EP1SGX10CF672C6N - Stratix GX FPGA, 10,570 Cells, 672-FBGA | Intel
Teilenummer: EP1SGX10CF672C6N ⚠ Letzte Bestellmöglichkeit| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $285 | $285,00 |
| 10 | $245 | $2.450,00 |
| 25 | $215 | $5.375,00 |
| 100 | $178 | $17.800,00 |
| 250 | $152 | $38.000,00 |
EP1SGX10CF672C6N Übersicht
A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit consisting of an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated silicon blocks such as block RAM, DSP multipliers, PLLs, and (in the Stratix GX family) multi-gigabit transceivers. Within the broader taxonomy, FPGAs sit alongside ASICs and CPLDs in the programmable logic segment, which itself belongs to the digital logic IC hierarchy and ultimately the integrated circuit family of semiconductor products. The Stratix GX variant specifically adds 3.125 Gbps-class transceivers, making it the predecessor to today's Stratix II GX and Stratix IV GX transceiver families.
Key features include 920,448 bits of embedded RAM, dedicated DSP blocks for high-throughput arithmetic, support for multiple I/O standards (LVDS, LVTTL, LVCMOS, SSTL, HSTL, PCI, PCI-X), and up to 20 global clock networks. The 'CF672' suffix denotes the 672-pin FineLine BGA package with 1.0 mm pitch and 33 × 33 mm body, 'C6' denotes the commercial speed grade, and 'N' indicates lead-free / RoHS-compliant lead finish.
From an architectural standpoint, the EP1SGX10CF672C6N integrates Look-Up Table (LUT)-based logic, TriMatrix embedded memory (MLAB, M512, M4K blocks), DSP blocks, and the high-speed transceiver interface that defined the Stratix GX family's value proposition in 2003-2006. The architecture supports partial reconfiguration and remote system upgrades via passive serial, fast passive parallel, and JTAG configuration modes.
Typical applications include 1 Gbps / 2 Gbps / 4 Gbps backplane interfaces, SONET/SDH framer designs, SERDES aggregation in switch fabrics, high-speed serial protocol bridging (PCIe Gen1, XAUI, Fibre Channel, SATA), and high-end test and measurement instrumentation. The dedicated transceiver circuitry also made it a frequent choice for early-generation serial RapidIO and SFI-4 designs.
When designing with this part, carefully validate the transceiver reference clocking scheme and the PCB BGA fanout — 672 balls at 1.0 mm pitch require 4-6 layer stackups with microvia or laser-drilled via technology for breakout. The 'C6' speed grade is the mid-tier performance bin; designers seeking the fastest Fmax should consider the C7 grade (with appropriate NRE cost) while power-optimized designs can drop to C5.
This page synthesizes distributor pricing across 15+ sources, parametric drop-in alternatives within the Stratix and Stratix II families, and practical design notes that go beyond the manufacturer datasheet's typical application section.
Drop-in-Alternativen für EP1SGX10CF672C6N – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit EP1SGX10CF672C6N (gleiche Bauform und Footprint) – abweichend in Operating Temperature, Package, Speed Grade, RoHS Status, Family.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
EP1SGX10CF672C7N
✅ Drop-In✓ Auf Lager
$182.1 / Stück
Datenblatt ansehen →EP1SGX10CF672C5N
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
EP1SGX10DF672C7N
✅ Drop-In✓ Auf Lager
Preis auf Anfrage
Datenblatt ansehen →EP1SGX25CF672C6N
✅ Drop-In✓ Auf Lager
$210 / Stück
Datenblatt ansehen →EP1SGX25CF672C7N
✅ Drop-In✓ Auf Lager
$338.5 / Stück
Datenblatt ansehen →EP1S25F672C6N
✅ Drop-In✓ Auf Lager
$192.75 / Stück
Datenblatt ansehen →EP1SGX10CF672C6N Grenzwerte & elektrische Eigenschaften
| Series | Stratix GX |
| Logic Family | CMOS, SRAM-based FPGA |
| Process Technology | 130 nm |
| Number of Logic Cells | 10,570 |
| Number of LABs/CLBs | 1,057 |
| Total RAM Bits | 920,448 |
| Number of I/O | 362 |
| Supply Voltage (Core) | 1.5 V |
| Betriebstemperatur | 0 °C to 85 °C |
| Package Type | 672-BBGA / FineLine FBGA |
| Package Dimensions | 33 × 33 mm, 1.0 mm pitch |
| Pin/Ball Count | 672 |
| Montageart | Surface Mount |
| Maximum Frequency | 500 MHz |
| Speed Grade | C6 (mid-tier) |
| RoHS-Status | Lead-free (N suffix) |
EP1SGX10CF672C6N 33 × 33 mm, 1.0 mm pitch Pinbelegungsleitfaden
Pinbelegung für EP1SGX10CF672C6N (33 × 33 mm, 1.0 mm pitch-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für EP1SGX10CF672C6N.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
EP1SGX10CF672C6N ist geeignet für 6 Anwendungs: 1G/2G/4G Backplane Interface, SONET/SDH Framer Implementation, PCIe Gen1 Endpoint, High-Speed Test & Measurement, Serial RapidIO Switch Fabric, Fibre Channel Host Bus Adapter.
1G/2G/4G Backplane Interface
The EP1SGX10CF672C6N's embedded 3.125 Gbps-class multi-gigabit transceivers make it a natural fit for 1G/2G/4G serial backplane interfaces in 2004-2008 era telecom switching and routing equipment. The device supports multiple transceiver channels per row with integrated 8B/10B encoding, word alignment, and clock data recovery, eliminating external SERDES PHY chips. With 10,570 logic cells and 920 Kbit of TriMatrix RAM, it can implement MAC-layer processing, channel bonding, and link-layer state machines on a single device. For backplane designs the FPGA typically interfaces to line-card ASICs via XAUI (4 × 3.125 Gbps) or to SFP modules directly via SFI. Designers should allocate at least 4 transceiver channels plus reference clocking and pay close attention to PCB channel loss budgets at 3.125 Gbps.
Empfohlen
SONET/SDH Framer Implementation
The EP1SGX10CF672C6N was widely deployed in SONET OC-48 / SDH STM-16 framer designs operating at 2.488 Gbps, where its transceiver channels and DSP blocks provided the necessary overhead processing, scrambling/descrambling, and pointer-adjustment state machines. The 10,570 logic cells are sufficient to implement a single OC-48 framer with full TOH (Transport Overhead) and POH (Path Overhead) processing, while 920 Kbit of embedded RAM accommodates multiple frame buffers. The 362 user I/Os connect to backplane framers, clock recovery units, and telecom backplane serializers. Compared to ASIC implementations, the FPGA offered faster time-to-market for emerging GFP (Generic Framing Procedure) and LCAS (Link Capacity Adjustment Scheme) standards.
Empfohlen
PCIe Gen1 Endpoint
The EP1SGX10CF672C6N can implement a PCIe Gen1 (2.5 Gbps) endpoint with x1 or x4 lane configurations using its embedded transceivers plus the PCIe hard IP block available in the Stratix GX family. The device's 362 user I/Os provide ample connectivity for application-layer interfaces to memory (DDR/DDR2), host processors, or custom peripherals. Typical applications include instrumentation cards, video capture boards, and storage controllers. Designers must use the Stratix GX PCIe Hard IP Compiler and pay careful attention to transmit pre-emphasis and receive equalization settings to meet PCIe channel compliance. The 672-BGA package's 1.0 mm pitch supports the BGA escape required for x4 PCIe lane routing.
Empfohlen
High-Speed Test & Measurement
The EP1SGX10CF672C6N is well-suited for high-speed test and measurement instruments including logic analyzers, protocol analyzers, and BERT (Bit Error Rate Tester) equipment. Its multi-gigabit transceivers handle 3.125 Gbps data capture, while the 10,570 logic cells and DSP blocks implement pattern generation, error counting, and protocol-aware decoding. The 920 Kbit of embedded RAM provides deep capture buffers for protocol analysis, and the 362 user I/Os interface to high-speed ADCs, DACs, and display controllers. The commercial 0°C to 85°C operating range is adequate for laboratory environments, and the 672-BGA package supports thermal management via BGA-bottom thermal pad attachment for sustained measurement workloads.
Empfohlen
Serial RapidIO Switch Fabric
Serial RapidIO (sRIO) switch fabrics and endpoint devices were a common deployment of the EP1SGX10CF672C6N in wireless base station and DSP-cluster applications circa 2005-2010. The FPGA's transceivers support sRIO 1x/4x lane configurations at 1.25 / 2.5 / 3.125 Gbps, while the logic fabric implements the logical, transport, and physical layer functions plus DMA engines and message-passing state machines. With 10,570 logic cells, the device serves as either a 4-port sRIO switch or a single-port endpoint with substantial DSP co-processing. The 672-BGA package's signal integrity characteristics are well-matched to sRIO channel requirements, though designers must still apply Tx pre-emphasis and Rx equalization per the sRIO spec.
Empfohlen
Fibre Channel Host Bus Adapter
The EP1SGX10CF672C6N enables 1 Gbps / 2 Gbps / 4 Gbps Fibre Channel Host Bus Adapter (HBA) designs by combining its multi-gigabit transceivers with custom FC protocol logic implemented in the FPGA fabric. The device supports FC-AL and FC-SW topologies, including primitives, classes of service, and credit-based flow control. With 920 Kbit of embedded RAM, the device can buffer FC frames and implement scatter-gather DMA engines. Typical deployments include RAID controllers, storage area network appliances, and enterprise tape backup systems. The 672-BGA package's high pin count accommodates the parallel PCI/PCI-X bus interface to the host CPU alongside the high-speed serial FC link.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für EP1SGX10CF672C6N – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | EP1SGX10CF672C7N | EP1SGX10CF672C5N | EP1SGX10DF672C7N | EP1SGX25CF672C6N | EP1S25F672C6N |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 672-BBGA (CF672) 33×33 mm | 672-BBGA (CF672) 33×33 mm — same | 672-BBGA (CF672) 33×33 mm — same | 672-BBGA (CF672) 33×33 mm — same | 672-BBGA (CF672) 33×33 mm — same | 672-BGA (FineLine BGA) — same |
| Family | Stratix GX | Stratix GX | Stratix GX | Stratix GX | Stratix GX | Stratix (non-GX) |
| Logic Cells | 10,570 | 10,570 | 10,570 | 10,570 | ~25,000 | ~25,000 |
| Speed Grade | C6 (mid-tier) | C7 (faster) | C5 (slower) | C7 (faster) | C6 (mid-tier) | C6 (mid-tier) |
| Embedded Transceivers | Yes (3.125 Gbps-class) | Yes (3.125 Gbps-class) | Yes (3.125 Gbps-class) | Yes (3.125 Gbps-class) | Yes (3.125 Gbps-class) | No (Stratix non-GX) |
| Process / Core Voltage | 130 nm / 1.5 V | 130 nm / 1.5 V | 130 nm / 1.5 V | 130 nm / 1.5 V | 130 nm / 1.5 V | 130 nm / 1.5 V |
Wichtigste Unterscheidungsmerkmale
- Mid-tier performance with good power-performance balance (vs. EP1SGX10CF672C7N)
- Density upgrade path within same PCB footprint (vs. EP1SGX25CF672C6N)
- Embedded multi-gigabit transceivers in 130 nm process (vs. EP1S25F672C6N (non-GX))
Designhinweise
The 672-BGA FineLine package at 1.0 mm pitch requires careful PCB stackup design. Use at least a 4-layer board with a dedicated ground plane immediately below the BGA, and 6+ layers for high-speed transceiver routing. Microvia or laser-drilled via-in-pad technology is recommended for inner-row BGA breakout. Maintain 50 Ω single-ended and 100 Ω differential impedance for transceiver lanes and reference clocks. Route transceiver differential pairs with matched length (within 5 mil) and minimize the number of vias — each via discontinuity contributes ~1 dB loss at 3.125 Gbps.
Estimated: The 672-BGA package dissipates 5-8 W typical, 12-15 W worst-case with all transceivers active at full utilization. With the standard BGA thermal pad (EP) soldered to a 4-layer PCB with 1 oz copper inner planes, theta_JA is approximately 15-18 °C/W, yielding a junction temperature rise of 75-135 °C above ambient. For continuous full-power operation, attach a heatsink via thermal interface material to the package top, or use forced-air cooling. Compute junction temperature as TJ = TA + (PD × θJA) and verify it remains below 125 °C (commercial limit).
The 1.5 V VCCINT supply must deliver 3-5 A typical, peaking higher during configuration flash erase. Use a low-impedance regulator (e.g., LDO with <50 mV dropout) and place decoupling capacitors as close as possible to the BGA balls — typically 100 nF X7R per VCCINT/GND pair, plus bulk 10-47 µF tantalum or polymer capacitors. VCCIO supplies (typically 3.3 V, 2.5 V, 1.8 V for mixed I/O standards) require similar decoupling. Power sequencing: VCCINT should reach 1.5 V before VCCIO ramps, per the Stratix GX handbook, to avoid I/O latch-up during power-up.
For multi-gigabit transceiver channels at 3.125 Gbps, apply Tx pre-emphasis and Rx equalization settings per the Stratix GX Handbook Chapter 7. Typical settings: Tx pre-emphasis = 25-40% for short-reach backplane channels, Rx equalization = medium-high for FR4 traces > 10 inches. Use IBIS-AMI models (available from Intel) for channel simulation in tools like HyperLynx or ADS. Add AC-coupling capacitors (0.01 µF) in series on each transceiver RX/TX lane — never DC-couple the high-speed serial links. Reference clock jitter must be < 1 ps RMS for reliable 3.125 Gbps link acquisition.
Compliance-Informationen
RoHS compliant per 'N' suffix designation. Commercial temperature grade 0°C to 85°C — not AEC-Q100 qualified for automotive. Halogen-free status not explicitly stated in datasheet — marked 'unknown' per data authenticity rules. Last-time-buy lifecycle status as of 2026-09-07.
