25K family (vs. 5CSEBA2U23C7N)
- Industrial-grade temperature range suits harsh environments (vs. 5CSEBA2U19C8N)
- Dual Cortex-A9 + 25K LE on a single die eliminates companion processor (vs. Discrete MCU + Cyclone V E FPGA)
Designhinweise
The 5CSEBA2U23C8N requires multiple power rails: 1.1 V core (VCC), 2.5 V/3.3 V auxiliary (VCCAUX/VCCA_FPLL), and HPS-specific rails (1.1 V, 1.5 V, 3.3 V). Per the Cyclone V Device Overview datasheet, the device supports power sequencing with POR delays. Designers must implement a sequencing controller (e.g., an LDO supervisor or dedicated sequencer IC) to ensure HPS rails ramp in the correct order - failure to sequence correctly can latch the HPS into a non-recoverable state. Decoupling: place 0.1 uF and 10 uF ceramic capacitors within 100 mils of every power pin.
The 23x23 mm 672-UBGA package has a typical theta-JA in the range of 12-15 C/W with a standard 4-layer JEDEC PCB. Estimated: with the HPS subsystem and FPGA fabric fully utilized, total power consumption can reach 5-8 W, producing a junction temperature rise of 60-120 C above ambient. For sealed industrial enclosures, use a thermal pad or copper-in-pour heatsink bonded to the package top to keep Tj below 100 C. Always run the Quartus Prime PowerPlay Power Analyzer with realistic toggle rates for an accurate thermal budget.
The 672-UBGA U23 package uses a 1.0 mm ball pitch - design rules require 0.4 mm drill via-in-pad or microvia escape for breakout. Use a 4-6 layer stackup with continuous ground planes below the BGA to provide a low-impedance return path for high-speed transceivers. Length-match all DDR3/LPDDR2 data and strobe traces within 25 mils per the Cyclone V External Memory Interface Handbook. Place clock generators and reference resistors within 1 inch of their respective pins; isolate them from noisy switching rails.
Differential pairs (LVDS, transceiver channels) must be routed with 100 ohm differential impedance and matched within 5 mils of intra-pair length and 100 mils of inter-pair length. Use ground-signal-ground coplanar routing where possible. Keep high-speed serializer/deserializer traces on the top layer directly above an unbroken reference plane - never route over plane splits. The HPS subsystem pins are concentrated on one side of the BGA (typically the outer rows); group these traces to a dedicated HPS connector or DDR interface.
Do not power the HPS subsystem before the FPGA fabric is fully configured - this causes HPS boot failures. Always program the FPGA fabric via JTAG or AS mode before releasing HPS reset. Configuration: choose between Active Serial (AS) mode for standalone boot (requires an EPCQ flash), JTAG for development, or FPP mode for high-speed parallel flash. The JTAG chain must include the HPS TAP as well as the FPGA TAP; connect TRST and TMS with proper pull-ups per the Cyclone V Handbook.
Compliance-Informationen
RoHS and REACH compliant per Altera/Intel Cyclone V product family documentation. Lead-free BGA balls. Not AEC-Q100 qualified; for automotive production, refer to AEC-Q100-qualified Cyclone V automotive variants. Halogen-free status not stated in the provided data.