CXDB4ABAM - 2GB LPDDR4X SDRAM 3733Mbps | CXMT
Teilenummer: CXDB4ABAM ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $32.7273 | $32,73 |
| 10 | $23.6364 | $236,36 |
| 100 | $20.9091 | $2.090,91 |
| 500 | $20 | $10.000,00 |
| 1.000 | $19.0909 | $19.090,90 |
CXDB4ABAM Übersicht
LPDDR4X is a type of synchronous dynamic random-access memory (SDRAM) that is part of the LPDDR (Low Power Double Data Rate) family, which is optimized for battery-powered devices. It is a successor to LPDDR4 and offers reduced I/O voltage (0.6V) compared to LPDDR4 (1.1V), resulting in lower power consumption while maintaining similar performance. LPDDR4X is widely used in smartphones, tablets, ultra-thin laptops, and embedded systems where power efficiency is critical.
Key features of the CXDB4ABAM include a 2GB density, 3733 Mbps data rate, and support for dual-channel operation. The device uses a 200-ball FBGA package with a 0.8mm ball pitch, enabling compact PCB designs. It is RoHS compliant and supports industrial temperature ranges, making it suitable for a variety of applications.
The CXDB4ABAM utilizes advanced DRAM process technology to achieve high speed and low power. It supports various power-saving modes, including idle, self-refresh, and deep power-down, which are essential for extending battery life in portable devices. The memory interface is compatible with standard LPDDR4X controllers, simplifying integration into SoC designs.
Typical applications include smartphones, tablets, embedded computing, AI edge devices, and automotive infotainment systems. The high bandwidth and low power make it ideal for applications requiring fast data processing and long battery life.
When designing with the CXDB4ABAM, ensure proper decoupling and signal integrity practices are followed. The 0.6V I/O voltage requires careful PCB layout to minimize noise and maintain signal integrity at high data rates.
Drop-in-Alternativen für CXDB4ABAM – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
CXDB4ABAM-MK
✓ Auf Lager
$19.0909 / Stück
Datenblatt ansehen →CXDB5CCAM-MK
✓ Auf Lager
$54.0909 / Stück
Datenblatt ansehen →MT53B256M32D1NP-062
✓ Auf Lager
$8.9 / Stück
Datenblatt ansehen →CXDB4ABAM-MJ
📋 Referenzalternative (nicht im Katalog)
K4U6E3S4AM-MGCL
📋 Referenzalternative (nicht im Katalog)
H9HCNNNBKMMLXR-NEM
📋 Referenzalternative (nicht im Katalog)
CXDB4ABAM Grenzwerte & elektrische Eigenschaften
| Speichertyp | LPDDR4X SDRAM |
| Density | 2GB |
| Datenrate | 3733 Mbps |
| Gehäuse | FBGA-200 (15x10x0.8mm) |
| Ball Pitch | 0.8 mm |
| I/O Voltage | 0.6 V |
| RoHS | Compliant |
| Montageart | Surface Mount |
| Lead-Free | Yes |
CXDB4ABAM fbga-200 (15x10x0.8mm) Pinbelegungsleitfaden
Pinbelegung für CXDB4ABAM (fbga-200 (15x10x0.8mm)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für CXDB4ABAM.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
CXDB4ABAM ist geeignet für 6 Anwendungs: Smartphones, Tablets, Embedded Computing, AI Edge Devices, Automotive Infotainment, Consumer Electronics.
Smartphones
The CXDB4ABAM provides 2GB LPDDR4X memory at 3733 Mbps, ideal for smartphones requiring high bandwidth for multitasking and AI processing. Its low 0.6V I/O voltage reduces power consumption, extending battery life. The 200-ball FBGA package enables compact PCB designs in slim phone form factors. With support for low-power modes, it helps meet stringent power budgets in mobile devices.
Empfohlen
Tablets
Tablets require a balance of performance and power efficiency. The CXDB4ABAM's 3733 Mbps data rate supports smooth video playback and gaming, while its low-power LPDDR4X architecture extends battery life. The 2GB density is suitable for entry-level to mid-range tablets. Its compact FBGA-200 package allows for thin and light designs, and the industrial temperature range option supports various environments.
Empfohlen
Embedded Computing
In embedded systems, the CXDB4ABAM offers high-bandwidth memory for real-time data processing in industrial automation, robotics, and edge computing. Its low power consumption is critical for fanless designs. The 200-ball FBGA package is suitable for compact embedded boards. With support for wide temperature ranges (if specified), it can operate in harsh environments. The 3733 Mbps speed enables fast data throughput for sensor fusion and control loops.
Empfohlen
AI Edge Devices
AI edge devices require high memory bandwidth for neural network inference. The CXDB4ABAM's 3733 Mbps data rate provides fast access to model weights and activations. Its low power consumption is essential for battery-powered edge devices. The 2GB capacity supports moderate-sized models. The compact FBGA-200 package fits into small form factors like smart cameras and drones. Low-power modes help extend operational time.
Empfohlen
Automotive Infotainment
Automotive infotainment systems demand high reliability and performance. The CXDB4ABAM offers 3733 Mbps bandwidth for smooth navigation and multimedia. Its low power consumption reduces heat generation in the cabin. The 200-ball FBGA package is suitable for automotive PCBs. If AEC-Q100 qualified (verify), it meets automotive standards. The 2GB density supports multiple displays and audio streams.
Empfohlen
Consumer Electronics
In consumer electronics like smart TVs and streaming devices, the CXDB4ABAM provides high-speed memory for 4K video decoding and responsive user interfaces. Its low power consumption is beneficial for energy-efficient designs. The 2GB capacity is adequate for modern applications. The compact FBGA-200 package enables slim product designs. The 3733 Mbps data rate ensures smooth performance in multimedia applications.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für CXDB4ABAM – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | CXDB4ABAM-MK | CXDB4ABAM-MJ | CXDB5CCAM-MK | K4U6E3S4AM-MGCL | MT53B256M32D1NP-062 | H9HCNNNBKMMLXR-NEM |
|---|---|---|---|---|---|---|---|
| Package | FBGA-200 (15x10x0.8mm) | FBGA-200 (15x10x0.8mm) | FBGA-200 (15x10x0.8mm) | FBGA-200 (15x10x0.8mm) | FBGA-200 (15x10x0.8mm) | FBGA-200 (15x10x0.8mm) | FBGA-200 (15x10x0.8mm) |
| Brand | CXMT | CXMT | CXMT | CXMT | Samsung | Micron | SK Hynix |
| Memory Type | LPDDR4X | LPDDR4X | LPDDR4X | LPDDR5 | LPDDR4X | LPDDR4X | LPDDR4X |
| Source | web_data | web_data | web_data | llm_knowledge | llm_knowledge | llm_knowledge | llm_knowledge |
Wichtigste Unterscheidungsmerkmale
- Native CXMT part with -MK suffix (vs. CXDB4ABAM-MK)
- Lower power than LPDDR5 (vs. CXDB5CCAM-MK)
- Cost-effective alternative to Samsung/Micron (vs. K4U6E3S4AM-MGCL)
Designhinweise
For the CXDB4ABAM, ensure proper decoupling capacitors (0.1uF and 1uF) are placed close to each power pin. The 0.6V I/O voltage requires careful signal integrity; keep trace lengths matched and use impedance-controlled routing for high-speed data lines. Refer to the LPDDR4X PCB design guidelines from JEDEC.
Although LPDDR4X is low-power, the CXDB4ABAM can dissipate heat during heavy operation. Ensure adequate thermal vias under the FBGA package and consider airflow in the system design. The operating temperature range should be verified from the datasheet to ensure it meets your application's requirements.
Do not exceed the maximum data rate of 3733 Mbps. Ensure the memory controller is configured for LPDDR4X with correct timing parameters. Verify the power supply voltages (VDD1, VDD2) from the datasheet; incorrect voltages can cause malfunction. Also, follow the recommended power-up sequence to avoid latch-up.
Compliance-Informationen
RoHS compliant per JLCPCB listing. Other compliance data not available in provided sources.
