EP1S30F1020C5 - Stratix 32K LE FPGA 1020-BGA | Intel
N.º de pieza: EP1S30F1020C5 ✗ Fin de vida| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $185 | $185,00 |
| 10 | $165 | $1.650,00 |
| 100 | $140 | $14.000,00 |
| 500 | $118 | $59.000,00 |
| 1.000 | $99 | $99.000,00 |
EP1S30F1020C5 Descripción general
An FPGA (Field-Programmable Gate Array) is a semiconductor device containing configurable logic blocks (CLBs), programmable interconnect, and dedicated hard-IP such as block RAM and DSP multipliers. FPGAs sit within the broader hierarchy of programmable logic devices (PLDs) and parallel-programmable ICs, and are positioned between fixed-function ASICs and software-programmable DSPs/microprocessors. The Stratix family, the first generation of high-end Altera FPGAs, replaced the APEX II family and was later superseded by Stratix II/III/IV/V families, but the EP1S30 retains a long-tail installed base in industrial, defense, and test-and-measurement equipment.
Key features of the EP1S30F1020C5 include up to 500 MHz internal operation, dedicated DSP blocks for fixed- and floating-point math, embedded TriMatrix memory blocks totaling approximately 3.3 Mbits, and a high-speed I/O ring capable of interfacing to external DDR/DDR2/QDR SRAM. The 'C5' speed grade positions the part at a moderate performance bin suitable for cost-sensitive designs, and the 'F1020' suffix denotes the 1020-ball flip-chip BGA package with full I/O count.
Architecturally, the device uses an SRAM-based configuration cell so the bitstream must be loaded from an external PROM or flash on every power-up. The logic element combines a 4-input look-up table (LUT), dedicated carry chain, and register; these LEs are clustered into Logic Array Blocks (LABs) with shared control signals. Hard multipliers, MRAM/M4K memory blocks, and a global/local interconnect fabric provide the structural backbone of Stratix.
Typical applications include high-speed DSP pipelines (radar, software-defined radio), protocol bridging (telecom backhaul, SONET/SDH framers), ASIC prototyping, and industrial vision/imaging systems. The wide 1020-pin BGA provides ample LVDS pairs for parallel data acquisition, while the rich DSP/memory ratio enables high-bandwidth signal-processing pipelines.
When designing with this part, plan for active thermal management: at 500 MHz the Stratix core can dissipate significant power, and the FC-FBGA demands a multi-layer PCB with via-in-pad and a heatsink path. Confirm Quartus II version support - Intel ended Quartus II subscription updates years ago, so legacy toolchains remain the only stable code path.
This page synthesizes distributor inventory, drop-in alternative listings, and design notes not found in the standalone Altera datasheet, providing engineer-ready decision context for new designs, long-life-cycle maintenance, and obsolescence management.
Alternativas directas para EP1S30F1020C5 — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con EP1S30F1020C5 (mismo factor de forma y huella) — difiere en Operating Temperature, Logic Elements, Process Technology, Speed Grade, Package.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
EP1S30F1020C6
✅ Sustitución directa✓ En stock
$262 / unidad
Ver hoja de datos →EP1S30F1020C7
✅ Sustitución directa✓ En stock
$575 / unidad
Ver hoja de datos →EP1S40F1020C5
✅ Sustitución directa✓ En stock
$165 / unidad
Ver hoja de datos →EP1S60F1020C5
✅ Sustitución directa✓ En stock
$171 / unidad
Ver hoja de datos →EP1S80F1020C5
✅ Sustitución directa✓ En stock
$745 / unidad
Ver hoja de datos →EP1S25F1020C5
✅ Sustitución directa✓ En stock
$650 / unidad
Ver hoja de datos →EP1S30F1020C5 Valores máximos y características eléctricas
| Family | Stratix |
| Logic Elements | 32,470 |
| Total Memory Bits | 3,317,184 |
| Total RAM Blocks | 32470 (per DigiKey descriptor) |
| User I/O Count | 726 |
| Process Technology | 130 nm CMOS |
| Core Voltage | 1.5 V |
| Maximum Internal Frequency | 500 MHz |
| Operating Temperature Grade | Commercial Extended |
| Speed Grade | 5 (C5) |
| Package Type | 1020-ball FC-FBGA (Flip-Chip Fine-pitch BGA) |
| Tipo de montaje | Surface Mount |
| Configuration Method | SRAM-based, external PROM required |
| Development Tool | Quartus II (legacy) |
| Estado RoHS | unknown |
Guía de configuración de pines de EP1S30F1020C5 1020-ball fc-fbga (flip-chip fine-pitch bga)
Configuración de pines para EP1S30F1020C5 (encapsulado 1020-ball fc-fbga (flip-chip fine-pitch bga)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para EP1S30F1020C5.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
EP1S30F1020C5 es adecuado para 6 aplicacións: High-Speed DSP Pipelines (Radar / Software Defined Radio), Telecommunications Protocol Bridging (SONET / SDH Framers), ASIC Prototyping and Emulation, Industrial Vision and Image Processing Systems, Test and Measurement Instrumentation, Defense and Aerospace Legacy Sustainment.
High-Speed DSP Pipelines (Radar / Software Defined Radio)
The EP1S30F1020C5 fits this application because its hardware multiplier blocks and TriMatrix memory deliver deterministic multi-GMAC throughput for FFT, FIR, and correlation kernels. At 500 MHz internal operation the part can sustain tens of GMACS, enough for multi-channel software-defined radio baseband or pulse-Doppler radar preprocessing. The 1020-ball FC-FBGA exposes 726 user I/Os - sufficient LVDS pairs to ingest ADC samples at hundreds of MSPS and route pre-processed data into external DDR memory. Designers typically instantiate the Stratix DSP blocks with the MegaCore DSP Builder flow and place MRAM blocks as ping-pong buffers to hide memory latency.
Recomendado
Telecommunications Protocol Bridging (SONET / SDH Framers)
Telecom bridging designs map well to the EP1S30F1020C5 because the part's high I/O count (726) and wide bus widths fit parallel TDM framers and SERDES aggregation. The C5 speed grade closes timing on multi-gigabit LVDS links, while dedicated MRAM blocks absorb jitter buffers and pointer-arithmetic state. With up to 500 MHz core operation, the FPGA can run multiple OC-48 framer engines simultaneously and feed downstream ASICs. Quartus II SOPC Builder provides pre-verified UART/SPI/I2C cores to integrate processor housekeeping logic alongside the framer datapath.
Recomendado
ASIC Prototyping and Emulation
ASIC prototyping requires capacity, I/O, and predictable timing - all of which the EP1S30F1020C5 delivers at 32,470 LEs and 726 user I/Os. According to Stratix application notes, designers often combine two or more EP1S30 devices in a multi-FPGA partition to emulate mid-complexity ASICs (500K to 1M gate equivalents). The 130 nm process node provides timing characteristics that reasonably match ASIC libraries of that era, making it ideal for pre-silicon verification. The SRAM-based configuration lets engineers iterate RTL in minutes rather than the multi-week ASIC tape-out cycle.
Recomendado
Industrial Vision and Image Processing Systems
The EP1S30F1020C5 suits machine-vision pipelines because its high I/O count accepts multi-channel Camera Link or LVDS camera inputs, while embedded DSP blocks execute Sobel, convolution, and color-space-conversion kernels in real time. With 3,317,184 bits of TriMatrix memory, the device holds line buffers and lookup tables for gamma correction without external SRAM. Industrial vision typically runs at 60-200 MHz pixel clocks - well within the C5 speed grade. The commercial-extended temperature grade (0 C to +85 C) covers most factory-floor enclosures, and the BGA package provides the mechanical robustness required by vibration-prone environments.
Recomendado
Test and Measurement Instrumentation
Test-and-measurement equipment leverages the EP1S30F1020C5 because the part's flexible I/O supports arbitrary waveform generation, real-time protocol decoding, and high-speed ADC/DAC interfacing. The 1020-ball FC-FBGA exposes 726 user I/Os, allowing direct parallel connection to wide ADC buses without external multiplexing. Embedded TriMatrix memory buffers captured waveforms before DMA-ing to host processors. The C5 speed grade balances performance and cost for mainstream oscilloscope and logic-analyzer products where 250-400 MHz internal Fmax is adequate for triggering and protocol decoding logic.
Recomendado
Defense and Aerospace Legacy Sustainment
Defense and aerospace programs sustain long life cycles (15-30 years), making the EP1S30F1020C5 a frequent bill-of-material incumbent for radar, EW, and avionics subsystems. According to Rochester Electronics and similar long-life suppliers, factory-traceable stock remains available for legacy sustainment where re-design is cost-prohibitive. The 130 nm process and SRAM-based configuration provide deterministic startup behavior required by MIL-spec systems, and the BGA package withstands the shock and vibration profiles of airborne platforms. Designers should plan for obsolescence management using form-fit-function equivalents within the Stratix family.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para EP1S30F1020C5 — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | EP1S30F1020C6 | EP1S30F1020C7 | EP1S40F1020C5 | EP1S60F1020C5 | EP1S80F1020C5 | EP1S25F1020C5 |
|---|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 1020-ball FC-FBGA | 1020-ball FC-FBGA - same | 1020-ball FC-FBGA - same | 1020-ball FC-FBGA - same | 1020-ball FC-FBGA - same | 1020-ball FC-FBGA - same | 1020-ball FC-FBGA - same |
| Logic Elements | 32,470 | 32,470 (same die) | 32,470 (same die) | 41,250 (~+27%) | 57,120 (~+76%) | 79,040 (~+144%) | 25,660 (~-21%) |
| Speed Grade | C5 | C6 (faster) | C7 (fastest) | C5 (same) | C5 (same) | C5 (same) | C5 (same) |
| Maximum Internal Frequency | 500 MHz | 500 MHz (better Fmax bin) | 500 MHz (best Fmax bin) | 500 MHz | 500 MHz | 500 MHz | 500 MHz |
| Total Memory Bits | 3,317,184 | 3,317,184 | 3,317,184 | 3,423,744 | 5,398,528 | 7,427,520 | 2,243,840 |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Process Technology | 130 nm CMOS | 130 nm CMOS | 130 nm CMOS | 130 nm CMOS | 130 nm CMOS | 130 nm CMOS | 130 nm CMOS |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Diferenciadores clave
- Mid-capacity Stratix sweet spot with full 726 I/O exposure (frente a EP1S25F1020C5)
- Lower-cost path with headroom upgrade to larger dies (frente a EP1S80F1020C5)
- Single-fabric solution for high I/O + DSP + memory (frente a Discrete DSP + glue logic)
Notas de diseño
The 1020-ball FC-FBGA package requires via-in-pad PCB construction with 0.8 mm or 1.0 mm ball pitch. Per Stratix hardware design guidelines, the PCB stack-up must include at least 6 layers with dedicated power and ground planes adjacent to the BGA fan-out area. Use microvia-in-pad (stacked or staggered) to route inner balls; signal integrity on the 1.5 V core and 3.3 V auxiliary rails depends on low-impedance plane capacitance directly under the device. Plan a 25-30 mm x 25-30 mm PCB keep-out for the BGA itself.
Estimated: at 500 MHz with 60-70% logic utilization, the EP1S30 core typically dissipates 5-8 W. The FC-FBGA exposes the die through the top surface for a heatsink attach. Designers should attach a 25x25 mm heatsink with thermal interface material and ensure airflow of at least 1.5 m/s. For enclosed chassis, derate by 20-30% and add a copper heat-spreader plane under the BGA. The 'F' (FC-FBGA) package supports higher power than wire-bond equivalents because the flip-chip solder balls provide a direct thermal path into the PCB inner planes.
Plan configuration memory carefully: the EP1S30 is SRAM-based, so the bitstream must be loaded from an external EPC configuration device or flash on every power-up. Per Altera application note AN-399, fast passive serial configuration takes 100-300 ms for a fully populated EP1S30; designers must hold nSTATUS low until the supply rails stabilize. Pinout is package-specific - the EP1S30F1020C5 ball map differs from the EP1S30F780 variant, so schematic reuse across packages is impossible. Quartus II version lock is also critical: a design compiled in v9.0 may not synthesize cleanly in v13.1 because of deprecated megafunctions.
Información de cumplimiento
RoHS and lead-free status uncertain for EP1S30F1020C5 because the part was produced across lead and lead-free assembly generations. Confirm with supplier CoC. AEC-Q100 not applicable - this is a commercial-grade FPGA.
