EP1K100FC484-2NGZ - ACEX-1K FPGA, 100K Gates, 484-BGA | Intel
Teilenummer: EP1K100FC484-2NGZ ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $95 | $95,00 |
| 10 | $85 | $850,00 |
| 100 | $72 | $7.200,00 |
| 500 | $60 | $30.000,00 |
| 1.000 | $52 | $52.000,00 |
EP1K100FC484-2NGZ Übersicht
An FPGA (Field-Programmable Gate Array) is a class of programmable logic device (PLD) containing an array of configurable logic blocks (CLBs/LABs), programmable interconnect, and I/O cells that the customer can reconfigure in the field after manufacture. FPGAs sit above CPLDs in the programmable-logic hierarchy and below ASICs in terms of per-unit cost versus design flexibility, making them ideal for prototyping, low-to-mid volume production, and applications where time-to-market outweighs NRE. The ACEX-1K family was Altera's first-generation SRAM-based FPGA with embedded memory blocks, and is positioned between the FLEX 6000/8000 and the later APEX/Cyclone families.
Key features of the EP1K100FC484-2NGZ include 4,992 LEs, 49,152 RAM bits organized into embedded array blocks (EABs), 333 maximum user I/O, a 2.375 V to 2.625 V core supply, in-system programmability via the Altera serial configuration scheme, and PCI-compliant I/O. The -2 speed grade is the faster of the two commercial speed grades offered for this die. JTAG (IEEE 1149.1) boundary-scan and dedicated configuration pins are integrated.
Architecturally, the device combines a fine-grained LAB fabric with coarse-grained EAB memory, allowing designers to map both random logic and small FIFOs/ROM/RAM into a single chip. The 0.25 um SRAM process and 2.5 V core (with 3.3 V PCI-tolerant I/O) make this device a representative member of the late-1990s/early-2000s Altera mid-density FPGA portfolio.
Typical applications include telecommunications interface cards, industrial control logic, glue logic and bus bridging on PCI add-in cards, low-volume ASIC replacement, and educational/development platforms that target the legacy MAX+PLUS II or Quartus design flow. The wide 333-I/O budget also suits parallel bus interfaces and backplane bridging.
Design consideration: the EP1K100FC484-2NGZ is now classified Obsolete by some distributors. Verify long-term supply before committing to new designs, and plan a migration path to the Cyclone series if production lifetime requirements exceed 5 years.
This page synthesizes distributor pricing, same-brand drop-in alternatives, lifecycle status and practical design notes not found in the manufacturer datasheet, giving procurement and FPGA engineers a single decision-ready reference.
Drop-in-Alternativen für EP1K100FC484-2NGZ – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit EP1K100FC484-2NGZ (gleiche Bauform und Footprint) – abweichend in Process Technology, Configuration Method, Speed Grade, Operating Temperature, Package.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
EP1K100FC484-2N
✅ Drop-In✓ Auf Lager
$58.4 / Stück
Datenblatt ansehen →EP1K100FC484-2
✅ Drop-In✓ Auf Lager
$33.4 / Stück
Datenblatt ansehen →EP1K100FC484-1N
✅ Drop-In✓ Auf Lager
$58.4 / Stück
Datenblatt ansehen →EP1K100FC484-1
✅ Drop-In✓ Auf Lager
$52.1 / Stück
Datenblatt ansehen →EP1K100FI484-2
✅ Drop-In✓ Auf Lager
$118 / Stück
Datenblatt ansehen →EP1K100EFI484-2
✅ Drop-In✓ Auf Lager
$67.5 / Stück
Datenblatt ansehen →EP1K100FC484-2NGZ Grenzwerte & elektrische Eigenschaften
| Series | ACEX-1K |
| Logic Elements / Cells | 4,992 |
| Number of LABs / CLBs | 624 |
| Total RAM Bits | 49,152 |
| Number of Gates | 257,000 (typical system gates: 100,000) |
| Number of User I/O | 333 |
| Voltage - Supply | 2.375 V to 2.625 V |
| Speed Grade | -2 |
| Betriebstemperatur | 0 C to 70 C (TA) |
| Montageart | Surface Mount |
| Gehäuse / Bauform | 484-FBGA (23 mm x 23 mm) |
| Configuration Method | SRAM, serial (Altera EPC/EPC2) or JTAG |
| JTAG (IEEE 1149.1) | Yes |
| Process Technology | 0.25 um SRAM CMOS |
EP1K100FC484-2NGZ 484-fbga (23 mm x 23 mm) Pinbelegungsleitfaden
Pinbelegung für EP1K100FC484-2NGZ (484-fbga (23 mm x 23 mm)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für EP1K100FC484-2NGZ.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
EP1K100FC484-2NGZ ist geeignet für 6 Anwendungs: Telecom Line-Card Glue Logic, PCI Add-in Card Controller Logic, Industrial Control and Machine Interface, ASIC Replacement / Low-Volume Production, Legacy Development and Education Platforms, Parallel Bus Bridging and Memory Interface.
Telecom Line-Card Glue Logic
The EP1K100FC484-2NGZ fits telecom line cards because its 4,992 LEs and 333 user I/Os are sized exactly for backplane glue, bus-bridging and protocol adaptation between TDM framers, Ethernet MACs and ASIC/ASSP front-ends. The 2.5 V core with PCI-compliant 3.3 V I/O allows direct interface to legacy PCI bus devices without external level shifters. Its 49,152 bits of embedded SRAM in EABs handle small FIFOs and look-up tables for routing tables without external memory, simplifying BOM and reducing board area on dense line cards.
Empfohlen
PCI Add-in Card Controller Logic
The EP1K100FC484-2NGZ is widely deployed on PCI add-in cards because it natively supports 33 MHz/66 MHz, 32-bit/64-bit PCI with on-chip PCI-compliant I/O buffers and the dedicated nCONFIG/nSTATUS/CONF_DONE configuration chain. With 100K gates and 333 I/Os, it implements state machines, scatter-gather DMA engines and bus-master controllers in a single device. The 0-70C commercial temperature grade suits PCI cards installed in climate-controlled servers and desktops; designers should still observe 2.5 V core and 3.3 V PCI signaling rules in timing closure.
Empfohlen
Industrial Control and Machine Interface
For industrial control front-ends and HMI panels, the EP1K100FC484-2NGZ provides enough logic and 333 I/Os to drive parallel LCD/TFT interfaces, keypads, motor-control PWM and serial fieldbus bridges (Modbus, Profibus, CAN) in a single chip. The 49,152-bit on-chip memory stores waveform tables, character fonts and small protocol stacks without external SRAM, reducing BOM cost. Although the commercial 0-70C temperature grade suits panel-internal environments, designs destined for outdoor or factory-floor deployment should select the EP1K100FI484-2 industrial variant.
Empfohlen
ASIC Replacement / Low-Volume Production
The EP1K100FC484-2NGZ is a classic ASIC-replacement vehicle for low-volume production (typically 100 to 10,000 units) where the NRE of a full ASIC is uneconomic. With 100,000 system gates, 49,152 bits of EAB RAM and SRAM-based in-system programmability, designers can iterate firmware-equivalent (bitstream) updates post-deployment via JTAG or Altera EPC configuration ROMs. Although now Obsolete, distributor stock of the EP1K100FC484-2NGZ remains available for re-spin of legacy designs until inventory is exhausted.
Empfohlen
Legacy Development and Education Platforms
The EP1K100FC484-2NGZ remains in university curricula and legacy development kits that teach SRAM-based FPGA architecture, JTAG configuration, and the Altera MAX+PLUS II/Quartus design flow. Its 484-FBGA is large enough for students to practice fine-pitch BGA rework and pin-constrained floorplanning while staying within the 100K-gate complexity sweet spot. Because the part is supported in older Quartus II service packs and legacy MAX+PLUS II software, it is ideal for coursework that targets Altera/Intel legacy FPGA design entry.
Empfohlen
Parallel Bus Bridging and Memory Interface
The EP1K100FC484-2NGZ is well suited to bridge between legacy parallel buses (e.g. PC/104, VME, ISA, proprietary 16/32-bit backplanes) and modern peripherals or processors, thanks to its 333 user I/Os. The 49,152-bit EAB SRAM implements small dual-port buffers and FIFOs that decouple mismatched bus clocks, while 4,992 LEs handle the address decoding, byte-enable logic and interrupt glue. Designers using the part should pay attention to the 2.5 V core and 3.3 V I/O voltage domains and use series-resistor or level-translator techniques for 5 V legacy buses.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für EP1K100FC484-2NGZ – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | EP1K100FC484-2N | EP1K100FC484-2 | EP1K100FC484-1N | EP1K100FI484-2 | EP1K100EFI484-2 |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Package | 484-FBGA (23x23 mm) | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same |
| Series | ACEX-1K | ACEX-1K | ACEX-1K | ACEX-1K | ACEX-1K | ACEX-1K |
| Logic Elements | 4,992 | 4,992 | 4,992 | 4,992 | 4,992 | 4,992 |
| Total RAM Bits | 49,152 | 49,152 | 49,152 | 49,152 | 49,152 | 49,152 |
| User I/O | 333 | 333 | 333 | 333 | 333 | 333 |
| Speed Grade | -2 | -2 | -2 | -1 (slower) | -2 | -2 |
| Operating Temperature | 0 C to 70 C (commercial) | 0 C to 70 C (commercial) | 0 C to 70 C (commercial) | 0 C to 70 C (commercial) | -40 C to +85 C (industrial) | -40 C to +85 C (industrial, enhanced) |
| Supply Voltage | 2.375 V to 2.625 V | 2.375 V to 2.625 V | 2.375 V to 2.625 V | 2.375 V to 2.625 V | 2.375 V to 2.625 V | 2.5 V / 5 V tolerant I/O |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Wichtigste Unterscheidungsmerkmale
- Same die, same 484-FBGA, same -2 speed grade - bit-for-bit drop-in (vs. EP1K100FC484-2N)
- Speed-grade upgrade on the same footprint (vs. EP1K100FC484-1N)
- Industrial-temperature variant on same footprint (vs. EP1K100FI484-2)
- Enhanced industrial variant with 5 V tolerant I/O (vs. EP1K100EFI484-2)
Designhinweise
Estimated: The EP1K100FC484-2NGZ core operates from 2.5 V; I/O banks support 3.3 V PCI signaling. A typical 50% utilization design with all 333 I/Os toggling draws roughly 0.5-1.0 A from the 2.5 V rail, so design the LDO (e.g. 2.5 A buck) with adequate headroom. Decouple each VCCINT/VCCIO ball pair with 0.1 uF plus 10 uF bulk within the ball-grid escape radius.
The 484-FBGA uses 1.0 mm ball pitch on a 23x23 mm body; escape routing requires microvia (HDI) stack-up with at least 4-6-4 build-up layers. Use via-in-pad or dog-bone fan-out per the Altera BGA escape guidelines, and follow the ACEX-1K pin table for VCC/VSS ball placement to keep power planes contiguous.
Configuration mode pins (MSEL0, MSEL1) select between EPC serial, JTAG and Fast Passive Parallel modes - wiring them incorrectly is the #1 reason ACEX-1K boards fail to configure. Also ensure CONF_DONE is pulled high via 10 kohm and nCONFIG/nSTATUS are properly debounced. Without an EPC configuration ROM, the SRAM configuration is lost on every power cycle.
Estimated: at 100% utilization and 333 I/Os switching at 33 MHz PCI, expect 1.5-2.5 W dissipation in still air. The 484-FBGA has no exposed die pad; thermal relief relies on PCB copper pour under the package. Use at least 4 thermal vias (0.3 mm drill) under the central ball grid to inner-plane copper for 15-20 C/W theta_JA improvement.
Compliance-Informationen
"N" suffix historically denotes lead-free terminal finish per Altera/Intel legacy part-number convention, but a current RoHS/REACH CoC must be requested from the distributor. AEC-Q100 not applicable - this is a commercial/industrial FPGA, not an automotive-qualified IC.
