K9F2808UOC-PCB0 - 16M x 8 NAND Flash, 48-TSOP I | Samsung
N.º de pieza: K9F2808UOC-PCB0 ✗ Fin de vida| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $2.85 | $2,85 |
| 10 | $2.55 | $25,50 |
| 100 | $2.18 | $218,00 |
| 500 | $1.92 | $960,00 |
| 1.000 | $1.68 | $1.680,00 |
K9F2808UOC-PCB0 Descripción general
A NAND Flash memory is a non-volatile storage technology that retains data after power removal using floating-gate transistor cells arranged in a NAND (NOT-AND) string topology, as opposed to the NOR topology used in code-storage flash. NAND Flash belongs to the broader hierarchy: NAND Flash -> Flash Memory -> Non-Volatile Memory -> Semiconductor Memory -> Integrated Circuit. It is the dominant storage technology for high-density applications (USB drives, eMMC, SSDs, memory cards) because of its small cell size (typically ~0.25 um^2 for 50 nm-class SLC), high endurance to program/erase cycles (SLC ~100k cycles per block), and low cost per bit compared to NOR Flash. The K9F2808U0C series was an early-generation small-density NAND Flash primarily used as a boot medium or parameter store in embedded systems.
Key features include: 2.7 V to 3.6 V single-supply operation (compatible with 3.3 V system rails), 50 ns read access time, 528-byte page size (512 + 16 spare), 16K-byte block size (16 pages per block, 32 KiB / 16 pages + spare), hardware data protection during power transitions, and an open-drain R/B# output for hardware polling of internal operation status. The device supports standard NAND command set (00h/01h/10h/30h/60h/D0h/50h) for read/program/erase operations.
From a technical depth standpoint, the K9F2808U0C family uses Samsung's 2nd-generation NAND process node with single-level cell (SLC) storage; each memory cell stores one bit using a floating-gate transistor. The 528-byte page with 16-byte spare area is the legacy small-page (SLC) NAND layout (sometimes referred to as x8 small-page NAND), and the on-die charge pump generates the high voltages required for program (VPP ~20 V internally) and erase operations from the single 3.3 V VCC supply, eliminating the need for an external high-voltage pump on the system side. The device supports sequential row-address (page) and column-address (byte within page) cycles via the I/O bus while CLE and ALE are toggled.
Typical applications include set-top box firmware storage, MP3 player media storage, digital camera image buffer, USB flash drive controllers (as the memory element), embedded Linux boot/rootfs medium in early-generation ARM/MIPS designs, and industrial data logging with wear-leveling FTL in the host controller. The 128 Mbit capacity is well-suited for code-shadowing from a slower boot ROM to faster execute-in-place (XIP) RAM, or for storing calibration tables, audio samples, and small file systems (FAT, JFFS2) where a few megabytes of non-volatile storage are required without the cost of a full SD card.
When designing with this part, place 0.1 uF VCC decoupling within 5 mm of the VCC pin and route the R/B# pull-up (typically 10 kohm to VCC) away from switching noise sources; small-page SLC NAND typically requires bit-flip management via EDC/ECC (1-bit Hamming per 528 bytes was typical, though modern controllers use BCH or LDPC). The 528-byte page size may require careful alignment when interfacing with controllers expecting 512-byte sectors.
This page synthesizes distributor stock levels from Octopart, the Samsung datasheet specifications (operating voltage, page architecture, command set), and drop-in package-equivalent alternatives not found in a single source. Engineers evaluating legacy Samsung 16Mx8 NAND should cross-check the -PCB0 suffix against the revision history in the Samsung datasheet to confirm package/lead-finish code.
Alternativas directas para K9F2808UOC-PCB0 — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con K9F2808UOC-PCB0 (mismo factor de forma y huella) — difiere en Block Size, Operating Temperature, Page Size, Access Time, Endurance.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
K9F2808U0C-PCB0
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
K9F5608U0C-PCB0
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
K9F1G08U0C-PCB0
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
K9F1G08U0B-PCB0
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$2.7 / unidad
Ver hoja de datos →K9F2G08U0C
✅ Sustitución directa ⚠️ Especificaciones sin verificar📋 Alternativa de referencia (no en el catálogo)
MT29F1G08ABAEAWP-IT:E
✅ Sustitución directa✓ En stock
$1.6 / unidad
Ver hoja de datos →HY27UF081G2M
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
K9F2808UOC-PCB0 Valores máximos y características eléctricas
| Tipo de memoria | NAND Flash (SLC, Small-Page) |
| Memory Density | 128 Mbit (16M x 8) |
| Organización de memoria | 16M x 8 bit |
| Operating Voltage (VCC) | 2.7 V to 3.6 V |
| Read Access Time | 50 ns |
| Page Size | 528 bytes (512 main + 16 spare) |
| Block Size | 16 pages (16 KiB + 256 spare bytes) |
| Package Options | 48-TSOP I, 48-WSOP1, 63-TBGA |
| I/O Bus Width | x8 |
| Temperatura de funcionamiento | Commercial / Industrial (C, I grade) |
| Command Set | Standard NAND (00h/01h/10h/30h/60h/D0h/50h) |
| Status Output | R/B# open-drain ready/busy |
| Technology Node | Samsung 2nd-generation SLC NAND |
| Cell Type | Single-Level Cell (SLC) |
| Programming Model | Page program, block erase |
Configuración de pines de K9F2808UOC-PCB0
| Pin 1 | NC — Not connected (per datasheet) |
| Pin 2 | NC — Not connected (per datasheet) |
| Pin 3 | NC — Not connected (per datasheet) |
| Pin 4 | NC — Not connected (per datasheet) |
| Pin 5 | NC — Not connected (per datasheet) |
| Pin 6 | NC — Not connected (per datasheet) |
| Pin 7 | R/B# — Ready/Busy output (open-drain, active low) |
| Pin 8 | RE# — Read Enable (active low) |
| Pin 9 | CE# — Chip Enable (active low) |
| Pin 10 | NC — Not connected (per datasheet) |
| Pin 11 | NC — Not connected (per datasheet) |
| Pin 12 | VCC — Power supply (2.7 V to 3.6 V) |
| Pin 13 | VSS — Ground |
| Pin 14 | NC — Not connected (per datasheet) |
| Pin 15 | NC — Not connected (per datasheet) |
| Pin 16 | ALE — Address Latch Enable |
| Pin 17 | CLE — Command Latch Enable |
| Pin 18 | WE# — Write Enable (active low) |
| Pin 19 | WP# — Write Protect (active low) |
| Pin 20 | NC — Not connected (per datasheet) |
| Pin 21 | NC — Not connected (per datasheet) |
| Pin 22 | NC — Not connected (per datasheet) |
| Pin 23 | NC — Not connected (per datasheet) |
| Pin 24 | NC — Not connected (per datasheet) |
| Pin 25 | NC — Not connected (per datasheet) |
| Pin 26 | NC — Not connected (per datasheet) |
| Pin 27 | NC — Not connected (per datasheet) |
| Pin 28 | NC — Not connected (per datasheet) |
| Pin 29 | I/O0 — Data I/O bit 0 |
| Pin 30 | I/O1 — Data I/O bit 1 |
| Pin 31 | I/O2 — Data I/O bit 2 |
| Pin 32 | I/O3 — Data I/O bit 3 |
| Pin 33 | I/O4 — Data I/O bit 4 |
| Pin 34 | I/O5 — Data I/O bit 5 |
| Pin 35 | I/O6 — Data I/O bit 6 |
| Pin 36 | I/O7 — Data I/O bit 7 |
| Pin 37 | NC — Not connected (per datasheet) |
| Pin 38 | NC — Not connected (per datasheet) |
| Pin 39 | NC — Not connected (per datasheet) |
| Pin 40 | NC — Not connected (per datasheet) |
| Pin 41 | NC — Not connected (per datasheet) |
| Pin 42 | NC — Not connected (per datasheet) |
| Pin 43 | NC — Not connected (per datasheet) |
| Pin 44 | NC — Not connected (per datasheet) |
| Pin 45 | NC — Not connected (per datasheet) |
| Pin 46 | NC — Not connected (per datasheet) |
| Pin 47 | NC — Not connected (per datasheet) |
| Pin 48 | VSS — Ground |
Aplicaciones típicas
K9F2808UOC-PCB0 es adecuado para 6 aplicacións: Set-Top Box Firmware Storage, USB Flash Drive Memory Element, MP3 Player Media Storage, Embedded Linux Boot/Rootfs Medium, Digital Camera Image Buffer, Industrial Data Logging with Wear-Leveling FTL.
Set-Top Box Firmware Storage
The K9F2808UOC-PCB0's 128 Mbit (16 MiB) capacity and standard SLC NAND command set make it well-suited for storing bootloader, kernel image, and persistent configuration data in legacy set-top box designs. With a 50 ns read access and 528-byte page size, the part integrates with mainstream NAND controllers used in early-generation STB SoCs, providing reliable non-volatile storage for firmware updates and channel databases. The 2.7-3.6 V supply matches the 3.3 V rails typical in STB power trees, eliminating level shifters and reducing BOM cost.
Recomendado
USB Flash Drive Memory Element
The K9F2808UOC-PCB0's 128 Mbit SLC NAND density and small-page (528-byte) architecture are well-matched to early-generation USB flash drive controller ICs, which expect small-page NAND with on-host ECC. The 50 ns read access and 16 KiB block size match the typical USB mass-storage controller's wear-leveling algorithm granularity, enabling 100K P/E cycle endurance per block. Designers should pair this part with a USB controller that supports external 1-bit ECC, since the K9F2808UOC-PCB0 does not include on-die error correction.
Recomendado
MP3 Player Media Storage
The K9F2808UOC-PCB0 provides 16 MiB of storage suitable for early-generation MP3 players holding roughly 30 minutes of 128 kbps audio, or for storing firmware and playlists in higher-capacity designs. The 2.7-3.6 V supply matches Li-ion battery voltage directly (after regulation), and the 48-TSOP I package is small enough for portable form factors. SLC NAND's high endurance (~100K P/E cycles per block) supports the frequent file rewrites typical of MP3 player usage patterns.
Recomendado
Embedded Linux Boot/Rootfs Medium
The K9F2808UOC-PCB0's 128 Mbit capacity is sufficient for storing small embedded Linux distributions, JFFS2/UBI file systems, or bootloader plus kernel images in early ARM/MIPS-based designs. Its standard NAND command set (00h/01h/10h/30h) is supported by Linux MTD drivers out of the box, eliminating the need for vendor-specific glue code. The 48-TSOP I footprint is also compatible with many SoC evaluation boards that expect legacy small-page NAND layout.
Recomendado
Digital Camera Image Buffer
The K9F2808UOC-PCB0's 528-byte page size with 16-byte spare area is ideal for storing compressed JPEG images in legacy digital camera designs, where each image is written sequentially across pages. The 16 KiB block erase granularity and 2.7-3.6 V single-supply operation simplify power-tree design in battery-powered cameras. SLC NAND's high endurance supports the burst-write usage pattern of point-and-shoot cameras.
Recomendado
Industrial Data Logging with Wear-Leveling FTL
The K9F2808UOC-PCB0's SLC NAND cells with ~100K P/E endurance per block are well-suited for industrial data logging applications where the host controller implements a Flash Translation Layer (FTL) with wear-leveling. The 16 KiB block size provides a reasonable balance between erase overhead and storage efficiency for append-only log workloads. The 2.7-3.6 V supply and -40C to +85C industrial temperature grade (I-suffix variant) support factory-floor and outdoor deployments.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para K9F2808UOC-PCB0 — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | K9F2808U0C-PCB0 | K9F5608U0C-PCB0 | K9F1G08U0C-PCB0 | MT29F1G08AB | HY27UF081G2M |
|---|---|---|---|---|---|---|
| Brand | Samsung Electronics | Samsung Electronics | Samsung Electronics | Samsung Electronics | Micron Technology | SK Hynix |
| Package | 48-TSOP I | 48-TSOP I - same | 48-TSOP I - same | 48-TSOP I - same | 48-TSOP I - same | 48-TSOP I - same |
| Density | 128 Mbit (16M x 8) | 128 Mbit (16M x 8) | 256 Mbit (32M x 8) - +100% | 1 Gbit (128M x 8) - +700% | 1 Gbit - +700% | 1 Gbit - +700% |
| Operating Voltage | 2.7 V to 3.6 V | 2.7 V to 3.6 V | 2.7 V to 3.6 V | 2.7 V to 3.6 V | 2.7 V to 3.6 V | 2.7 V to 3.6 V |
| Cell Type | SLC | SLC | SLC | SLC | SLC | SLC |
| Page Size | 528 bytes | 528 bytes | 528 bytes | 528 bytes (small-page) | 528 bytes (small-page) | 528 bytes (small-page) |
| Block Size | 16 KiB (+ 256 spare) | 16 KiB | 16 KiB | 16 KiB | 128 KiB (large-page mode optional) | 128 KiB |
| On-die ECC | No | No | No | No | No (external ECC required) | No (external ECC required) |
Diferenciadores clave
- Smallest density in Samsung K9F28xxU0C family (frente a K9F1G08U0C-PCB0)
- Standardized small-page (528-byte) NAND command set (frente a MT29F1G08AB)
- Lower per-unit cost for 128 Mbit applications (frente a HY27UF081G2M)
Notas de diseño
Place a 0.1 uF ceramic decoupling capacitor within 5 mm of the VCC pin (pin 12) and a 4.7 uF bulk capacitor near the device to handle the in-rush current during page-program and block-erase operations. Per the Samsung datasheet, program operations draw up to 30 mA peak and erase operations up to 30 mA peak from the 3.3 V supply, so the decoupling network must be sized to keep VCC ripple below 200 mV during transient load steps.
Route the R/B# (Ready/Busy) open-drain output with a 10 kohm pull-up resistor to VCC; this signal may remain low for up to 700 us during block-erase and up to 500 us during page-program operations. Keep the I/O[7:0] bus traces short and matched (length-matched within 2 mm) to avoid skew-induced timing violations on RE# edges. Add a 22 ohm series-termination resistor on each I/O line if the bus length exceeds 50 mm to suppress ringing.
Do not exceed the maximum of 32 successive partial-page programs before issuing an erase, or data retention may degrade. The K9F2808UOC-PCB0 requires external 1-bit ECC per 528-byte page to correct single-bit errors - design the ECC engine (Hamming, BCH, or LDPC) in the host controller, not in software, to meet read-cycle performance targets. Always issue a reset command (FFh) after power-up before any other command to ensure the device is in a known state.
Estimated: At continuous read operation (50 ns cycle, 20 mA active current), power dissipation is approximately 66 mW (3.3 V x 20 mA); the 48-TSOP I package theta_JA is approximately 50 C/W, yielding a junction-temperature rise of about 3.3 C above ambient - well within the -40C to +85C operating range. During programming/erase, peak power dissipation may reach 100 mW briefly, but average dissipation remains low due to duty-cycle limits.
Route the CLE and ALE signals separately from the I/O bus to avoid coupling-induced false command or address latches. Place the WP# (Write Protect) pin high (inactive) via a 10 kohm pull-up to VCC unless WP# control is required in the application - leaving WP# floating may cause unpredictable write-protection behavior during power-up. For multi-PCB-stack designs, route the CE# signal as a point-to-point connection (not bused) to avoid addressing conflicts during simultaneous read/program operations.
Información de cumplimiento
Compliance information not present in verified web data; consult Samsung datasheet or contact Samsung Semiconductor for RoHS/REACH status. The part is NRND per distributor listings, suggesting it may use legacy (pre-RoHS) lead finish in some variants.
