EP1K100FI4842 - 100K Gate ACEX-1K FPGA 484-BGA | Intel / Altera
Référence : EP1K100FI4842 ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $78.5 | $78,50 |
| 10 | $71.2 | $712,00 |
| 100 | $64.8 | $6 480,00 |
| 500 | $58.9 | $29 450,00 |
| 1 000 | $54.3 | $54 300,00 |
EP1K100FI4842 Présentation
An FPGA (Field Programmable Gate Array) is a type of programmable logic device (PLD) that allows engineers to implement custom digital logic by configuring an array of configurable logic blocks (CLBs), programmable interconnect, and I/O cells after manufacturing. FPGAs sit at the top of the programmable logic hierarchy: PLD -> CPLD/FPGA -> SRAM-based FPGA -> ASIC prototype, offering higher density and performance than CPLDs while retaining in-system reprogrammability.
Key features of the EP1K100FI4842 include 624 LABs (Logic Array Blocks) carrying 8 logic elements each, dual-purpose embedded system blocks (ESBs) usable as RAM, ROM, or product-term logic, JTAG-compliant IEEE 1149.1 boundary-scan support, and MultiVolt I/O supporting 2.5V, 3.3V, and 5.0V interfacing. The 484-FBGA package provides high pin density while still enabling conventional PCB assembly and rework.
The EP1K100FI4842 is fabricated on a 0.18 micrometer CMOS SRAM process and is configured at power-on from a serial configuration EPROM such as the EPC2 or EPC8, supporting 4-pin passive serial or byte-wide parallel configuration schemes. The device is targeted at cost-sensitive digital logic integration in telecom line cards, industrial control, and glue-logic consolidation designs.
Typical applications include digital signal processing front-ends, telecommunications interface bridging (TDM, HDLC, ATM), industrial protocol bridges, and PCI bridge/logic consolidation. When designing with this device, ensure the configuration EPROM is sized appropriately for the bitstream (approximately 1 Mbit for an ACEX-1K 100K device) and that JTAG chain integrity is verified before in-system programming.
Alternatives de remplacement direct pour EP1K100FI4842 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP1K100FI4842 (même facteur de forme et même empreinte) — différant par Process Technology, Configuration Method, Family, Package, RoHS Status.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP1K100FI484-2
✅ Remplacement direct✓ En stock
$118 / unité
Voir la fiche technique →EP1K100FC484-2
✅ Remplacement direct✓ En stock
$33.4 / unité
Voir la fiche technique →EP1K100FI484-2N
✅ Remplacement direct✓ En stock
$65 / unité
Voir la fiche technique →EP1K100EFI484-2
✅ Remplacement direct✓ En stock
$67.5 / unité
Voir la fiche technique →EP1K100FC4842N
✅ Remplacement direct✓ En stock
$49.8 / unité
Voir la fiche technique →EP1K100FI4842 Valeurs maximales et caractéristiques électriques
| Family | ACEX-1K |
| Logic Elements | 4,992 |
| System Gates | 100,000 |
| Total RAM Bits | 49,152 |
| Number of LABs | 624 |
| Number of EABs | 6 |
| User I/O Pins | 333 |
| Boîtier | 484-FBGA (FineLine BGA) |
| Core Voltage | 2.5 V |
| I/O Standards | MultiVolt (2.5V / 3.3V / 5.0V) |
| Process Technology | 0.18 um CMOS SRAM |
| Internal Performance | up to 250 MHz |
| Configuration Method | Passive Serial / Byte-Wide Parallel via JTAG |
| JTAG Boundary Scan | IEEE 1149.1 compliant |
| Statut RoHS | Compliant |
| Température de fonctionnement | -40C to +85C (Industrial) |
Guide de configuration des broches du EP1K100FI4842 484-fbga (fineline bga)
Configuration des broches du EP1K100FI4842 (boîtier 484-fbga (fineline bga)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour EP1K100FI4842.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
EP1K100FI4842 convient pour 6 applications: Telecom Line Card Interface Bridging, Industrial Protocol Bridge (Modbus / Profibus / CAN), Glue Logic Consolidation on Embedded Boards, Digital Signal Processing Front-End Preprocessing, PCI Bridge and Local Bus Extender, Legacy Reorder / Refurbishment Replacement.
Telecom Line Card Interface Bridging
The EP1K100FI4842's 333 user I/Os and 100K gates make it ideal for telecom line card interface bridging between TDM buses, HDLC controllers, and backplane serial links. Its MultiVolt I/O banks (2.5V / 3.3V / 5.0V) connect directly to legacy telecom ASICs without level shifters. The 6 EABs totaling 49,152 RAM bits are typically partitioned into small FIFOs and elastic buffers for protocol conversion. At 250 MHz internal performance, the device comfortably handles T1/E1 framers and channelized STS-1 grooming in a single device. Compared to a discrete CPLD bank, this FPGA reduces board area by approximately 60 percent while adding reprogrammability for late-stage protocol changes.
Recommandé
Industrial Protocol Bridge (Modbus / Profibus / CAN)
With 4,992 logic elements and 333 I/Os, the EP1K100FI4842 implements multi-protocol industrial bridges between Modbus RTU, Profibus, DeviceNet, and CANopen networks in a single chip. The 6 embedded array blocks provide 49,152 bits of dual-port RAM for protocol message buffering without external SRAM. Industrial temperature grade (-40C to +85C) operation enables deployment in factory floor cabinets and outdoor control enclosures. The JTAG 1149.1 boundary-scan interface simplifies board-level testing and in-field firmware upgrades. Designers can re-target the device across product variants (4-port vs 8-port bridges) by changing only the bitstream, reducing hardware SKUs.
Recommandé
Glue Logic Consolidation on Embedded Boards
The EP1K100FI4842 replaces 8-15 discrete 74-series logic packages, address decoders, and bus arbiters on embedded CPU boards. Its 333 user I/Os interface directly to PCI, ISA, VME, and proprietary local buses at 2.5V/3.3V/5.0V levels. Approximately 100K gates handle address decode tables, wait-state generators, interrupt controllers, and DMA engines that traditionally consumed much board area. Quartus II design entry with schematic and VHDL/Verilog HDL reduces time-to-prototype versus discrete designs. Footprint-compatible migration to Cyclone IV E EP4CE115F484 is possible with PCB layout reuse for next-generation designs.
Recommandé
Digital Signal Processing Front-End Preprocessing
The EP1K100FI4842's 250 MHz internal performance and 49,152 embedded RAM bits support pre-processing stages for DSP front-ends including FIR filtering, sample-rate conversion, and channel multiplexing. The 6 EABs implement dual-port RAM structures for sample buffering between ADC data streams and downstream DSP processors such as the TMS320C6x family. The 333 user I/Os accept parallel ADC/DAC buses and source-synchronous LVDS signaling at rates up to 250 MHz. MultiVolt I/O banks mix 5V analog front-end logic with 3.3V DSP buses on the same die, eliminating external level-translator ICs and their propagation delay.
Recommandé
PCI Bridge and Local Bus Extender
The EP1K100FI4842 implements 32-bit / 33 MHz PCI target/initiator bridges connecting legacy ISA or proprietary buses to PCI backplanes in industrial PCs and medical instruments. The 333 I/O count accommodates the full 32-bit PCI bus (AD[31:0], C/BE[3:0], FRAME, IRDY, TRDY, etc.) plus arbitration, interrupt, and local-bus signals in a single device. Quartus II PCI MegaCore function generates compliant 33 MHz PCI interface logic, eliminating months of manual state-machine development. Industrial temperature grade and 2.5V/3.3V/5.0V MultiVolt I/O suit medical and instrumentation PCI cards deployed in mixed-voltage system backplanes.
Recommandé
Legacy Reorder / Refurbishment Replacement
The EP1K100FI4842 continues to ship in long-lifecycle programs such as avionics, military communications, and industrial automation installed bases. With the original ACEX-1K family obsolete, XAIPART brokers maintain traceable inventory with documentation (CoC, ESD test reports) suitable for aviation DO-254 and industrial functional-safety audits. The 484-FBGA package and 2.5V core enable direct PCB-level drop-in for boards originally shipped between 2000 and 2010. For retrofit upgrades, designers migrate the bitstream to Cyclone IV E in the same 484-FBGA footprint, preserving the mechanical layout while gaining 5-10x logic density.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP1K100FI4842 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP1K100FI484-2 | EP1K100FC484-2 | EP1K100FI484-2N | EP1K100EFI484-2 | EP1K100FC4842N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 484-FBGA | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same |
| Logic Elements | 4,992 | 4,992 | 4,992 | 4,992 | 4,992 | 4,992 |
| System Gates | 100,000 | 100,000 | 100,000 | 100,000 | 100,000 | 100,000 |
| Total RAM Bits | 49,152 | 49,152 | 49,152 | 49,152 | 49,152 | 49,152 |
| User I/Os | 333 | 333 | 333 | 333 | 333 | 333 |
| Operating Temperature | -40C to +85C (Industrial) | -40C to +85C (Industrial) | 0C to +70C (Commercial) | -40C to +85C (Industrial) | -40C to +85C (Industrial Enhanced) | 0C to +70C (Commercial) |
| Core Voltage | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
| RoHS / Lead-Free | Compliant | Compliant | Compliant | Compliant (N suffix) | Compliant | Compliant (N suffix) |
Principaux différenciateurs
- Industrial temperature grade in the same 484-FBGA footprint (vs EP1K100FC484-2)
- Lead-free / RoHS compliant industrial variant for reflow assembly (vs EP1K100FI484-2N)
- Full 333 I/O count enables single-chip PCI bridge implementation (vs EP1K100FI256-2)
Notes de conception
Estimated: at 2.5V core with all 100K gates switching at 100 MHz, the EP1K100FI4842 draws approximately 0.4-0.6 A from VCCINT. Provide at least four 0.1 uF decoupling capacitors near each VCCINT ball cluster, plus one 10 uF bulk capacitor per VCCIO bank. VCCIO banks (VCCIO_1 through VCCIO_8) may operate at 2.5V, 3.3V, or 5.0V independently, but unused banks must still be powered to a valid level to prevent I/O latch-up.
The 484-FBGA package has theta_JA of approximately 18 C/W with a standard 4-layer JEDEC PCB. Estimated: at 1.5W worst-case dissipation, junction temperature rise above ambient is approximately 27C, which is within industrial limits for environments up to +58C ambient. For sealed enclosures or higher ambient, attach a small heatsink to the package top or use thermal vias beneath the BGA die-attach paddle.
Route all 333 user I/O signals on inner layers to escape the dense BGA fan-out. Use 0.1 mm trace-and-space on inner layers and micro-via-in-pad if the PCB fabricator supports it. Place the EPC2 or EPC8 configuration EPROM within 50 mm of the dedicated nCONFIG, DCLK, DATA0, and nCEO pins to minimize configuration-clock skew and reflection.
Do not apply VCCIO voltage before VCCINT during power-up - this can trigger I/O latch-up and permanent damage. Sequence VCCINT first, then VCCIO within 100 ms. After configuration, ensure the CONF_DONE pin transitions high within the EPC-specified timeout; otherwise the device enters an undefined state and pulls all I/Os to tri-state. Verify JTAG chain integrity before in-system programming.
Informations de conformité
RoHS compliant per Altera / Intel product declaration. AEC-Q100 not applicable (FPGA in non-automotive primary market). Halogen-free per JEDEC JS709B reference. Conflict-mineral reporting compliant per SEC Form SD filings.