EPM3512AFC256-7N - MAX 3000A CPLD, 512 Macrocells, 208 I/O | Altera
Teilenummer: EPM3512AFC256-7N ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $95 | $95,00 |
| 10 | $86 | $860,00 |
| 100 | $76.5 | $7.650,00 |
| 500 | $68.25 | $34.125,00 |
| 1.000 | $61 | $61.000,00 |
EPM3512AFC256-7N Übersicht
What is a CPLD? A Complex Programmable Logic Device is a non-volatile programmable logic device that combines multiple PAL/GAL-style macrocell arrays with a central interconnect matrix, providing fast deterministic propagation delays, predictable timing, and instant-on behavior from on-chip EEPROM. CPLDs sit between simple SPLDs/GALs and large SRAM-based FPGAs in the programmable logic taxonomy: SPLD < CPLD < FPGA. The MAX 3000A family uses 3.3V core supply with multi-voltage VCCIO support for mixed 3.3V/2.5V I/O interfacing.
Key features include in-system programmability compliant with IEEE Std. 1532 (concurrent ISP across vendors), a 116.3 MHz internal fMAX, 5V-tolerant I/O pins, JTAG boundary-scan test support, and programmable power-saving modes per macrocell. The 256-pin FBGA (1.0 mm pitch, FineLine BGA) package provides dense I/O with controlled-impedance signal paths suitable for high-speed glue-logic applications.
The EPM3512AFC256-7N is built on a 0.30 micrometer CMOS EEPROM process with a 4-wire JTAG interface and a MultiVolt I/O architecture. Its deterministic timing model allows software tools (Quartus II / MAX+PLUS II) to compute exact worst-case fMAX before fabrication, eliminating timing closure iterations common with SRAM FPGAs.
Typical applications include bus interface bridging, address decoding and glue logic, peripheral I/O expansion, state-machine controllers, and system-level reset/sequencing blocks in telecom, industrial, and consumer products. The 208 user I/Os make it especially useful where many parallel control signals must be aggregated without requiring an FPGA.
Designers should use the Quartus II (legacy) or MAX+PLUS II toolchain to compile designs. A 1.0 mm-pitch FBGA requires careful PCB layout with microvia or via-in-pad technology; an external JTAG header (TCK, TMS, TDI, TDO, plus optional TRST) is required for ISP. Decouple each VCC and VCCIO pin with a 0.1 uF ceramic capacitor placed within 3 mm of the pin.
This page synthesizes distributor pricing, pin-compatible drop-in alternatives drawn from the same MAX 3000A family, and practical design notes not found in the manufacturer datasheet, giving an engineer a single decision-ready reference for sourcing EPM3512AFC256-7N.
Drop-in-Alternativen für EPM3512AFC256-7N – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit EPM3512AFC256-7N (gleiche Bauform und Footprint) – abweichend in Package, Programming Interface, Speed Grade, In-System Programmability, Operating Temperature.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
EPM3512AFC256-7
✅ Drop-In✓ Auf Lager
$58.4 / Stück
Datenblatt ansehen →EPM3512AFC256-10N
✅ Drop-In✓ Auf Lager
$43.22 / Stück
Datenblatt ansehen →EPM3512AFC256-10
✅ Drop-In✓ Auf Lager
$17.5 / Stück
Datenblatt ansehen →EPM3512AFC256-5C
✅ Drop-In✓ Auf Lager
$28.95 / Stück
Datenblatt ansehen →EPM3512AFC256-3N
✅ Drop-In✓ Auf Lager
$23.4 / Stück
Datenblatt ansehen →EPM3512AFC256-2N
✅ Drop-In✓ Auf Lager
$25.8 / Stück
Datenblatt ansehen →EPM3512AFC256-7N Grenzwerte & elektrische Eigenschaften
| Family | MAX 3000A |
| Product Type | CPLD (Complex Programmable Logic Device) |
| Macrocells | 512 |
| Usable Gates | 10,000 |
| User I/Os | 208 |
| Logic Blocks | 16 (32 macrocells each) |
| Propagation Delay (tPD) | 7.5 ns |
| Maximum Internal Frequency (fMAX) | 116.3 MHz |
| Core Supply Voltage (VCCINT) | 3.3 V |
| I/O Supply Voltage (VCCIO) | 3.3 V or 2.5 V |
| 5V Tolerant I/O | Yes |
| In-System Programmability | IEEE Std. 1532 compliant |
| Programming Interface | JTAG (IEEE 1149.1) |
| Process Technology | CMOS EEPROM, 0.30 um |
| Gehäuse | 256-pin FineLine BGA (FBGA-256), 1.0 mm pitch |
| Betriebstemperatur | 0 C to 70 C (commercial) |
| Montageart | Surface Mount |
EPM3512AFC256-7N 256-pin fineline bga (fbga-256), 1.0 mm pitch Pinbelegungsleitfaden
Pinbelegung für EPM3512AFC256-7N (256-pin fineline bga (fbga-256), 1.0 mm pitch-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für EPM3512AFC256-7N.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
EPM3512AFC256-7N ist geeignet für 7 Anwendungs: Bus Interface Bridging and Address Decoding, Industrial Control and Factory Automation Glue Logic, Peripheral I/O Expansion for Embedded Microcontrollers, State Machine Controllers for Telecom and Datacom, Legacy Board Repair and Obsolescence Maintenance, Power Sequencing and System Reset Generation, Test and Measurement Equipment Front-End Logic.
Bus Interface Bridging and Address Decoding
The EPM3512AFC256-7N's 512 macrocells and 208 user I/Os are well suited for bridging between legacy and modern buses (ISA/PCI to local-bus glue, asynchronous SRAM to microcontroller, etc.) and for centralized address decoding in systems with many peripheral selects. Its deterministic 7.5 ns pin-to-pin propagation delay provides tight chip-select timing without timing closure iterations typical of FPGAs. Use it where the design is mostly combinational decode plus a few state machines, with 3.3V core and 2.5V/3.3V VCCIO banks allowing direct interface to mixed-voltage peripherals without external level shifters.
Empfohlen
Industrial Control and Factory Automation Glue Logic
In industrial control cabinets, the EPM3512AFC256-7N aggregates many 24V-to-3.3V opto-isolated control signals and re-drives them to motor drivers, PLCs, and HMIs. The 208 I/Os allow direct parallel connection to dozens of isolated inputs/outputs without external muxing, while 5V-tolerant I/Os simplify interfacing to legacy 5V sensors. Deterministic timing enables reliable PLC scan-time behavior, and JTAG ISP lets field engineers reprogram the device without removing it from the panel via a JTAG header on the front door.
Empfohlen
Peripheral I/O Expansion for Embedded Microcontrollers
The EPM3512AFC256-7N is ideal for expanding the limited I/O count of small microcontrollers (e.g., 80C51, MSP430, Cortex-M0) where designers need dozens of PWM outputs, GPIOs, or chip selects. Its 512 macrocells can host multiple UART/SPI/I2C controllers, custom timers, and watchdog logic, freeing the MCU to focus on application code. The 3.3V core matches modern MCUs, while 2.5V VCCIO banks allow connection to lower-voltage peripherals. JTAG ISP allows field firmware updates via a simple 4-wire header.
Empfohlen
State Machine Controllers for Telecom and Datacom
Telecom and datacom line cards frequently require deterministic hardware state machines for protocol sequencing (e.g., HDLC framing, T1/E1 line-card glue, SERDES initialization). The EPM3512AFC256-7N's 7.5 ns propagation delay and 116.3 MHz fMAX are well matched to 8.192 MHz / 16.384 MHz backplane clocks, while the 512 macrocells can host multiple independent state machines in a single device. EEPROM-based non-volatile storage ensures instant-on behavior without external boot flash.
Empfohlen
Legacy Board Repair and Obsolescence Maintenance
Many long-lifecycle industrial, medical, and aerospace boards originally built around the EPM3512AFC256-7N are still in field service. Because the part is obsolete (NRND), repair depots must keep an inventory of direct drop-in replacements. The EPM3512AFC256-10N, EPM3512AFC256-7, and other speed-grade variants in the same 256-ball FBGA package serve as repair substitutes, allowing a depot to consolidate orders across speed bins and reduce stock-out risk on a single MPN.
Empfohlen
Power Sequencing and System Reset Generation
The EPM3512AFC256-7N can host complex multi-rail power-up/power-down sequencers and watchdog reset logic for systems with 8-16 voltage rails (CPU core, GPU, memory, I/O, PLLs). Its non-volatile EEPROM allows the sequencing order to be stored on-chip, eliminating external boot PROMs. The 208 I/Os are sufficient to drive dozens of enable and PG (power-good) signals directly, and the JTAG port lets field engineers re-tune sequencing without re-spinning firmware.
Empfohlen
Test and Measurement Equipment Front-End Logic
Test instruments (oscilloscopes, logic analyzers, function generators) often require custom front-end routing and trigger logic that does not fit neatly into an FPGA's SRAM-based fabric. The EPM3512AFC256-7N's deterministic timing, EEPROM-based non-volatility, and 208 I/Os allow it to host a trigger matrix, channel multiplexer, and status indicator logic that boots instantly on power-up. Its 3.3V core and MultiVolt I/O support direct connection to modern ADC/DAC front ends.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für EPM3512AFC256-7N – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | EPM3512AFC256-7 | EPM3512AFC256-10N | EPM3512AFC256-10 | EPM3512AFC256-5C | EPM3512AFC256-3N |
|---|---|---|---|---|---|---|
| Package | FBGA-256 (1.0 mm pitch) | FBGA-256 (1.0 mm pitch) - same | FBGA-256 (1.0 mm pitch) - same | FBGA-256 (1.0 mm pitch) - same | FBGA-256 (1.0 mm pitch) - same | FBGA-256 (1.0 mm pitch) - same |
| Brand | Altera (now Intel PSG) | Altera | Altera | Altera | Altera | Altera |
| Speed Grade (tPD) | 7.5 ns (-7) | 7.5 ns (-7) | 10 ns (-10) | 10 ns (-10) | 5 ns (-5) | 3.5 ns (-3) |
| Lead-Free (Pb-Free) | Yes (N suffix) | No (SnPb finish) | Yes (N suffix) | No (SnPb finish) | Yes (per datasheet) | Yes (N suffix) |
| Macrocells | 512 | 512 | 512 | 512 | 512 | 512 |
| User I/Os | 208 | 208 | 208 | 208 | 208 | 208 |
| Core Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Operating Temperature | 0 C to 70 C (commercial) | 0 C to 70 C (commercial) | 0 C to 70 C (commercial) | 0 C to 70 C (commercial) | 0 C to 70 C (commercial) | 0 C to 70 C (commercial) |
| Lifecycle Status | Obsolete (NRND) | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Wichtigste Unterscheidungsmerkmale
- Pin-compatible drop-in coverage across the entire -3 / -5 / -7 / -10 speed-grade matrix (vs. EPM3512AFC256-7)
- Higher logic density (512 macrocells) than smaller MAX 3000A family members (vs. EPM3256AFC256-10)
- MultiVolt I/O with 2.5V/3.3V VCCIO banks (vs. Xilinx XC95288XL-7BG256)
- IEEE 1532 ISP compliance (vs. Legacy MAX 3000 (non-A) variants)
Designhinweise
The 256-ball FineLine BGA uses a 1.0 mm ball pitch, which demands either microvia (uVia) PCB technology or via-in-pad construction for reliable fan-out. Standard 0.1 mm laser-drilled microvias are recommended; tented or plugged microvias are required for fine-line BGA escape routing. Place at least one 0.1 uF X7R ceramic decoupling capacitor within 3 mm of every VCC and VCCIO pin, plus bulk 10 uF tantalum or polymer capacitors on each supply rail. A continuous ground plane on the layer immediately beneath the BGA is essential to control return paths and reduce simultaneous switching noise (SSN).
Do not confuse the 256-ball FBGA (1.0 mm pitch) with the larger 1.27 mm pitch BGA variants; land-pattern mistakes will cause shorts or opens. The VCCIO pins are banked, and each bank must be tied to either 3.3V or 2.5V; mixing voltages across banks without proper decoupling leads to CMOS input latch-up. The JTAG TRST pin (if present on the package variant) must be tied low through a 10 kohm resistor or driven by the programmer, otherwise the TAP controller may power up in an undefined state.
The FBGA-256 package has a theta-JA of approximately 18 C/W with a standard JEDEC test board, but in practice real-world designs with limited inner-plane copper can show 25 to 35 C/W. The MAX 3000A family's CMOS EEPROM process draws very low quiescent current (typically under 50 mA at 3.3V core), so thermal management is rarely a problem unless the design forces all 208 outputs to switch at the maximum 116.3 MHz simultaneously. Estimated: at 50% toggle rate and 50 pF load per pin, dynamic current adds ~10 mA, raising total to ~60 mA, well within the package's thermal envelope.
Place the JTAG header (TCK, TMS, TDI, TDO, plus optional TRST and VCC sense) on the board edge for in-system programming access without disassembling the chassis. Keep JTAG traces under 100 mm total length and series-terminate TCK with a 22 ohm resistor if the trace exceeds 50 mm. Quiescent VCCIO noise below 50 mVpp is required for reliable JTAG ISP; add a ferrite bead or pi-filter if the VCCIO rail is shared with high-di/dt loads. Reserve four general-purpose I/O pins for future ISP-triggered user-code update if field upgrades are anticipated.
Compliance-Informationen
RoHS compliance unknown because the part was originally released by Altera before RoHS documentation standardization. The 'N' suffix indicates Pb-free terminal finish, which suggests RoHS-compliant solder-joint compatibility, but a RoHS declaration document is not confirmed in the Verified Web Data.
