CXDB4ABAM-MK - 8Gb LPDDR4X SDRAM 3733MHz | CXMT
MPN: CXDB4ABAM-MK โ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $12.5 | $12.50 |
| 10 | $11.2 | $112.00 |
| 100 | $9.8 | $980.00 |
| 500 | $8.5 | $4,250.00 |
| 1,000 | $7.2 | $7,200.00 |
Drop-in alternatives for CXDB4ABAM-MK โ same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool โ Select alternative parts for side-by-side comparison:
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$0.12 / Unit
View Datasheet โMT53B256M32D1NP-062
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CXDB4ABAM-MK Maximum Ratings & Electrical Characteristics
| Memory Type | LPDDR4X SDRAM |
| Density | 8Gb |
| Data Rate | 3733 MHz |
| Package | BGA-200 (15x10x0.8 mm) |
| Supply Voltage (VDD1) | 1.8V |
| Supply Voltage (VDD2) | 1.1V |
| I/O Voltage (VDDQ) | 0.6V |
| Operating Temperature Range | [DATA_NEEDED: operating temperature range] |
| RoHS | Compliant |
| Mounting Type | Surface Mount |
| Number of Pins | 200 |
| Organization | [DATA_NEEDED: memory organization] |
| CAS Latency | [DATA_NEEDED: CAS latency] |
| Refresh | [DATA_NEEDED: refresh rate] |
| Lead-Free | Yes |
CXDB4ABAM-MK Pin Configuration
| Pin A1 | VDD1 โ Core power supply 1.8V |
| Pin A2 | VSS โ Ground |
| Pin B1 | DQ0 โ Data I/O 0 |
| Pin B2 | DQ1 โ Data I/O 1 |
| Pin C1 | VDD2 โ Core power supply 1.1V |
| Pin C2 | VSSQ โ I/O ground |
| Pin D1 | CK_t โ Clock positive |
| Pin D2 | CK_c โ Clock negative |
| Pin E1 | CS โ Chip select |
| Pin E2 | CA0 โ Command/Address 0 |
| Pin F1 | CA1 โ Command/Address 1 |
| Pin F2 | CA2 โ Command/Address 2 |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
CXDB4ABAM-MK is suitable for 6 applications: Smartphones, Tablets, Set-Top Boxes, IoT Devices, VR Headsets, Automotive Infotainment.
Smartphones
The CXDB4ABAM-MK's 3733 MHz data rate and low power consumption enable smooth multitasking and immersive VR experiences in smartphones. Its 8Gb density supports high-resolution displays and demanding apps. The LPDDR4X interface reduces power draw, extending battery life. The compact BGA-200 package fits space-constrained phone designs.
Recommended
Tablets
Tablets require high memory bandwidth for video streaming and gaming. The CXDB4ABAM-MK delivers 3733 MHz speed and 8Gb capacity, ensuring smooth performance. Its low power consumption is critical for battery-powered tablets. The 200-ball FBGA package allows thin form factors. The device supports dual-channel operation for increased throughput.
Recommended
Set-Top Boxes
Set-top boxes need high-speed memory for HD video decoding and app loading. The CXDB4ABAM-MK's 3733 MHz data rate ensures fast data transfer. Its 8Gb density supports multiple streams. The low power consumption reduces heat generation. The BGA-200 package is suitable for compact set-top box designs.
Recommended
IoT Devices
IoT devices require low power and reliable memory. The CXDB4ABAM-MK's LPDDR4X interface minimizes power consumption, extending battery life. Its 3733 MHz speed supports real-time data processing. The 8Gb density provides ample storage for sensor data. The compact package is ideal for small IoT modules.
Recommended
VR Headsets
VR headsets demand high bandwidth and low latency. The CXDB4ABAM-MK's 3733 MHz data rate delivers the required throughput for immersive experiences. Its low power consumption is essential for battery-operated headsets. The 8Gb density supports high-resolution displays. The BGA-200 package enables compact headset designs.
Recommended
Automotive Infotainment
Automotive infotainment systems require reliable, high-speed memory. The CXDB4ABAM-MK's 3733 MHz speed supports navigation and multimedia. Its low power consumption reduces heat in the cabin. The 8Gb density handles multiple applications. The device's temperature-compensated self-refresh ensures data integrity in varying temperatures.
Recommended
Recommended Products Summary
Engineering reference data for CXDB4ABAM-MK โ comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | CXDB4ABAM | K4F8E304HB-MGCJ | H5AN8G6NAFR-UHC |
|---|---|---|---|---|
| Package | BGA-200 | BGA-200 | BGA-200 | BGA-200 |
| Brand | CXMT | CXMT | Samsung | SK Hynix |
| Density | 8Gb | 8Gb | 8Gb | 8Gb |
| Data Rate | 3733 MHz | [DATA_NEEDED] | 3733 MHz | 3733 MHz |
| I/O Voltage | 0.6V | 0.6V | 0.6V | 0.6V |
| Supply Voltage (VDD1) | 1.8V | 1.8V | 1.8V | 1.8V |
| Supply Voltage (VDD2) | 1.1V | 1.1V | 1.1V | 1.1V |
| RoHS | Compliant | Compliant | Compliant | Compliant |
Key Differentiators
- 3733 MHz data rate (vs CXDB4ABAM)
- Low power consumption (vs K4F8E304HB-MGCJ)
- Cost-effective (vs H5AN8G6NAFR-UHC)
Design Notes
For high-speed LPDDR4X signals at 3733 MHz, maintain controlled impedance of 50 ohms for single-ended and 100 ohms differential for clock signals. Keep trace lengths matched within 0.1mm for data and address buses. Use ground planes beneath the memory to minimize noise.
Decouple VDD1 (1.8V) and VDD2 (1.1V) with 0.1uF and 1uF capacitors placed as close to the pins as possible. Use a 4.7uF bulk capacitor on the power rail. Ensure low-impedance power delivery to maintain signal integrity at high speeds.
The BGA-200 package has a thermal resistance that requires adequate PCB copper for heat dissipation. Provide thermal vias under the package to the ground plane. For high ambient temperature applications, consider airflow or a heatsink to keep junction temperature within limits.
Compliance Information
RoHS compliant per JLCPCB listing. Other compliance data not available.
