EP1K100FI4842 - 100K Gate ACEX-1K FPGA 484-BGA | Intel / Altera
MPN: EP1K100FI4842 ✗ اختتامِ زندگیEP1K100FI4842 جائزہ
An FPGA (Field Programmable Gate Array) is a type of programmable logic device (PLD) that allows engineers to implement custom digital logic by configuring an array of configurable logic blocks (CLBs), programmable interconnect, and I/O cells after manufacturing. FPGAs sit at the top of the programmable logic hierarchy: PLD -> CPLD/FPGA -> SRAM-based FPGA -> ASIC prototype, offering higher density and performance than CPLDs while retaining in-system reprogrammability.
Key features of the EP1K100FI4842 include 624 LABs (Logic Array Blocks) carrying 8 logic elements each, dual-purpose embedded system blocks (ESBs) usable as RAM, ROM, or product-term logic, JTAG-compliant IEEE 1149.1 boundary-scan support, and MultiVolt I/O supporting 2.5V, 3.3V, and 5.0V interfacing. The 484-FBGA package provides high pin density while still enabling conventional PCB assembly and rework.
The EP1K100FI4842 is fabricated on a 0.18 micrometer CMOS SRAM process and is configured at power-on from a serial configuration EPROM such as the EPC2 or EPC8, supporting 4-pin passive serial or byte-wide parallel configuration schemes. The device is targeted at cost-sensitive digital logic integration in telecom line cards, industrial control, and glue-logic consolidation designs.
Typical applications include digital signal processing front-ends, telecommunications interface bridging (TDM, HDLC, ATM), industrial protocol bridges, and PCI bridge/logic consolidation. When designing with this device, ensure the configuration EPROM is sized appropriately for the bitstream (approximately 1 Mbit for an ACEX-1K 100K device) and that JTAG chain integrity is verified before in-system programming.
کے لیے ڈراپ اِن متبادل EP1K100FI4842 — یکساں پیکیج، پن سے پن مطابقت پذیر۔ مختلف پیکیج والے پرزے جن کے لیے PCB دوبارہ کام درکار ہو، شامل نہیں ہیں۔
اس سیریز میں مختلف ورژن
اسی سیریز کے ماڈلز جو ڈراپ اِن مطابقت رکھتے ہیں EP1K100FI4842 (یکساں فارم فیکٹر اور فٹ پرنٹ) — میں مختلف Process Technology, Configuration Method, Family, Package, RoHS Status.
EP1K100FI484-2
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EP1K100FC484-2
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EP1K100FI484-2N
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EP1K100EFI484-2
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EP1K100FC4842N
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EP1K100FI4842 زیادہ سے زیادہ ریٹنگز اور برقی خصوصیات
| Family | ACEX-1K |
| Logic Elements | 4,992 |
| System Gates | 100,000 |
| Total RAM Bits | 49,152 |
| Number of LABs | 624 |
| Number of EABs | 6 |
| User I/O Pins | 333 |
| پیکیج | 484-FBGA (FineLine BGA) |
| Core Voltage | 2.5 V |
| I/O Standards | MultiVolt (2.5V / 3.3V / 5.0V) |
| Process Technology | 0.18 um CMOS SRAM |
| Internal Performance | up to 250 MHz |
| Configuration Method | Passive Serial / Byte-Wide Parallel via JTAG |
| JTAG Boundary Scan | IEEE 1149.1 compliant |
| RoHS اسٹیٹس | Compliant |
| آپریٹنگ درجہ حرارت | -40C to +85C (Industrial) |
EP1K100FI4842 484-fbga (fineline bga) پن کنفیگریشن گائیڈ
EP1K100FI4842 (484-fbga (fineline bga) پیکیج) کے لیے پن کنفیگریشن۔ اس ڈیجیٹل IC میں GPIO، کمیونیکیشن انٹرفیس (UART، SPI، I2C) اور پاور پنز شامل ہیں۔ متبادل پن فنکشنز اور کنفیگریشن آپشنز کے لیے مینوفیکچرر کے ڈیٹا شیٹ سے رجوع کریں۔ ایمبیڈڈ سسٹم ڈیزائن اور PCB لے آؤٹ کے لیے ضروری۔
کے لیے تفصیلی پن آؤٹ ڈیٹا دستیاب نہیں EP1K100FI4842.
رجوع کریں ڈیٹا شیٹ مکمل پن کنفیگریشن کے لیے۔
عام استعمالات
EP1K100FI4842 کے لیے موزوں ہے 6 ایپلیکیشنs: Telecom Line Card Interface Bridging, Industrial Protocol Bridge (Modbus / Profibus / CAN), Glue Logic Consolidation on Embedded Boards, Digital Signal Processing Front-End Preprocessing, PCI Bridge and Local Bus Extender, Legacy Reorder / Refurbishment Replacement.
Telecom Line Card Interface Bridging
The EP1K100FI4842's 333 user I/Os and 100K gates make it ideal for telecom line card interface bridging between TDM buses, HDLC controllers, and backplane serial links. Its MultiVolt I/O banks (2.5V / 3.3V / 5.0V) connect directly to legacy telecom ASICs without level shifters. The 6 EABs totaling 49,152 RAM bits are typically partitioned into small FIFOs and elastic buffers for protocol conversion. At 250 MHz internal performance, the device comfortably handles T1/E1 framers and channelized STS-1 grooming in a single device. Compared to a discrete CPLD bank, this FPGA reduces board area by approximately 60 percent while adding reprogrammability for late-stage protocol changes.
تجویز کردہ
Industrial Protocol Bridge (Modbus / Profibus / CAN)
With 4,992 logic elements and 333 I/Os, the EP1K100FI4842 implements multi-protocol industrial bridges between Modbus RTU, Profibus, DeviceNet, and CANopen networks in a single chip. The 6 embedded array blocks provide 49,152 bits of dual-port RAM for protocol message buffering without external SRAM. Industrial temperature grade (-40C to +85C) operation enables deployment in factory floor cabinets and outdoor control enclosures. The JTAG 1149.1 boundary-scan interface simplifies board-level testing and in-field firmware upgrades. Designers can re-target the device across product variants (4-port vs 8-port bridges) by changing only the bitstream, reducing hardware SKUs.
تجویز کردہ
Glue Logic Consolidation on Embedded Boards
The EP1K100FI4842 replaces 8-15 discrete 74-series logic packages, address decoders, and bus arbiters on embedded CPU boards. Its 333 user I/Os interface directly to PCI, ISA, VME, and proprietary local buses at 2.5V/3.3V/5.0V levels. Approximately 100K gates handle address decode tables, wait-state generators, interrupt controllers, and DMA engines that traditionally consumed much board area. Quartus II design entry with schematic and VHDL/Verilog HDL reduces time-to-prototype versus discrete designs. Footprint-compatible migration to Cyclone IV E EP4CE115F484 is possible with PCB layout reuse for next-generation designs.
تجویز کردہ
Digital Signal Processing Front-End Preprocessing
The EP1K100FI4842's 250 MHz internal performance and 49,152 embedded RAM bits support pre-processing stages for DSP front-ends including FIR filtering, sample-rate conversion, and channel multiplexing. The 6 EABs implement dual-port RAM structures for sample buffering between ADC data streams and downstream DSP processors such as the TMS320C6x family. The 333 user I/Os accept parallel ADC/DAC buses and source-synchronous LVDS signaling at rates up to 250 MHz. MultiVolt I/O banks mix 5V analog front-end logic with 3.3V DSP buses on the same die, eliminating external level-translator ICs and their propagation delay.
تجویز کردہ
PCI Bridge and Local Bus Extender
The EP1K100FI4842 implements 32-bit / 33 MHz PCI target/initiator bridges connecting legacy ISA or proprietary buses to PCI backplanes in industrial PCs and medical instruments. The 333 I/O count accommodates the full 32-bit PCI bus (AD[31:0], C/BE[3:0], FRAME, IRDY, TRDY, etc.) plus arbitration, interrupt, and local-bus signals in a single device. Quartus II PCI MegaCore function generates compliant 33 MHz PCI interface logic, eliminating months of manual state-machine development. Industrial temperature grade and 2.5V/3.3V/5.0V MultiVolt I/O suit medical and instrumentation PCI cards deployed in mixed-voltage system backplanes.
تجویز کردہ
Legacy Reorder / Refurbishment Replacement
The EP1K100FI4842 continues to ship in long-lifecycle programs such as avionics, military communications, and industrial automation installed bases. With the original ACEX-1K family obsolete, XAIPART brokers maintain traceable inventory with documentation (CoC, ESD test reports) suitable for aviation DO-254 and industrial functional-safety audits. The 484-FBGA package and 2.5V core enable direct PCB-level drop-in for boards originally shipped between 2000 and 2010. For retrofit upgrades, designers migrate the bitstream to Cyclone IV E in the same 484-FBGA footprint, preserving the mechanical layout while gaining 5-10x logic density.
تجویز کردہ
تجویز کردہ پروڈکٹس کا خلاصہ
کے لیے انجینئرنگ ریفرنس ڈیٹا EP1K100FI4842 — موازنہ، ڈیزائن رہنمائی، اور تعمیل کی معلومات۔
انتخاب کی گائیڈ
متبادلات کے ساتھ موازنہ
| پیرامیٹر | یہ پروڈکٹ | EP1K100FI484-2 | EP1K100FC484-2 | EP1K100FI484-2N | EP1K100EFI484-2 | EP1K100FC4842N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 484-FBGA | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same |
| Logic Elements | 4,992 | 4,992 | 4,992 | 4,992 | 4,992 | 4,992 |
| System Gates | 100,000 | 100,000 | 100,000 | 100,000 | 100,000 | 100,000 |
| Total RAM Bits | 49,152 | 49,152 | 49,152 | 49,152 | 49,152 | 49,152 |
| User I/Os | 333 | 333 | 333 | 333 | 333 | 333 |
| Operating Temperature | -40C to +85C (Industrial) | -40C to +85C (Industrial) | 0C to +70C (Commercial) | -40C to +85C (Industrial) | -40C to +85C (Industrial Enhanced) | 0C to +70C (Commercial) |
| Core Voltage | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
| RoHS / Lead-Free | Compliant | Compliant | Compliant | Compliant (N suffix) | Compliant | Compliant (N suffix) |
اہم امتیازی خصوصیات
- Industrial temperature grade in the same 484-FBGA footprint (بمقابلہEP1K100FC484-2)
- Lead-free / RoHS compliant industrial variant for reflow assembly (بمقابلہEP1K100FI484-2N)
- Full 333 I/O count enables single-chip PCI bridge implementation (بمقابلہEP1K100FI256-2)
ڈیزائن نوٹس
Estimated: at 2.5V core with all 100K gates switching at 100 MHz, the EP1K100FI4842 draws approximately 0.4-0.6 A from VCCINT. Provide at least four 0.1 uF decoupling capacitors near each VCCINT ball cluster, plus one 10 uF bulk capacitor per VCCIO bank. VCCIO banks (VCCIO_1 through VCCIO_8) may operate at 2.5V, 3.3V, or 5.0V independently, but unused banks must still be powered to a valid level to prevent I/O latch-up.
The 484-FBGA package has theta_JA of approximately 18 C/W with a standard 4-layer JEDEC PCB. Estimated: at 1.5W worst-case dissipation, junction temperature rise above ambient is approximately 27C, which is within industrial limits for environments up to +58C ambient. For sealed enclosures or higher ambient, attach a small heatsink to the package top or use thermal vias beneath the BGA die-attach paddle.
Route all 333 user I/O signals on inner layers to escape the dense BGA fan-out. Use 0.1 mm trace-and-space on inner layers and micro-via-in-pad if the PCB fabricator supports it. Place the EPC2 or EPC8 configuration EPROM within 50 mm of the dedicated nCONFIG, DCLK, DATA0, and nCEO pins to minimize configuration-clock skew and reflection.
Do not apply VCCIO voltage before VCCINT during power-up - this can trigger I/O latch-up and permanent damage. Sequence VCCINT first, then VCCIO within 100 ms. After configuration, ensure the CONF_DONE pin transitions high within the EPC-specified timeout; otherwise the device enters an undefined state and pulls all I/Os to tri-state. Verify JTAG chain integrity before in-system programming.
تعمیل کی معلومات
RoHS compliant per Altera / Intel product declaration. AEC-Q100 not applicable (FPGA in non-automotive primary market). Halogen-free per JEDEC JS709B reference. Conflict-mineral reporting compliant per SEC Form SD filings.