CXDB4ABAM - 2GB LPDDR4X SDRAM 3733Mbps | CXMT
Référence : CXDB4ABAM ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $32.7273 | $32,73 |
| 10 | $23.6364 | $236,36 |
| 100 | $20.9091 | $2 090,91 |
| 500 | $20 | $10 000,00 |
| 1 000 | $19.0909 | $19 090,90 |
CXDB4ABAM Présentation
LPDDR4X is a type of synchronous dynamic random-access memory (SDRAM) that is part of the LPDDR (Low Power Double Data Rate) family, which is optimized for battery-powered devices. It is a successor to LPDDR4 and offers reduced I/O voltage (0.6V) compared to LPDDR4 (1.1V), resulting in lower power consumption while maintaining similar performance. LPDDR4X is widely used in smartphones, tablets, ultra-thin laptops, and embedded systems where power efficiency is critical.
Key features of the CXDB4ABAM include a 2GB density, 3733 Mbps data rate, and support for dual-channel operation. The device uses a 200-ball FBGA package with a 0.8mm ball pitch, enabling compact PCB designs. It is RoHS compliant and supports industrial temperature ranges, making it suitable for a variety of applications.
The CXDB4ABAM utilizes advanced DRAM process technology to achieve high speed and low power. It supports various power-saving modes, including idle, self-refresh, and deep power-down, which are essential for extending battery life in portable devices. The memory interface is compatible with standard LPDDR4X controllers, simplifying integration into SoC designs.
Typical applications include smartphones, tablets, embedded computing, AI edge devices, and automotive infotainment systems. The high bandwidth and low power make it ideal for applications requiring fast data processing and long battery life.
When designing with the CXDB4ABAM, ensure proper decoupling and signal integrity practices are followed. The 0.6V I/O voltage requires careful PCB layout to minimize noise and maintain signal integrity at high data rates.
Alternatives de remplacement direct pour CXDB4ABAM — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
CXDB4ABAM-MK
✓ En stock
$19.0909 / unité
Voir la fiche technique →CXDB5CCAM-MK
✓ En stock
$54.0909 / unité
Voir la fiche technique →MT53B256M32D1NP-062
✓ En stock
$8.9 / unité
Voir la fiche technique →CXDB4ABAM-MJ
📋 Alternative de référence (hors catalogue)
K4U6E3S4AM-MGCL
📋 Alternative de référence (hors catalogue)
H9HCNNNBKMMLXR-NEM
📋 Alternative de référence (hors catalogue)
CXDB4ABAM Valeurs maximales et caractéristiques électriques
| Type de mémoire | LPDDR4X SDRAM |
| Density | 2GB |
| Débit de données | 3733 Mbps |
| Boîtier | FBGA-200 (15x10x0.8mm) |
| Ball Pitch | 0.8 mm |
| I/O Voltage | 0.6 V |
| RoHS | Compliant |
| Type de montage | Surface Mount |
| Lead-Free | Yes |
Guide de configuration des broches du CXDB4ABAM fbga-200 (15x10x0.8mm)
Configuration des broches du CXDB4ABAM (boîtier fbga-200 (15x10x0.8mm)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour CXDB4ABAM.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
CXDB4ABAM convient pour 6 applications: Smartphones, Tablets, Embedded Computing, AI Edge Devices, Automotive Infotainment, Consumer Electronics.
Smartphones
The CXDB4ABAM provides 2GB LPDDR4X memory at 3733 Mbps, ideal for smartphones requiring high bandwidth for multitasking and AI processing. Its low 0.6V I/O voltage reduces power consumption, extending battery life. The 200-ball FBGA package enables compact PCB designs in slim phone form factors. With support for low-power modes, it helps meet stringent power budgets in mobile devices.
Recommandé
Tablets
Tablets require a balance of performance and power efficiency. The CXDB4ABAM's 3733 Mbps data rate supports smooth video playback and gaming, while its low-power LPDDR4X architecture extends battery life. The 2GB density is suitable for entry-level to mid-range tablets. Its compact FBGA-200 package allows for thin and light designs, and the industrial temperature range option supports various environments.
Recommandé
Embedded Computing
In embedded systems, the CXDB4ABAM offers high-bandwidth memory for real-time data processing in industrial automation, robotics, and edge computing. Its low power consumption is critical for fanless designs. The 200-ball FBGA package is suitable for compact embedded boards. With support for wide temperature ranges (if specified), it can operate in harsh environments. The 3733 Mbps speed enables fast data throughput for sensor fusion and control loops.
Recommandé
AI Edge Devices
AI edge devices require high memory bandwidth for neural network inference. The CXDB4ABAM's 3733 Mbps data rate provides fast access to model weights and activations. Its low power consumption is essential for battery-powered edge devices. The 2GB capacity supports moderate-sized models. The compact FBGA-200 package fits into small form factors like smart cameras and drones. Low-power modes help extend operational time.
Recommandé
Automotive Infotainment
Automotive infotainment systems demand high reliability and performance. The CXDB4ABAM offers 3733 Mbps bandwidth for smooth navigation and multimedia. Its low power consumption reduces heat generation in the cabin. The 200-ball FBGA package is suitable for automotive PCBs. If AEC-Q100 qualified (verify), it meets automotive standards. The 2GB density supports multiple displays and audio streams.
Recommandé
Consumer Electronics
In consumer electronics like smart TVs and streaming devices, the CXDB4ABAM provides high-speed memory for 4K video decoding and responsive user interfaces. Its low power consumption is beneficial for energy-efficient designs. The 2GB capacity is adequate for modern applications. The compact FBGA-200 package enables slim product designs. The 3733 Mbps data rate ensures smooth performance in multimedia applications.
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Récapitulatif des produits recommandés
Données de référence d'ingénierie pour CXDB4ABAM — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | CXDB4ABAM-MK | CXDB4ABAM-MJ | CXDB5CCAM-MK | K4U6E3S4AM-MGCL | MT53B256M32D1NP-062 | H9HCNNNBKMMLXR-NEM |
|---|---|---|---|---|---|---|---|
| Package | FBGA-200 (15x10x0.8mm) | FBGA-200 (15x10x0.8mm) | FBGA-200 (15x10x0.8mm) | FBGA-200 (15x10x0.8mm) | FBGA-200 (15x10x0.8mm) | FBGA-200 (15x10x0.8mm) | FBGA-200 (15x10x0.8mm) |
| Brand | CXMT | CXMT | CXMT | CXMT | Samsung | Micron | SK Hynix |
| Memory Type | LPDDR4X | LPDDR4X | LPDDR4X | LPDDR5 | LPDDR4X | LPDDR4X | LPDDR4X |
| Source | web_data | web_data | web_data | llm_knowledge | llm_knowledge | llm_knowledge | llm_knowledge |
Principaux différenciateurs
- Native CXMT part with -MK suffix (vs CXDB4ABAM-MK)
- Lower power than LPDDR5 (vs CXDB5CCAM-MK)
- Cost-effective alternative to Samsung/Micron (vs K4U6E3S4AM-MGCL)
Notes de conception
For the CXDB4ABAM, ensure proper decoupling capacitors (0.1uF and 1uF) are placed close to each power pin. The 0.6V I/O voltage requires careful signal integrity; keep trace lengths matched and use impedance-controlled routing for high-speed data lines. Refer to the LPDDR4X PCB design guidelines from JEDEC.
Although LPDDR4X is low-power, the CXDB4ABAM can dissipate heat during heavy operation. Ensure adequate thermal vias under the FBGA package and consider airflow in the system design. The operating temperature range should be verified from the datasheet to ensure it meets your application's requirements.
Do not exceed the maximum data rate of 3733 Mbps. Ensure the memory controller is configured for LPDDR4X with correct timing parameters. Verify the power supply voltages (VDD1, VDD2) from the datasheet; incorrect voltages can cause malfunction. Also, follow the recommended power-up sequence to avoid latch-up.
Informations de conformité
RoHS compliant per JLCPCB listing. Other compliance data not available in provided sources.
