5CSXFC4C6U23I7N - Cyclone V SX SoC FPGA, 40K LE, 672-UBGA | Intel
MPN: 5CSXFC4C6U23I7N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $269 | $2,690.00 |
| 100 | $245 | $24,500.00 |
| 500 | $219 | $109,500.00 |
| 1,000 | $195 | $195,000.00 |
Drop-in alternatives for 5CSXFC4C6U23I7N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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View Datasheet →5CSXFC4C6U23I7N Maximum Ratings & Electrical Characteristics
| Family | Cyclone V SX |
| Architecture | SoC FPGA (ARM Cortex-A9 + FPGA fabric) |
| Logic Elements | 40,000 |
| Logic Cells | 85,000 |
| Processor | Dual ARM Cortex-A9 MPCore with CoreSight |
| Processor Max Frequency | 800 MHz |
| Process Technology | 28 nm low-power (TSMC) |
| Core Supply Voltage | 1.1 V |
| User I/O Count | 224 |
| Package | 672-UBGA (23x23 mm) |
| Mounting Type | Surface Mount |
| Operating Temperature | -40C to +100C (Industrial) |
| RoHS Status | Compliant |
| Hard Processor System (HPS) | Integrated dual-core ARM Cortex-A9 |
| Transceivers | Not present (SX variant) |
5CSXFC4C6U23I7N 672-ubga (23x23 mm) Pin Configuration Guide
Complete pinout information for 5CSXFC4C6U23I7N (672-ubga (23x23 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 5CSXFC4C6U23I7N.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
5CSXFC4C6U23I7N is suitable for 7 applications: Industrial Motor Control Drives, Machine Vision and Video Surveillance, Software-Defined Radio Baseband, Portable Medical Imaging, Factory Automation Controllers, Avionics and Aerospace Embedded Computing, Broadcast and Pro-AV Equipment.
Industrial Motor Control Drives
The 5CSXFC4C6U23I7N excels in industrial motor control drives where its FPGA fabric implements high-speed current and torque control loops - PWM generation, encoder decoding, and oversampled ADC interfacing - while the dual ARM Cortex-A9 cores at 800 MHz run field-oriented control (FOC) software. The 28 nm low-power process keeps thermal dissipation manageable in sealed IP65 enclosures, and the industrial -40C to +100C operating range handles factory floor ambient swings. With 224 user I/O, the device drives multi-axis servo systems from a single chip, replacing the legacy architecture of separate DSP + MCU + FPGA. Quartus Prime and SoC EDS toolchains support the HPS-FPGA split for deterministic real-time motor control.
Recommended
Machine Vision and Video Surveillance
The 5CSXFC4C6U23I7N is well suited for machine vision and IP video surveillance applications where the FPGA fabric handles pixel-rate preprocessing (noise reduction, lens distortion correction, edge detection) while the dual ARM Cortex-A9 cores run analytics algorithms (motion detection, person recognition, video encoding). The HPS DDR3 controller with bandwidth shared via coherent bridges allows the FPGA fabric to write processed frames directly to system memory without DMA overhead. The 672-ball UBGA provides high I/O count for parallel image sensor interfaces and HDMI/MIPI bridge connections. Power efficiency from the 28 nm process enables fanless embedded camera designs.
Recommended
Software-Defined Radio Baseband
The 5CSXFC4C6U23I7N enables software-defined radio baseband designs where the FPGA fabric executes signal processing kernels (FFT, channelization, demodulation) at sample rates up to hundreds of MHz, while the dual ARM Cortex-A9 cores run the MAC layer and protocol stack. The hard memory controller and DDR3 interface provide the memory bandwidth required for sample buffering. Note that the SX variant excludes transceivers - external ADC/DAC with parallel LVDS connects to FPGA I/O. The industrial temperature range and low-power 28 nm process suit outdoor base station deployments.
Recommended
Portable Medical Imaging
The 5CSXFC4C6U23I7N fits portable medical imaging systems (point-of-care ultrasound, handheld endoscopy) where low power consumption and dual-core processing are essential. The FPGA fabric implements beamforming and digital signal conditioning for ultrasound transducers at low latency, while the ARM Cortex-A9 cores drive the user interface and DICOM network stack. The 1.1 V core supply voltage draws minimal current from battery packs, and the SoC integration eliminates a separate processor chip to meet size and BOM constraints for handheld medical devices.
Recommended
Factory Automation Controllers
The 5CSXFC4C6U23I7N serves as the central controller in factory automation systems where it interfaces with industrial Ethernet protocols (PROFINET, EtherCAT, EtherNet/IP) through the FPGA fabric while running real-time control logic on the ARM Cortex-A9 cores. The 224 user I/O accommodate digital and analog field device connections, and the hardened peripheral set (USB 2.0 OTG, EMAC, UART, SPI, I2C, CAN) simplifies integration with motor drives, sensors, and HMIs. Industrial -40C to +100C operation tolerates cabinet temperatures.
Recommended
Avionics and Aerospace Embedded Computing
The 5CSXFC4C6U23I7N supports avionics and aerospace embedded computing roles requiring ARINC 429, MIL-STD-1553, or custom avionics bus interfaces implemented in the FPGA fabric alongside ARM Cortex-A9 software processing. The industrial temperature grade and radiation-tolerant packaging options suit unmanned aerial vehicle (UAV) flight controllers, where size, weight, and power (SWaP) constraints favor SoC integration over separate FPGA + processor boards. The hardened HPS runs flight control software deterministically while the FPGA handles sensor fusion at high sample rates.
Recommended
Broadcast and Pro-AV Equipment
The 5CSXFC4C6U23I7N enables broadcast video routers, professional audio mixers, and pro-AV signal processors where the FPGA fabric handles multi-format video scaling, color space conversion, and audio embedding at line rates, while the ARM Cortex-A9 cores manage IP-based control protocols (Dante, AVB, NMOS). The dual-core HPS supports Linux for network management and a real-time OS for deterministic audio/video processing. The 672-UBGA package supports the high I/O count required for multi-channel broadcast equipment.
Recommended
Recommended Products Summary
Engineering reference data for 5CSXFC4C6U23I7N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 5CSXFC4C6U23I7LN | 5CSXFC4C6U23C8N | 5CSXFC4C6U23C7N | 5CSXFC2C6U23I7N | 5CSXFC6C6U23A7N | 5CSEBA6U23I7N |
|---|---|---|---|---|---|---|---|
| Package | 672-UBGA (U23, 23x23 mm) | 672-UBGA (U23, 23x23 mm) | 672-UBGA (U23, 23x23 mm) | 672-UBGA (U23, 23x23 mm) | 672-UBGA (U23, 23x23 mm) | 672-UBGA (U23, 23x23 mm) | 672-UBGA (U23, 23x23 mm) |
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Family | Cyclone V SX | Cyclone V SX | Cyclone V SX | Cyclone V SX | Cyclone V SX | Cyclone V SX | Cyclone V SE |
| Logic Elements | 40,000 | 40,000 | 40,000 | 40,000 | 25,000 | 110,000 | 110,000 |
| Processor | Dual ARM Cortex-A9 @ 800 MHz | Dual ARM Cortex-A9 @ 800 MHz | Dual ARM Cortex-A9 @ 800 MHz (C8 speed) | Dual ARM Cortex-A9 @ 800 MHz (C7 speed) | Dual ARM Cortex-A9 @ 800 MHz | Dual ARM Cortex-A9 @ 800 MHz | Single ARM Cortex-A9 @ 925 MHz |
| Logic Cells | 85,000 | 85,000 | 85,000 | 85,000 | [DATA_NEEDED] | 110,000 | [DATA_NEEDED] |
| Operating Temperature | -40C to +100C (Industrial) | -40C to +100C (Industrial, lead-free) | 0C to 85C (Commercial, C8 speed) | 0C to 85C (Commercial, C7 speed) | -40C to +100C (Industrial) | -40C to +125C (Automotive) | -40C to +100C (Industrial) |
| Core Voltage | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V |
| User I/O | 224 | 224 | 224 | 224 | 224 | 224 | 224 |
Key Differentiators
- Same 672-UBGA U23 footprint as higher-density C6 variant (vs 5CSXFC6C6U23A7N)
- Industrial temperature grade at C7/C8 speed (vs 5CSXFC4C6U23C7N)
- Dual-core ARM Cortex-A9 vs Cyclone V SE single-core (vs 5CSEBA6U23I7N)
Design Notes
The 5CSXFC4C6U23I7N requires multiple supply rails: 0.9 V for HPS cores, 1.1 V for FPGA core, 1.5 V/1.8 V/2.5 V/3.3 V for I/O banks, plus a 2.5 V analog supply for PLLs. Per Intel's Cyclone V SX power management user guide, use a dedicated sequencer such as the LTC2974 or equivalent to enforce safe power-up/power-down ordering - failure to do so can cause latch-up. Decoupling requires at least 100 nF X7R per power pin plus bulk 22 uF tantalums per rail.
At typical utilization (60% logic + dual-core HPS active), power dissipation is approximately 3-5 W depending on toggle rate. The 672-UBGA package has theta_JA around 12 C/W on a 4-layer 1 oz PCB with adequate thermal vias. For sealed enclosures without forced airflow, attach a small heatsink (e.g., 15x15 mm) directly to the package top. Confirm the junction temperature stays below 100C using Quartus Prime's PowerPlay thermal analysis.
Use Intel's U23 package ball map and follow the recommended footprint in the Cyclone V device datasheet. The UBGA balls are 1.0 mm pitch - route with 8 mil traces and breakout vias at the ball periphery. Route DDR3 signals with matched lengths (CLK to DQS within 50 ps) and use 100 ohm differential impedance for the HPS RGMII interface. Place 0.1 uF decoupling capacitors on the BOTTOM side directly under their respective power balls to minimize loop inductance.
Do not confuse the SX variant (no transceivers) with the ST variant (3.125 Gbps transceivers) - the pinout is different. The SX package is U23; ST parts use a different package. Always verify the device family code in the OPN: SX = SoC without transceivers, ST = SoC with transceivers. Boot mode selection via MSEL pins must match the desired boot source (QSPI, SD, NAND, JTAG); wrong MSEL settings result in no-boot symptoms. Use the SoC EDS tool to validate HPS-FPGA bridge configurations before generating the preloader.
For high-speed LVDS interfaces (e.g., external ADC connections on FPGA I/O banks), maintain 100 ohm differential impedance and use length matching within 10 ps. Place LVDS pairs on the same column of UBGA balls to minimize skew. The HPS RGMII to external Ethernet PHY must also use length-matched routing; the HPS provides dedicated RGMII pins but does NOT have internal skew compensation, so external trace tuning is mandatory.
Compliance Information
RoHS compliant per Intel product page. The standard 5CSXFC4C6U23I7N is industrial grade; the Q1-suffixed automotive variant is not listed for this exact OPN, but the related 5CSXFC6C6U23A7N is AEC-Q100 qualified.
