IRS21834STRPBF vs IR2117STRPBF Comparación
Comparación detallada lado a lado de IRS21834STRPBF por Infineon y IR2117STRPBF por Infineon. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | IRS21834STRPBF | IR2117STRPBF |
|---|---|---|
| Marca | Infineon | Infineon |
| Categoría | Power MOSFET Drivers | Power MOSFET Drivers |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $1,45 | $0,58 |
| Configuration | Half-Bridge | High-Side Single Channel |
| Number of Drivers | 2 (high-side + low-side) | — |
| Input Logic | Inverting, Non-Inverting with Shutdown | — |
| Maximum Offset Voltage (High-Side) | 600 V | — |
| Gate Drive Supply (VCC, VBS) | 10 V to 20 V | — |
| Source Current (typ.) | 1.9 A | — |
| Sink Current (typ.) | 2.3 A | — |
| Propagation Delay (typ.) | 200 ns | — |
| Delay Matching (max) | ±50 ns | — |
| Undervoltage Lockout (VCC, VBS) | Yes | — |
| Negative Transient Voltage Tolerance | dV/dt immune | Yes, dV/dt immune |
| Rango de temperatura de funcionamiento | -40C to +125C | -40 C to +125 C |
| Encapsulado | 14-SOIC (SOIC-14) | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Nivel MSL | 1 (unlimited) | MSL3 (per JEDEC J-STD-020) |
| Estado RoHS | Compliant | Compliant |
| Lead-Free | Yes | Yes |
| Función | — | Gate Driver, Non-Inverting |
| Input Logic Compatibility | — | CMOS / TTL |
| Número de salidas | — | 1 |
| Driven Device | — | N-Channel MOSFET / IGBT |
| Gate Drive Supply Voltage (VCC) | — | 10 V to 20 V |
| Floating Channel Offset Voltage | — | up to +600 V |
| Peak Source Current (IOUT+) | — | 250 mA |
| Peak Sink Current (IOUT-) | — | 500 mA |
| Propagation Delay (Ton/Toff) | — | 125 ns (max) |
| Tiempo de subida | — | 80 ns (typ) |
| Tiempo de bajada | — | 40 ns (typ) |
| Undervoltage Lockout (UVLO) | — | Yes |
| Encapsulado / Carcasa | — | 8-SOIC (0.154 inch / 3.90 mm width) |