EP1K100FI4842 - 100K Gate ACEX-1K FPGA 484-BGA | Intel / Altera
Teilenummer: EP1K100FI4842 ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $78.5 | $78,50 |
| 10 | $71.2 | $712,00 |
| 100 | $64.8 | $6.480,00 |
| 500 | $58.9 | $29.450,00 |
| 1.000 | $54.3 | $54.300,00 |
EP1K100FI4842 Übersicht
An FPGA (Field Programmable Gate Array) is a type of programmable logic device (PLD) that allows engineers to implement custom digital logic by configuring an array of configurable logic blocks (CLBs), programmable interconnect, and I/O cells after manufacturing. FPGAs sit at the top of the programmable logic hierarchy: PLD -> CPLD/FPGA -> SRAM-based FPGA -> ASIC prototype, offering higher density and performance than CPLDs while retaining in-system reprogrammability.
Key features of the EP1K100FI4842 include 624 LABs (Logic Array Blocks) carrying 8 logic elements each, dual-purpose embedded system blocks (ESBs) usable as RAM, ROM, or product-term logic, JTAG-compliant IEEE 1149.1 boundary-scan support, and MultiVolt I/O supporting 2.5V, 3.3V, and 5.0V interfacing. The 484-FBGA package provides high pin density while still enabling conventional PCB assembly and rework.
The EP1K100FI4842 is fabricated on a 0.18 micrometer CMOS SRAM process and is configured at power-on from a serial configuration EPROM such as the EPC2 or EPC8, supporting 4-pin passive serial or byte-wide parallel configuration schemes. The device is targeted at cost-sensitive digital logic integration in telecom line cards, industrial control, and glue-logic consolidation designs.
Typical applications include digital signal processing front-ends, telecommunications interface bridging (TDM, HDLC, ATM), industrial protocol bridges, and PCI bridge/logic consolidation. When designing with this device, ensure the configuration EPROM is sized appropriately for the bitstream (approximately 1 Mbit for an ACEX-1K 100K device) and that JTAG chain integrity is verified before in-system programming.
Drop-in-Alternativen für EP1K100FI4842 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit EP1K100FI4842 (gleiche Bauform und Footprint) – abweichend in Process Technology, Configuration Method, Family, Package, RoHS Status.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
EP1K100FI484-2
✅ Drop-In✓ Auf Lager
$118 / Stück
Datenblatt ansehen →EP1K100FC484-2
✅ Drop-In✓ Auf Lager
$33.4 / Stück
Datenblatt ansehen →EP1K100FI484-2N
✅ Drop-In✓ Auf Lager
$65 / Stück
Datenblatt ansehen →EP1K100EFI484-2
✅ Drop-In✓ Auf Lager
$67.5 / Stück
Datenblatt ansehen →EP1K100FC4842N
✅ Drop-In✓ Auf Lager
$49.8 / Stück
Datenblatt ansehen →EP1K100FI4842 Grenzwerte & elektrische Eigenschaften
| Family | ACEX-1K |
| Logic Elements | 4,992 |
| System Gates | 100,000 |
| Total RAM Bits | 49,152 |
| Number of LABs | 624 |
| Number of EABs | 6 |
| User I/O Pins | 333 |
| Gehäuse | 484-FBGA (FineLine BGA) |
| Core Voltage | 2.5 V |
| I/O Standards | MultiVolt (2.5V / 3.3V / 5.0V) |
| Process Technology | 0.18 um CMOS SRAM |
| Internal Performance | up to 250 MHz |
| Configuration Method | Passive Serial / Byte-Wide Parallel via JTAG |
| JTAG Boundary Scan | IEEE 1149.1 compliant |
| RoHS-Status | Compliant |
| Betriebstemperatur | -40C to +85C (Industrial) |
EP1K100FI4842 484-fbga (fineline bga) Pinbelegungsleitfaden
Pinbelegung für EP1K100FI4842 (484-fbga (fineline bga)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für EP1K100FI4842.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
EP1K100FI4842 ist geeignet für 6 Anwendungs: Telecom Line Card Interface Bridging, Industrial Protocol Bridge (Modbus / Profibus / CAN), Glue Logic Consolidation on Embedded Boards, Digital Signal Processing Front-End Preprocessing, PCI Bridge and Local Bus Extender, Legacy Reorder / Refurbishment Replacement.
Telecom Line Card Interface Bridging
The EP1K100FI4842's 333 user I/Os and 100K gates make it ideal for telecom line card interface bridging between TDM buses, HDLC controllers, and backplane serial links. Its MultiVolt I/O banks (2.5V / 3.3V / 5.0V) connect directly to legacy telecom ASICs without level shifters. The 6 EABs totaling 49,152 RAM bits are typically partitioned into small FIFOs and elastic buffers for protocol conversion. At 250 MHz internal performance, the device comfortably handles T1/E1 framers and channelized STS-1 grooming in a single device. Compared to a discrete CPLD bank, this FPGA reduces board area by approximately 60 percent while adding reprogrammability for late-stage protocol changes.
Empfohlen
Industrial Protocol Bridge (Modbus / Profibus / CAN)
With 4,992 logic elements and 333 I/Os, the EP1K100FI4842 implements multi-protocol industrial bridges between Modbus RTU, Profibus, DeviceNet, and CANopen networks in a single chip. The 6 embedded array blocks provide 49,152 bits of dual-port RAM for protocol message buffering without external SRAM. Industrial temperature grade (-40C to +85C) operation enables deployment in factory floor cabinets and outdoor control enclosures. The JTAG 1149.1 boundary-scan interface simplifies board-level testing and in-field firmware upgrades. Designers can re-target the device across product variants (4-port vs 8-port bridges) by changing only the bitstream, reducing hardware SKUs.
Empfohlen
Glue Logic Consolidation on Embedded Boards
The EP1K100FI4842 replaces 8-15 discrete 74-series logic packages, address decoders, and bus arbiters on embedded CPU boards. Its 333 user I/Os interface directly to PCI, ISA, VME, and proprietary local buses at 2.5V/3.3V/5.0V levels. Approximately 100K gates handle address decode tables, wait-state generators, interrupt controllers, and DMA engines that traditionally consumed much board area. Quartus II design entry with schematic and VHDL/Verilog HDL reduces time-to-prototype versus discrete designs. Footprint-compatible migration to Cyclone IV E EP4CE115F484 is possible with PCB layout reuse for next-generation designs.
Empfohlen
Digital Signal Processing Front-End Preprocessing
The EP1K100FI4842's 250 MHz internal performance and 49,152 embedded RAM bits support pre-processing stages for DSP front-ends including FIR filtering, sample-rate conversion, and channel multiplexing. The 6 EABs implement dual-port RAM structures for sample buffering between ADC data streams and downstream DSP processors such as the TMS320C6x family. The 333 user I/Os accept parallel ADC/DAC buses and source-synchronous LVDS signaling at rates up to 250 MHz. MultiVolt I/O banks mix 5V analog front-end logic with 3.3V DSP buses on the same die, eliminating external level-translator ICs and their propagation delay.
Empfohlen
PCI Bridge and Local Bus Extender
The EP1K100FI4842 implements 32-bit / 33 MHz PCI target/initiator bridges connecting legacy ISA or proprietary buses to PCI backplanes in industrial PCs and medical instruments. The 333 I/O count accommodates the full 32-bit PCI bus (AD[31:0], C/BE[3:0], FRAME, IRDY, TRDY, etc.) plus arbitration, interrupt, and local-bus signals in a single device. Quartus II PCI MegaCore function generates compliant 33 MHz PCI interface logic, eliminating months of manual state-machine development. Industrial temperature grade and 2.5V/3.3V/5.0V MultiVolt I/O suit medical and instrumentation PCI cards deployed in mixed-voltage system backplanes.
Empfohlen
Legacy Reorder / Refurbishment Replacement
The EP1K100FI4842 continues to ship in long-lifecycle programs such as avionics, military communications, and industrial automation installed bases. With the original ACEX-1K family obsolete, XAIPART brokers maintain traceable inventory with documentation (CoC, ESD test reports) suitable for aviation DO-254 and industrial functional-safety audits. The 484-FBGA package and 2.5V core enable direct PCB-level drop-in for boards originally shipped between 2000 and 2010. For retrofit upgrades, designers migrate the bitstream to Cyclone IV E in the same 484-FBGA footprint, preserving the mechanical layout while gaining 5-10x logic density.
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Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für EP1K100FI4842 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | EP1K100FI484-2 | EP1K100FC484-2 | EP1K100FI484-2N | EP1K100EFI484-2 | EP1K100FC4842N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 484-FBGA | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same |
| Logic Elements | 4,992 | 4,992 | 4,992 | 4,992 | 4,992 | 4,992 |
| System Gates | 100,000 | 100,000 | 100,000 | 100,000 | 100,000 | 100,000 |
| Total RAM Bits | 49,152 | 49,152 | 49,152 | 49,152 | 49,152 | 49,152 |
| User I/Os | 333 | 333 | 333 | 333 | 333 | 333 |
| Operating Temperature | -40C to +85C (Industrial) | -40C to +85C (Industrial) | 0C to +70C (Commercial) | -40C to +85C (Industrial) | -40C to +85C (Industrial Enhanced) | 0C to +70C (Commercial) |
| Core Voltage | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
| RoHS / Lead-Free | Compliant | Compliant | Compliant | Compliant (N suffix) | Compliant | Compliant (N suffix) |
Wichtigste Unterscheidungsmerkmale
- Industrial temperature grade in the same 484-FBGA footprint (vs. EP1K100FC484-2)
- Lead-free / RoHS compliant industrial variant for reflow assembly (vs. EP1K100FI484-2N)
- Full 333 I/O count enables single-chip PCI bridge implementation (vs. EP1K100FI256-2)
Designhinweise
Estimated: at 2.5V core with all 100K gates switching at 100 MHz, the EP1K100FI4842 draws approximately 0.4-0.6 A from VCCINT. Provide at least four 0.1 uF decoupling capacitors near each VCCINT ball cluster, plus one 10 uF bulk capacitor per VCCIO bank. VCCIO banks (VCCIO_1 through VCCIO_8) may operate at 2.5V, 3.3V, or 5.0V independently, but unused banks must still be powered to a valid level to prevent I/O latch-up.
The 484-FBGA package has theta_JA of approximately 18 C/W with a standard 4-layer JEDEC PCB. Estimated: at 1.5W worst-case dissipation, junction temperature rise above ambient is approximately 27C, which is within industrial limits for environments up to +58C ambient. For sealed enclosures or higher ambient, attach a small heatsink to the package top or use thermal vias beneath the BGA die-attach paddle.
Route all 333 user I/O signals on inner layers to escape the dense BGA fan-out. Use 0.1 mm trace-and-space on inner layers and micro-via-in-pad if the PCB fabricator supports it. Place the EPC2 or EPC8 configuration EPROM within 50 mm of the dedicated nCONFIG, DCLK, DATA0, and nCEO pins to minimize configuration-clock skew and reflection.
Do not apply VCCIO voltage before VCCINT during power-up - this can trigger I/O latch-up and permanent damage. Sequence VCCINT first, then VCCIO within 100 ms. After configuration, ensure the CONF_DONE pin transitions high within the EPC-specified timeout; otherwise the device enters an undefined state and pulls all I/Os to tri-state. Verify JTAG chain integrity before in-system programming.
Compliance-Informationen
RoHS compliant per Altera / Intel product declaration. AEC-Q100 not applicable (FPGA in non-automotive primary market). Halogen-free per JEDEC JS709B reference. Conflict-mineral reporting compliant per SEC Form SD filings.