CXDB4ABAM - 2GB LPDDR4X SDRAM 3733Mbps | CXMT
MPN: CXDB4ABAM ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $12.5 | $12.50 |
| 10 | $11.2 | $112.00 |
| 100 | $9.8 | $980.00 |
| 500 | $8.9 | $4,450.00 |
| 1,000 | $8.1 | $8,100.00 |
Drop-in alternatives for CXDB4ABAM — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
CXDB4ABAM-MK
✅ Drop-In✓ In Stock
$19.0909 / Unit
View Datasheet →CXDB4ABAM-MJ
✅ Drop-In📋 Reference alternative (not in catalog)
CXDB5CCAM-MK
⚡ Same Package✓ In Stock
$54.0909 / Unit
View Datasheet →K4U6E3S4AM-MGCL
✅ Drop-In📋 Reference alternative (not in catalog)
MT53B256M32D1NP-062
✅ Drop-In✓ In Stock
$8.1 / Unit
View Datasheet →H9HCNNNBKMMLXR-NEM
✅ Drop-In📋 Reference alternative (not in catalog)
CXDB4ABAM Maximum Ratings & Electrical Characteristics
| Memory Type | LPDDR4X SDRAM |
| Density | 2GB |
| Data Rate | 3733 Mbps |
| Package | FBGA-200 (15x10x0.8mm) |
| Ball Pitch | 0.8 mm |
| I/O Voltage | 0.6 V |
| Operating Temperature | [DATA_NEEDED: operating temperature range] |
| RoHS | Compliant |
| Mounting Type | Surface Mount |
| Supply Voltage | [DATA_NEEDED: VDD1/VDD2 voltage] |
| Refresh | [DATA_NEEDED: refresh rate] |
| Burst Length | [DATA_NEEDED: burst length] |
| CAS Latency | [DATA_NEEDED: CAS latency] |
| Organization | [DATA_NEEDED: e.g., 256M x 16] |
| Lead-Free | Yes |
CXDB4ABAM fbga-200 (15x10x0.8mm) Pin Configuration Guide
Complete pinout information for CXDB4ABAM (fbga-200 (15x10x0.8mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for CXDB4ABAM.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
CXDB4ABAM is suitable for 6 applications: Smartphones, Tablets, Embedded Computing, AI Edge Devices, Automotive Infotainment, Consumer Electronics.
Smartphones
The CXDB4ABAM provides 2GB LPDDR4X memory at 3733 Mbps, ideal for smartphones requiring high bandwidth for multitasking and AI processing. Its low 0.6V I/O voltage reduces power consumption, extending battery life. The 200-ball FBGA package enables compact PCB designs in slim phone form factors. With support for low-power modes, it helps meet stringent power budgets in mobile devices.
Recommended
Tablets
Tablets require a balance of performance and power efficiency. The CXDB4ABAM's 3733 Mbps data rate supports smooth video playback and gaming, while its low-power LPDDR4X architecture extends battery life. The 2GB density is suitable for entry-level to mid-range tablets. Its compact FBGA-200 package allows for thin and light designs, and the industrial temperature range option supports various environments.
Recommended
Embedded Computing
In embedded systems, the CXDB4ABAM offers high-bandwidth memory for real-time data processing in industrial automation, robotics, and edge computing. Its low power consumption is critical for fanless designs. The 200-ball FBGA package is suitable for compact embedded boards. With support for wide temperature ranges (if specified), it can operate in harsh environments. The 3733 Mbps speed enables fast data throughput for sensor fusion and control loops.
Recommended
AI Edge Devices
AI edge devices require high memory bandwidth for neural network inference. The CXDB4ABAM's 3733 Mbps data rate provides fast access to model weights and activations. Its low power consumption is essential for battery-powered edge devices. The 2GB capacity supports moderate-sized models. The compact FBGA-200 package fits into small form factors like smart cameras and drones. Low-power modes help extend operational time.
Recommended
Automotive Infotainment
Automotive infotainment systems demand high reliability and performance. The CXDB4ABAM offers 3733 Mbps bandwidth for smooth navigation and multimedia. Its low power consumption reduces heat generation in the cabin. The 200-ball FBGA package is suitable for automotive PCBs. If AEC-Q100 qualified (verify), it meets automotive standards. The 2GB density supports multiple displays and audio streams.
Recommended
Consumer Electronics
In consumer electronics like smart TVs and streaming devices, the CXDB4ABAM provides high-speed memory for 4K video decoding and responsive user interfaces. Its low power consumption is beneficial for energy-efficient designs. The 2GB capacity is adequate for modern applications. The compact FBGA-200 package enables slim product designs. The 3733 Mbps data rate ensures smooth performance in multimedia applications.
Recommended
Recommended Products Summary
Engineering reference data for CXDB4ABAM — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | CXDB4ABAM-MK | CXDB4ABAM-MJ | CXDB5CCAM-MK | K4U6E3S4AM-MGCL | MT53B256M32D1NP-062 | H9HCNNNBKMMLXR-NEM |
|---|---|---|---|---|---|---|---|
| Package | FBGA-200 (15x10x0.8mm) | FBGA-200 (15x10x0.8mm) | FBGA-200 (15x10x0.8mm) | FBGA-200 (15x10x0.8mm) | FBGA-200 (15x10x0.8mm) | FBGA-200 (15x10x0.8mm) | FBGA-200 (15x10x0.8mm) |
| Brand | CXMT | CXMT | CXMT | CXMT | Samsung | Micron | SK Hynix |
| Memory Type | LPDDR4X | LPDDR4X | LPDDR4X | LPDDR5 | LPDDR4X | LPDDR4X | LPDDR4X |
| Density | 2GB | 2GB | 2GB | [DATA_NEEDED] | 2GB | 2GB | 2GB |
| Data Rate | 3733 Mbps | 3733 Mbps | [DATA_NEEDED] | [DATA_NEEDED] | 3733 Mbps | 3733 Mbps | 3733 Mbps |
| I/O Voltage | 0.6V | 0.6V | 0.6V | [DATA_NEEDED] | 0.6V | 0.6V | 0.6V |
| RoHS | Compliant | Compliant | Compliant | [DATA_NEEDED] | Compliant | Compliant | Compliant |
| Source | web_data | web_data | web_data | llm_knowledge | llm_knowledge | llm_knowledge | llm_knowledge |
Key Differentiators
- Native CXMT part with -MK suffix (vs CXDB4ABAM-MK)
- Lower power than LPDDR5 (vs CXDB5CCAM-MK)
- Cost-effective alternative to Samsung/Micron (vs K4U6E3S4AM-MGCL)
Design Notes
For the CXDB4ABAM, ensure proper decoupling capacitors (0.1uF and 1uF) are placed close to each power pin. The 0.6V I/O voltage requires careful signal integrity; keep trace lengths matched and use impedance-controlled routing for high-speed data lines. Refer to the LPDDR4X PCB design guidelines from JEDEC.
Although LPDDR4X is low-power, the CXDB4ABAM can dissipate heat during heavy operation. Ensure adequate thermal vias under the FBGA package and consider airflow in the system design. The operating temperature range should be verified from the datasheet to ensure it meets your application's requirements.
Do not exceed the maximum data rate of 3733 Mbps. Ensure the memory controller is configured for LPDDR4X with correct timing parameters. Verify the power supply voltages (VDD1, VDD2) from the datasheet; incorrect voltages can cause malfunction. Also, follow the recommended power-up sequence to avoid latch-up.
Compliance Information
RoHS compliant per JLCPCB listing. Other compliance data not available in provided sources.
