5CSEBA5U23C8SN - Cyclone V SE SoC FPGA, 85K LE, ARM Cortex-A9
MPN: 5CSEBA5U23C8SN ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $268.5 | $2,685.00 |
| 100 | $245 | $24,500.00 |
| 500 | $222 | $111,000.00 |
| 1,000 | $198.5 | $198,500.00 |
Drop-in alternatives for 5CSEBA5U23C8SN — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
5CSEBA5U23C8N
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View Datasheet →5CSEBA5U23C7SN
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View Datasheet →5CSEBA5U19C8SN
✅ Drop-In ⚠️ 参数待验证✓ In Stock
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View Datasheet →5CSEBA5U23C8SN Maximum Ratings & Electrical Characteristics
| Family | Cyclone V SE SoC FPGA |
| Logic Elements | 85K |
| Hard Processor Core | Single ARM Cortex-A9 MPCore with CoreSight |
| Processor Frequency | 600 MHz |
| Process Technology | 28 nm low-power |
| Core Voltage (typical) | 1.1 V |
| Package | 672-UBGA (23x23 mm) |
| Terminal Count | 672 (FBGA / BGA) |
| Terminal Form | Ball |
| Mounting Type | Surface Mount |
| Operating Temperature Grade | Industrial |
| Memory | M10K embedded memory blocks |
| DSP Blocks | Variable-precision DSP blocks |
| Peripherals | USB, Ethernet MAC, UART, SPI, I2C, GPIO |
| RoHS Status | Compliant |
| Lifecycle Status | Active (legacy Altera part, supported by Intel) |
5CSEBA5U23C8SN 672-ubga (23x23 mm) Pin Configuration Guide
Complete pinout information for 5CSEBA5U23C8SN (672-ubga (23x23 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 5CSEBA5U23C8SN.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
5CSEBA5U23C8SN is suitable for 7 applications: Industrial Motor Control, Machine Vision Edge Devices, Factory Automation Gateways, Human-Machine Interface (HMI) Panels, Video Surveillance Edge Nodes, Automotive Infotainment / Driver-Assistance Subsystems, Embedded Vision & Custom Protocol Bridging.
Industrial Motor Control
The 5CSEBA5U23C8SN is a strong fit for multi-axis industrial motor drives because its ARM Cortex-A9 HPS runs the FOC algorithm and industrial Ethernet stacks (EtherCAT, PROFINET, Modbus TCP), while the 85K-LE FPGA fabric handles deterministic PWM generation, encoder quadrature capture, and current-sense ADC interfacing. Using an SoC FPGA eliminates the need for a separate DSP or MCU, reducing BOM count and latency. The 672-UBGA package provides ample GPIO and LVDS pairs for parallel current-sensor and resolver sampling. Designers should allocate at least 20% of LE for safety logic (STO, SBC) when targeting IEC 61800 safety functions.
Recommended
Machine Vision Edge Devices
In industrial machine vision systems, the 5CSEBA5U23C8SN's HPS runs Linux plus OpenCV-class pre-processing, while the FPGA fabric accelerates pixel pipelines (debayer, color correction, threshold, morphology) at line rate. The 85K logic elements comfortably fit 720p60 vision pipelines, and the 672-UBGA exposes enough LVDS pairs for direct MIPI-CSI or parallel-camera interfaces. SoC integration simplifies BOM by combining CPU, GPU-free image pre-processing, and timing-critical trigger logic. Plan ~15-25% of fabric for image-line buffers using M10K blocks.
Recommended
Factory Automation Gateways
For industrial IoT gateways, the 5CSEBA5U23C8SN's Cortex-A9 HPS runs containerized Linux (Docker / balenaOS) and MQTT/OPC-UA stacks, while the FPGA fabric terminates fieldbuses (RS-485, CAN-FD, IO-Link) and runs deterministic pre-processing. Its 600 MHz HPS performance is sufficient for edge analytics, and the 28 nm low-power process keeps the SoC FPGA below typical 5-8 W envelope at full utilization. The 672-ball package exposes 8/16-bit EMIF for DDR3, supporting the memory needed for time-series buffering at the edge.
Recommended
Human-Machine Interface (HMI) Panels
In industrial HMI panels, the 5CSEBA5U23C8SN runs a Qt/HTML5 graphics stack on Linux from the HPS, while the FPGA fabric drives the TFT LCD controller, touch-screen I2C bridge, and backlight PWM. With 85K logic elements, designers can implement 2D acceleration, alpha blending, and multi-layer composition without an external GPU. The industrial temperature grade makes the part suitable for cabinet-mounted panels. Use the HPS Ethernet MAC for plant-network connectivity, and the FPGA fabric to bridge legacy parallel keypads or CANopen peripherals.
Recommended
Video Surveillance Edge Nodes
The 5CSEBA5U23C8SN suits edge video analytics: the HPS runs ONNX-based inference engines (e.g. TFLite, OpenVINO for ARM) for person/vehicle detection, while the FPGA fabric performs video decoding, motion detection, and privacy masking in real time. The 85K LE budget is sufficient for H.264 pre-processing plus a small custom CNN accelerator. Use the integrated EMAC for IP-camera RTSP ingest, and the FPGA fabric for SD-card or NVMe buffering. Industrial-grade screening supports outdoor cabinet deployment.
Recommended
Automotive Infotainment / Driver-Assistance Subsystems
Although the 5CSEBA5U23C8SN is the industrial-grade variant, the same silicon family is used in automotive-qualified Cyclone V SE SoCs for infotainment head units, digital instrument clusters, and surround-view driver-assistance (ADAS) subsystems. The ARM Cortex-A9 HPS runs QNX / Android Automotive / Linux, while the FPGA fabric handles LVDS camera aggregation, surround-view stitching assist, and graphics composition. The 672-UBGA package supports the pin density required for 4-6 camera inputs plus display outputs. Automotive projects should source the -A temperature grade from the same part family.
Recommended
Embedded Vision & Custom Protocol Bridging
The 5CSEBA5U23C8SN is widely used as a protocol-bridging SoC: the HPS runs standard networking (TCP/IP, MQTT, gRPC) while the FPGA fabric implements proprietary or legacy protocols (I2S, SPI, custom LVDS, serial FPGAs links). This dual role avoids the cost of two discrete chips and reduces inter-IC latency to tens of nanoseconds. The 85K LE support medium-complexity bridges with room for diagnostic logic. Designers can also use the FPGA fabric as a hardware accelerator for AES / SHA in security-sensitive bridges.
Recommended
Recommended Products Summary
Engineering reference data for 5CSEBA5U23C8SN — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 5CSEBA5U23C8N | 5CSEBA5U23C7SN | 5CSEBA5U23C7N | 5CSEBA5U23C6N | 5CSEBA5U19C8SN |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 672-UBGA (U23, 23x23 mm) | 672-UBGA (U23, 23x23 mm) - same | 672-UBGA (U23, 23x23 mm) - same | 672-UBGA (U23, 23x23 mm) - same | 672-UBGA (U23, 23x23 mm) - same | 672-UBGA (U19, 19x19 mm) - different |
| Logic Elements | 85K | 85K | 85K | 85K | 85K | 85K |
| HPS Core | Single ARM Cortex-A9 @ 600 MHz | Single ARM Cortex-A9 @ 600 MHz | Single ARM Cortex-A9 @ 600 MHz | Single ARM Cortex-A9 @ 600 MHz | Single ARM Cortex-A9 @ 600 MHz | Single ARM Cortex-A9 @ 600 MHz |
| Speed Grade | 8 | 8 | 7 | 7 | 6 | 8 |
| Operating-Condition Code | SN (industrial) | N | SN (industrial) | N | N | SN (industrial) |
| Process | 28 nm low-power | 28 nm low-power | 28 nm low-power | 28 nm low-power | 28 nm low-power | 28 nm low-power |
| Pin-to-Pin Drop-In | Reference | Yes (same U23 footprint) | Yes (same U23 footprint) | Yes (same U23 footprint) | Yes (same U23 footprint) | No (U19 footprint, mechanical check required) |
| Approx. Unit Price (USD, qty 1) | 285.00 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Speed-grade-8 timing margin headroom (vs 5CSEBA5U23C7SN)
- Operating-condition SN (industrial) qualification (vs 5CSEBA5U23C8N)
- Largest 672-BGA in the SE 85K-LE lineup (vs 5CSEBA5U19C8SN)
Design Notes
Estimated: at 1.1 V core and 85K-LE utilization ~70%, the 5CSEBA5U23C8SN typically draws 1.5-3 W from the FPGA core plus 1-2 W from the Cortex-A9 HPS under load, with peaks to 5-6 W. Design a 4-layer PCB with dedicated power planes, decouple each VCCINT/VCCPD/HPS rail with 10 uF bulk + 100 nF high-frequency ceramic placed within 5 mm of the balls, and consider a load-switch or sequencer for the HPS cold-boot path.
Estimated: the 672-UBGA (23x23 mm) package has theta_JA around 12-15 C/W with a 4-layer JEDEC test board. With 4-5 W typical dissipation, junction-to-ambient rise is 48-75 C, requiring industrial-grade ambient derating above ~50 C. Use thermal vias in the BGA land pattern and a copper spreader on the top-side inner row to keep junction temperature under 100 C in industrial cabinets.
Route all HPS peripheral traces (USB, EMAC, RGMII, DDR3) with 100 ohm differential impedance, keep DDR3 reference-plane unbroken under the BGA, and escape the inner balls using laser-drilled microvias (0.1 mm pitch). Use a 1.0 mm BGA pitch escape with dog-bone fanout for the outer two rows and via-in-pad only if the assembly house supports it. Plan for at least 8 layers (top, GND, signal, signal, power, signal, signal, bottom) on industrial layouts.
Do not assume the HPS can boot from raw NAND without configuring the Boot Select pins - the 5CSEBA5U23C8SN requires BSEL[2:0] strap resistors to choose between SD/MMC, QSPI, or NAND sources. Confirm Quartus Prime and SoC EDS toolchain version compatibility (17.1 or later recommended) before starting the design; older versions may lack device support. Also note that programming files generated for speed-grade 8 do not run on speed-grade 7 devices - regenerate the SOF/JIC for the new speed grade.
Compliance Information
RoHS and REACH compliance are stated on the Intel/Altera Cyclone V product pages. The 5CSEBA5U23C8SN is the industrial-grade variant, not AEC-Q100 qualified — for automotive projects select the -A temperature grade device from the same silicon family. Halogen-free status not explicitly listed; treat as unknown unless confirmed on the lot certificate.
