A3PE3000L-FG896 - ProASIC3L Low Power FPGA 620 I/O | Microchip
Teilenummer: A3PE3000L-FG896 ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $0 | $0,00 |
| 10 | $0 | $0,00 |
| 100 | $0 | $0,00 |
| 500 | $0 | $0,00 |
| 1.000 | $0 | $0,00 |
A3PE3000L-FG896 Übersicht
A field-programmable gate array (FPGA) is a semiconductor device that can be configured by the designer after manufacturing, sitting within the broader hierarchy of programmable logic devices that ranges from SPLDs and CPLDs up to high-density FPGAs. Unlike SRAM-based FPGAs, the ProASIC3L family uses nonvolatile flash technology, meaning the configuration is stored on-chip and no external boot flash is required, making it a secure, single-chip, Instant On solution.
Key features of the A3PE3000L-FG896 include its low total cost of ownership, single-chip operation, reprogrammability, and the ProASIC3L family's Flash*Freeze technology, which dramatically reduces static and dynamic power consumption without losing SRAM state or I/O activity. The 1.2 V to 1.5 V core voltage range supports low-power system design.
Technically, the device is fabricated on a 130 nm flash process and built around ProASIC3L VersaTile logic architecture, where each tile can act as a lookup table, flip-flop, or embedded memory. The 896-BGA package provides a large 620 I/O budget for wide bus interfaces, memory controllers, and glue logic consolidation in board designs that previously needed multiple ASICs or ASSPs.
Typical applications include industrial control, portable and battery-powered instrumentation, secure single-chip logic, and power-sensitive embedded systems where FPGA reprogrammability and instant-on startup are essential.
A key design consideration is power: while Flash*Freeze mode can substantially cut dynamic and static power, designers should budget I/O bank loading and configure unused I/Os appropriately to maximize savings.
This page synthesizes distributor availability, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet, with pricing and stock data verified as of 2026-09-02.
Drop-in-Alternativen für A3PE3000L-FG896 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit A3PE3000L-FG896 (gleiche Bauform und Footprint) – abweichend in Family, Package, Configuration Memory, System Gates, Core Voltage.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
A3PE3000L-FG896I
✅ Drop-In✓ Auf Lager
Preis auf Anfrage
Datenblatt ansehen →A3PE3000L-FG896M
✅ Drop-In✓ Auf Lager
Preis auf Anfrage
Datenblatt ansehen →A3PE3000L-1FGG896
✅ Drop-In✓ Auf Lager
$255 / Stück
Datenblatt ansehen →A3PE3000L-1FG896
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
A3PE3000L-FG896 Grenzwerte & elektrische Eigenschaften
| Family | ProASIC3L |
| System Gates | 3,000,000 |
| User I/O | 620 |
| Logic Cells | 75,264 |
| Core Voltage | 1.2 V to 1.5 V |
| Technology | 130 nm nonvolatile flash |
| Configuration Memory | Nonvolatile flash (single-chip, Instant On) |
| Gehäuse | 896-ball FBGA |
| Montageart | Surface Mount |
| Low Power Feature | Flash*Freeze technology |
| Operating Temperature Suffix | Commercial (unmarked suffix; -I grade is industrial) |
| RoHS-Status | unknown |
| Programmability | In-system reprogrammable |
A3PE3000L-FG896 896-ball fbga Pinbelegungsleitfaden
Pinbelegung für A3PE3000L-FG896 (896-ball fbga-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für A3PE3000L-FG896.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
A3PE3000L-FG896 ist geeignet für 6 Anwendungs: Industrial Control and Automation, Portable and Battery-Powered Instrumentation, Secure Single-Chip Logic, Board-Level Glue Logic Consolidation, Medical and Test Equipment, Communications and Networking Line Cards.
Industrial Control and Automation
The A3PE3000L-FG896 suits industrial controllers that need large I/O counts and deterministic, instant-on logic. Its 620 user I/Os in an 896-ball FBGA can absorb PLC I/O expansion, motor-control sequencing, and sensor interfacing that would otherwise require several smaller devices, reducing BOM and board area. Because configuration resides in nonvolatile on-chip flash, the FPGA is active immediately at power-up - important for factory equipment with strict startup sequences. The 1.2 V to 1.5 V core and low static flash power help in sealed enclosures with limited airflow. Designers typically pair the FPGA with an MCU handling communications while the FPGA manages timing-critical I/O.
Empfohlen
Portable and Battery-Powered Instrumentation
Battery-powered instruments benefit directly from the ProASIC3L family's low static and dynamic power plus Flash*Freeze technology, which drops power dramatically while retaining SRAM state and I/O context. The A3PE3000L-FG896's 3M gates and 75,264 logic cells provide enough capacity for data acquisition sequencers, display driving, and signal pre-processing in handheld testers and field analyzers. The nonvolatile flash configuration removes the boot-time and board-area cost of external configuration flash. With a 1.2 V to 1.5 V core, the device fits multi-rail battery systems; designers should place the FPGA in Flash*Freeze during idle intervals to extend battery runtime.
Empfohlen
Secure Single-Chip Logic
ProASIC3L's nonvolatile flash technology makes the A3PE3000L-FG896 a strong fit for secure, single-chip logic where the bitstream must never appear on a board-level configuration bus, as happens with SRAM FPGAs at every power-up. Applications include secure communications equipment, licensing enforcement logic, and anti-tamper designs. The device is Instant On - active within microseconds of supply ramp - so security functions need not wait for configuration. With 3M gates and 620 I/Os, designers can consolidate security logic, bus bridging, and custom peripherals into one 896-BGA device, shrinking the attack surface relative to multi-chip solutions.
Empfohlen
Board-Level Glue Logic Consolidation
The A3PE3000L-FG896 excels at replacing collections of ASSPs, CPLDs, and discrete glue logic across a PCB. Its 620 user I/Os and 896-ball FBGA footprint provide the connectivity to interface memory buses, backplanes, and mixed-voltage peripherals in one reprogrammable device. Reprogrammability allows board spins to be absorbed in firmware rather than PCB rework, cutting total cost of ownership - a headline feature on Microchip's product page. Because configuration is nonvolatile and Instant On, the consolidated logic meets power-up timing without external boot memory. Verify I/O banking and voltage standards in the datasheet when migrating legacy discrete interfaces.
Empfohlen
Medical and Test Equipment
Medical diagnostic devices and bench instrumentation need predictable power-up behavior, flexible I/O, and long field life - all ProASIC3L strengths. The A3PE3000L-FG896's 3M gates implement acquisition front-end control, filter engines, and display/communication interfaces, while Flash*Freeze mode keeps standby power low between measurements. Nonvolatile configuration means the instrument is operational the instant power is applied, simplifying self-test sequences. The large FBGA package suits rack and cart-based equipment where board space is less constrained than in wearables. Field upgrades are performed by reprogramming flash in-system, enabling feature updates over service life.
Empfohlen
Communications and Networking Line Cards
Line cards and control planes in networking gear use the A3PE3000L-FG896 for bus bridging, LED/status control, hot-swap supervision, and board management. The 620 I/O budget covers wide parallel interfaces to PHYs and switch fabric devices, and the 896-BGA delivers the ball count those interfaces demand. Instant On nonvolatile configuration lets the card signal ready states to the chassis manager before software loads, and reprogrammability supports in-field feature updates. Designers should budget core and I/O rail sequencing with the chassis power-good scheme and use Flash*Freeze during card standby to cut slot power, an increasingly important metric in dense chassis.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für A3PE3000L-FG896 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | A3PE3000L-FG896I | A3PE3000L-FG896M | A3PE3000L-1FGG896 | A3PE3000L-1FG896 |
|---|---|---|---|---|---|
| Package | 896-ball FBGA | 896-ball FBGA - same | 896-ball FBGA - same | 896-ball FBGA (FGG) - same footprint | 896-ball FBGA - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip (Microsemi legacy) | Microchip Technology |
| System Gates | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 |
| User I/O | 620 | 620 | 620 | 620 | 620 |
| Core Voltage | 1.2 V to 1.5 V | 1.2 V to 1.5 V | 1.2 V to 1.5 V | 1.2 V (per FindIC listing) | 1.2 V to 1.5 V |
| Low Power Feature | Flash*Freeze, nonvolatile flash | Flash*Freeze, nonvolatile flash | Flash*Freeze, nonvolatile flash | Flash*Freeze, nonvolatile flash | Flash*Freeze, nonvolatile flash |
Wichtigste Unterscheidungsmerkmale
- Lowest-risk drop-in replacement option (vs. A3PE3000L-FG896I)
- Faster timing headroom (vs. A3PE3000L-1FGG896)
- Single-chip nonvolatile configuration (vs. SRAM-based FPGAs of similar density)
Designhinweise
Budget two power domains: the 1.2 V to 1.5 V core rail and the I/O bank rails. Per the Microchip product page, the ProASIC3L family emphasizes low dynamic and static power, but actual consumption depends heavily on I/O loading and toggle rates. Enter the design into Microchip Libero and run the power calculator early with realistic switching activity, then apply Flash*Freeze mode in idle states to capture the family's headline power savings.
The 896-ball FBGA requires careful fan-out planning. Use a microvia or sequential build-up stackup to escape the ball field, and define via-in-pad with fill for power/ground balls. Follow the Microchip ProASIC3L datasheet (DS50003268) PCB land-pattern and reflow guidance; the datasheet's ball map sections define VCC, GND, and NC ball assignments that govern your power-plane segmentation. Simulate or follow datasheet derating for signal integrity on high-speed I/O banks.
Do not confuse the -FG896 and -FGG896 package suffixes, or commercial vs -I industrial temperature grades, when ordering or cross-referencing: they share the same die and footprint but differ in ordering data and, for speed-grade dashes (-1), timing. Verify the exact suffix against your environmental and timing requirements before substitution, even though these variants are pin-to-pin compatible within the same 896-ball package.
Compliance-Informationen
Compliance status not stated in the provided verified web data. Consult the Microchip product page or distributor environmental data for current RoHS/REACH declarations.
