A3P600-2FGG144I - ProASIC3 600K-Gate FPGA 144-FBGA | Microchip
MPN: A3P600-2FGG144I ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $68.5 | $68.50 |
| 10 | $62.1 | $621.00 |
| 100 | $55.8 | $5,580.00 |
| 500 | $49.9 | $24,950.00 |
| 1,000 | $44.6 | $44,600.00 |
A3P600-2FGG144I Overview
A flash-based FPGA is a field-programmable gate array whose configuration is stored in on-chip non-volatile flash cells rather than an external configuration ROM. Within the programmable-logic hierarchy (semiconductor -> programmable logic device -> FPGA -> flash FPGA), this architecture gives the ProASIC3 family single-chip, instant-on behavior and inherent security advantages over SRAM FPGAs, which must load their bitstream at every power-up.
Key features of the A3P600-2FGG144I include 600,000 system gates (13,824 CLBs), 110,592 bits of embedded RAM, 97 user I/Os supporting single-ended standards, a 1.425V to 1.575V core supply range, and an industrial operating junction range of -40C to +100C. The -2 speed grade supports up to 310 MHz internal system performance. Low total cost of ownership comes from the single-chip solution, small 13x13 mm footprint, and reprogrammability without external configuration devices.
Technically, ProASIC3 uses a sea-of-gates architecture of versatile logic elements with flash switches, so configuration data survives power cycling and cannot be easily read back, reducing cloning risk. Four I/O banks allow compatible I/O voltage standards to be grouped per bank, with VCCIBx pins routed per bank as described in Microchip migration application notes.
Typical applications include industrial automation and motor control interfaces, aerospace and defense systems requiring secure instant-on logic, communications line cards, and medical instrumentation where the 144-FBGA footprint balances density and board area.
Design consideration: assign only electrically compatible I/O standards to each of the four banks, and budget the 1.5V core rail for inrush during flash power-up.
This page adds value beyond the datasheet by synthesizing distributor stock sources, same-package drop-in alternatives, comparison tables, and practical design notes in one place.
Drop-in alternatives for A3P600-2FGG144I — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with A3P600-2FGG144I (same form factor and footprint) — differing in Package, System Gates, Operating Temperature, Process Technology, Configuration.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
A3P1000-2FGG144I
✅ Drop-In✓ In Stock
$27.2 / Unit
View Datasheet →A3P1000-1FGG144T
✅ Drop-In✓ In Stock
$75 / Unit
View Datasheet →A3P1000-FG144T
✅ Drop-In✓ In Stock
$27.2 / Unit
View Datasheet →A3P250-FGG144I
✅ Drop-In✓ In Stock
$14.06 / Unit
View Datasheet →A3P600-2FGG144I Maximum Ratings & Electrical Characteristics
| Family | ProASIC3 |
| Number of System Gates | 600000 |
| Total RAM Bits | 110592 |
| CLBs | 13824 |
| Number of I/O | 97 |
| Maximum System Frequency | 310 MHz (speed grade -2) |
| Process Technology | 130 nm flash |
| Core Supply Voltage | 1.425 V to 1.575 V (1.5 V nominal) |
| Operating Temperature | -40C to +100C (TJ) |
| Package | 144-LBGA / 144-FBGA (13x13 mm) |
| Mounting Type | Surface Mount |
| Programmability | Flash-based, in-system reprogrammable, single-chip |
| Configuration Storage | Non-volatile on-chip flash (no external config device) |
| I/O Banks | 4 |
| Packaging | Tray |
| Lead Free | Yes (LEAD FREE per Mouser listing) |
A3P600-2FGG144I 144-lbga / 144-fbga (13x13 mm) Pin Configuration Guide
Pin configuration for A3P600-2FGG144I (144-lbga / 144-fbga (13x13 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for A3P600-2FGG144I.
Refer to the datasheet for full pin configuration.
Typical Applications
A3P600-2FGG144I is suitable for 6 applications: Industrial Automation and Control, Aerospace and Defense Secure Logic, Communications Line Cards, Medical Instrumentation, Test and Measurement Equipment, Secure Embedded Control and IoT Gateways.
Industrial Automation and Control
The A3P600-2FGG144I fits industrial automation backplanes and motor-control interface logic because its 97 user I/Os, four per-bank-supplied I/O voltage domains, and industrial -40C to +100C junction rating match mixed-voltage factory environments. The 600K-gate fabric implements encoder interfaces, PWM bridge logic, and safety interlocks at up to 310 MHz system performance, while on-chip flash configuration delivers instant-on operation after power loss - important on production lines that must resume deterministically. Used between PLC processors and field I/O, it absorbs glue-logic, bus-bridging, and protocol-conversion tasks without external configuration devices, cutting BOM count. The trade-off versus a CPLD is higher flexibility but the need for Libero SoC timing closure at full speed.
Recommended
Aerospace and Defense Secure Logic
Flash-based ProASIC3 devices like the A3P600-2FGG144I are widely used in aerospace and defense subsystems because the non-volatile flash configuration cannot be read back like an SRAM bitstream, reducing design-theft and tampering risk, and the single-chip solution simplifies radiation-conscious board layouts. The 600K gates, 110,592 RAM bits, and 310 MHz performance handle telemetry framing, bus interfaces, and signal preprocessing, while the 144-FBGA 13x13 mm package suits space-constrained modules. Instant-on behavior eliminates configuration boot time in mission-critical power-up sequences. Designers should verify the specific program flow (angle grade) and environmental screening requirements with Microchip, since -2 industrial parts may need additional qualification for defense programs.
Recommended
Communications Line Cards
In communications equipment, the A3P600-2FGG144I implements framing, multiplexing, and line-card interface logic where 110,592 bits of embedded RAM provide FIFO buffering between PHY and MAC domains, and 97 I/Os span the wide parallel buses typical of backplane cards. The -2 speed grade supports 310 MHz internal pipelines, adequate for TDM and legacy serial protocol processing. Four I/O banks let designers group 3.3V, 2.5V, and 1.8V interfaces per bank with dedicated VCCIBx supplies, simplifying mixed-voltage line-card design. Because configuration is flash-resident, cards resume operation within microseconds of hot-swap power application. For designs needing dual redundant fabrics, the same-footprint A3P1000 doubles capacity without respin.
Recommended
Medical Instrumentation
Medical diagnostic and monitoring instruments benefit from the A3P600-2FGG144I's deterministic instant-on startup, industrial temperature margin, and quiet single-chip implementation of sensor interface and preprocessing logic. The 600K-gate fabric and 110,592-bit RAM handle acquisition sequencers, filter pre-processing, and front-panel interface logic, while 97 I/Os connect ADCs, displays, and communication modules across four independent voltage banks. Flash configuration removes external boot devices that could introduce boot failures in battery-backed portable diagnostic units. The 13x13 mm 144-FBGA supports compact handheld and benchtop enclosures. Regulatory teams should note that -2 industrial grade is not automatically medical-qualified; system-level IEC validation remains the manufacturer's responsibility.
Recommended
Test and Measurement Equipment
Bench instruments and rack modules use the A3P600-2FGG144I as timing, trigger, and bus-interface logic: the 310 MHz -2 speed grade supports fine-grained state machines, 97 I/Os probe multiple signal domains, and four bank-supplied VCCIBx rails adapt to logic analyzers or mixed-voltage fixtures. The 110,592-bit embedded RAM implements capture buffers for event recorders. Flash-based instant-on configuration means the instrument is ready the moment power is applied - no configuration controller or serial flash to fail. The 144-FBGA footprint fits standard 3U module layouts. When measurement channel counts grow, the pin-migration path to A3P1000 in the identical package lets the same PCB absorb the larger die, reducing redesign cost.
Recommended
Secure Embedded Control and IoT Gateways
Embedded controllers and IoT gateway nodes adopt the A3P600-2FGG144I where configuration security matters: flash cells store the bitstream on-chip with no external configuration device to probe or corrupt, and the fabric implements custom interfaces, cryptographic glue logic, and sensor aggregation alongside a host MCU. The 1.425V to 1.575V core tolerance suits imperfect embedded power supplies, and instant-on operation supports duty-cycled nodes that must act immediately on wake. The 13x13 mm 144-FBGA fits dense gateway PCBs while remaining reworkable relative to finer-pitch packages. Designers should budget core current during flash power-up and group I/O standards per bank. Companion Microchip MCUs or the low-power A3P600L variants extend battery-life budgets.
Recommended
Recommended Products Summary
Engineering reference data for A3P600-2FGG144I — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | A3P1000-2FGG144I | A3P1000-1FGG144T | A3P1000-FG144T | A3P250-FGG144I |
|---|---|---|---|---|---|
| Package | 144-FBGA (13x13 mm) | 144-FBGA - same | 144-FBGA - same | 144-FBGA (FG) - same footprint | 144-FBGA - same |
| Brand | Microchip Technology (Microsemi) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 600000 | 1000000 | 1000000 | 1000000 | 250000 |
| Core Supply Voltage | 1.425 V to 1.575 V | 1.425 V to 1.575 V | 1.425 V to 1.575 V | 1.425 V to 1.575 V | 1.425 V to 1.575 V |
| Lifecycle Position | Active (mature ProASIC3) | Active | Active | Active | Active |
Key Differentiators
- Non-volatile flash configuration, single chip (vs SRAM FPGAs (e.g., Lattice/Xilinx equivalents))
- Same-footprint density migration (vs A3P1000-2FGG144I)
- Cost-down option in identical package (vs A3P250-FGG144I)
- Speed grade headroom (vs A3P1000-1FGG144T)
Design Notes
Supply the 1.5V core rail within 1.425V to 1.575V and decouple each supply pin with 0.1uF ceramics placed within 2 mm of the ball, plus bulk 10uF per rail. Flash FPGAs draw an inrush component while flash switches stabilize at power-up, so size the core regulator headroom accordingly. The four I/O banks each have dedicated VCCIBx pins - do not tie banks with different I/O standards to a single rail if standards differ electrically.
The 144-FBGA (13x13 mm, 0.8 mm-class ball pitch, fine-pitch GG build) requires an 8x8 or denser ball-map breakout; use via-in-pad or dogbone fanout on 4+ layer boards. Follow the Microchip ProASIC3 PCB layout guidelines for ball land diameter and solder-mask definition. Provide solid ground planes under the die area and stitch thermal vias under the package center to spread junction heat toward the -40C to +100C TJ budget.
Do not assign incompatible I/O standards to the same bank - VCCIBx is bank-dedicated, so a 3.3V LVCMOS pin on a 1.8V bank violates the standard. Also, when migrating between A3P400/A3P600/A3P1000 in this 144-pin package, re-verify bank routing per the Microchip migration application note (a3p1000_migration_hbs), because bank-to-pin mapping differs between densities even though the footprint is shared.
Compliance Information
Mouser listing explicitly states LEAD FREE for A3P600-2FGG144I. Full RoHS/REACH declarations must be obtained from Microchip product pages; not AEC-Q100 (FPGA, industrial grade I suffix).
