EP1SGX25FF1020C6BN - Stratix GX FPGA 25.6K LE 1020-BGA | Intel
MPN: EP1SGX25FF1020C6BN ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $850 | $850.00 |
| 10 | $790 | $7,900.00 |
| 100 | $720 | $72,000.00 |
| 500 | $665 | $332,500.00 |
| 1,000 | $620 | $620,000.00 |
Drop-in alternatives for EP1SGX25FF1020C6BN — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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View Datasheet →EP1SGX25FF1020C6BN Maximum Ratings & Electrical Characteristics
| Family | Stratix GX |
| Logic Elements | 25,660 |
| Maximum User I/O | 607 |
| Total RAM Bits | 1,944,576 |
| Embedded Multipliers (18x18) | 20 |
| Process Technology | 130 nm |
| Core Voltage (VCCINT) | 1.5 V |
| Package | 1020-ball FC-FBGA (Flip-Chip Fine-pitch BGA) |
| Transceiver Channels | Up to 20 full-duplex |
| Max Transceiver Data Rate | 3.125 Gbps per channel |
| Internal Logic Frequency (max) | 500 MHz |
| Operating Temperature Grade | Commercial (C6) |
| Speed Grade | 6 |
| Mounting Type | Surface Mount (BGA) |
| Design Software | Quartus II (legacy) |
EP1SGX25FF1020C6BN 1020-ball fc-fbga (flip-chip fine-pitch bga) Pin Configuration Guide
Complete pinout information for EP1SGX25FF1020C6BN (1020-ball fc-fbga (flip-chip fine-pitch bga) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1SGX25FF1020C6BN.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1SGX25FF1020C6BN is suitable for 6 applications: Backplane SERDES for Telecom Line Cards, PCI Express Endpoint Card, Serial RapidIO Switch / Endpoint, High-Speed Data Acquisition Front End, 10G Ethernet MAC + Bridging, ASIC/ASSP Prototyping Platform.
Backplane SERDES for Telecom Line Cards
The EP1SGX25FF1020C6BN fits backplane SERDES designs on telecom line cards because its 20 embedded transceiver channels support up to 3.125 Gbps each, enabling proprietary chip-to-chip and backplane links above the 1 Gbps parallel threshold. Each channel provides 8b/10b encoding, word alignment, and rate-matching, removing the need for an external PHY. Placed between the framer ASIC and the backplane connector, the FPGA bridges protocols and absorbs format changes without a dedicated bridging ASIC. The 25,660 LE fabric plus 20 DSP blocks are sufficient for traffic-manager pre-classification, while 1,944,576 RAM bits hold multi-cell packet buffers. The 1020-BGA package exposes 607 user I/O for parallel TDM or LVDS links alongside the high-speed serial.
Recommended
PCI Express Endpoint Card
The EP1SGX25FF1020C6BN's hardened transceiver IP blocks can be configured for x1/x4 PCI Express, providing an early-generation endpoint for host-bus adapter cards at 2.5 Gbps per lane. The fabric implements the PCIe Transaction, Data Link and most of the Physical MAC layers, while the hard PHY handles 8b/10b encoding and serialization. This makes the part popular in legacy server/storage cards where PCIe IP licensing fees make a fully soft implementation costly. The 25,660 LE fabric holds DMA engines and lightweight protocol stacks. Board designers use the 1020-BGA with via-in-pad thermal vias because the active transceivers raise junction temperature under sustained 2.5 Gbps traffic.
Recommended
Serial RapidIO Switch / Endpoint
Stratix GX transceivers natively support Serial RapidIO at 1.25 / 2.5 / 3.125 Gbps, so the EP1SGX25FF1020C6BN can implement either a 4x or 8x RapidIO endpoint or a small embedded switch. The DSP blocks implement CRC, IDLE sequence insertion, and priority-based scheduling, while the fabric holds the logical I/O and message-passing state machines. Embedded RAM provides per-port virtual-channel buffering at line rate. Compared with a discrete SERDES + ASSP approach this single-chip integration reduces board area and BOM, especially on AMC and ATCA modules. The 1020-BGA footprint was retained across all speed grades, enabling board reuse between designs.
Recommended
High-Speed Data Acquisition Front End
The EP1SGX25FF1020C6BN suits high-speed ADC/DAC front ends where 14/16-bit converters running at 100-200 MSPS need an FPGA that can absorb streams, decimate, and forward to a host processor over serial links. The 607 user I/O pins interface directly to LVDS DDR source-synchronous ADC outputs, while the 20 transceivers forward processed data to a DSP or storage array at multiple gigabits per second. The 20 embedded 18x18 multipliers implement FIR decimation filters and digital down-conversion stages. The TriMatrix RAM (1,944,576 bits) holds data-acquisition windows and FFT bins. Industrial and defense test instruments from 2005-2012 used this exact part for its combination of LVDS bandwidth and SERDES in a single die.
Recommended
10G Ethernet MAC + Bridging
Ten-Gigabit Ethernet MAC and bridging functions fit comfortably in 25,660 LEs, and the EP1SGX25FF1020C6BN's transceivers can drive XAUI (4 x 3.125 Gbps) directly to an SFP+ or XFP optical module, providing a low-cost 10GE bridge. The fabric implements MAC framing, IFG, CRC, XGXS/PCS alignment, and rate adaptation to client-side parallel LVDS. Designers often pair it with an external PHY for line-side optics. Embedded RAM queues traffic for cut-through or store-and-forward operation. The 1020-BGA package enables both transceiver and parallel LVDS lanes on the same substrate, simplifying layout for switch line cards.
Recommended
ASIC/ASSP Prototyping Platform
When a discrete ASIC is not yet ready, the EP1SGX25FF1020C6BN acts as a development vehicle for early firmware bring-up, customer demos, and protocol validation. Its 25,660 LEs and 1.9 Mbit of RAM are enough to host pre-silicon RTL of a moderate-sized ASIC, and the 1020-BGA matches the planned ASIC ball map on many legacy projects, simplifying PCB migration. Twenty 3.125 Gbps transceivers model SERDES behaviour well enough for silicon-accurate validation. Use Quartus II for synthesis and verification - newer Quartus Prime releases dropped support for this family, so legacy toolchain is mandatory for prototyping continuity.
Recommended
Recommended Products Summary
Engineering reference data for EP1SGX25FF1020C6BN — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1SGX25FF1020C6N | EP1SGX25FF1020C6 | EP1SGX25FF1020C5N | EP1SGX25FF1020C5 | EP1SGX25FF1020C4 | EP1SGX25DF1020C6BN |
|---|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 1020-ball FC-FBGA | 1020-ball FC-FBGA - same | 1020-ball FC-FBGA - same | 1020-ball FC-FBGA - same | 1020-ball FC-FBGA - same | 1020-ball FC-FBGA - same | 1020-ball FC-FBGA - same |
| Logic Elements | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 |
| Speed Grade | C6 (-1) | C6 (-1) - same | C6 (-1) - same | C5 (-2) - slower | C5 (-2) - slower | C4 (-3) - slowest | C6 (-1) - same |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V (lower-power D-variant) |
| Transceiver Channels | Up to 20 | Up to 20 | Up to 20 | Up to 20 | Up to 20 | Up to 20 | Up to 20 |
| Max Transceiver Rate | 3.125 Gbps | 3.125 Gbps | 3.125 Gbps | 3.125 Gbps | 3.125 Gbps | 3.125 Gbps | 3.125 Gbps |
| Embedded RAM | 1,944,576 bits | 1,944,576 bits | 1,944,576 bits | 1,944,576 bits | 1,944,576 bits | 1,944,576 bits | 1,944,576 bits |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND | NRND |
Key Differentiators
- Embedded multi-gigabit transceivers (no external PHY) (vs Cyclone series)
- Direct IE-grade ordering code preserves lead-free compliance (vs EP1SGX25FF1020C6 (without N suffix))
- Higher speed grade C6 vs C5/C4 (vs EP1SGX25FF1020C5 (lower speed bin))
Design Notes
The 1020-ball FC-FBGA requires a high-density PCB with via-in-pad and microvia stack-ups (typically 8-12 layers with 0.4 mm ball pitch escape). Use the Altera Stratix GX board design guidelines for trace impedance (50 ohm SE / 100 ohm diff for transceivers), keep MGTL [transceiver] pairs length-matched within 5 mils, and provide solid GND/power planes adjacent to high-speed serial traces. Decoupling must follow the reference capacitor network from the datasheet (typically 0.1uF + 10uF per VCC/GND pair).
Active transceiver channels each dissipate approximately 100-150 mW, so with all 20 channels enabled total device power can exceed 5 W. Use a thermal pad array of via-in-pad microvias to inner copper planes and consider a heat spreader for sealed enclosures. Estimated: at 5 W and theta_JA = 11 C/W (with 4-layer thermal via array), junction temperature rise above ambient is roughly 55 C, so derate ambient to 65 C max for commercial temperature grade operation.
Configuration flash must use an Altera-supported EPCS or EPCQ device (3.3V for legacy AS mode); check the configuration scheme against the latest Quartus II release notes. Always assert CONF_DONE with the proper pull-up, and route JTAG TCK/TMS/TDO/TDI in a daisy chain that respects the 6 ns setup time. Do not hot-plug the FC-BGA - Intel/Altera does not support live insertion. Power-on ramp must satisfy the 0.1 ms-100 ms VCCINT rise time window stated in the datasheet, otherwise the POR circuit may mis-trigger.
Compliance Information
RoHS/REACH/lead-free status for the C6BN ordering code is not explicitly stated in the provided web data; see Intel/Altera product page or manufacturer datasheet for definitive compliance information. AEC-Q100 is not applicable to commercial-grade FPGAs.
