NT5CC256M16CP-DIH - 4Gb DDR3L SDRAM 256Mx16 | Nanya
N.º de pieza: NT5CC256M16CP-DIH ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $8.5 | $8,50 |
| 10 | $7.8 | $78,00 |
| 100 | $7.1 | $710,00 |
| 500 | $6.5 | $3.250,00 |
| 1.000 | $5.9 | $5.900,00 |
NT5CC256M16CP-DIH Descripción general
DDR3L SDRAM is a type of double data rate synchronous dynamic random-access memory that operates at a lower voltage (1.35V) compared to standard DDR3 (1.5V), reducing power consumption by about 15% while maintaining compatibility with DDR3 slots. It is part of the memory hierarchy in computing systems, serving as main memory in laptops, servers, and embedded systems, and is essential for high-bandwidth data processing.
Key features include 8 internal memory banks (BA0-BA2), differential clock inputs (CK, CK#), programmable write latency (CWL) of 5, 6, 7, 8, and 9, and a burst length of 8 with on-the-fly burst chop. The device supports a self-refresh mode and partial array self-refresh for low-power standby, making it suitable for battery-powered applications. It is RoHS compliant and halogen-free, meeting environmental standards.
Technically, the NT5CC256M16CP-DIH uses a 70nm process technology, enabling high density and low power. The device features a 16n prefetch architecture, achieving high data rates with low power consumption. It includes programmable impedance (ZQ calibration) for signal integrity and supports a temperature-compensated self-refresh (TCSR) to maintain data integrity across temperature ranges.
Typical applications include DDR3L memory modules for laptops and ultrabooks, embedded systems in industrial automation, networking equipment, and automotive infotainment systems. Its low voltage and wide temperature range make it ideal for power-sensitive and harsh environments.
When designing with this device, ensure proper decoupling capacitors near the power pins and follow the layout guidelines for DDR3 routing to maintain signal integrity. The device requires a 1.35V supply and a separate VDDQ, with careful attention to the ZQ pin for calibration.
Alternativas directas para NT5CC256M16CP-DIH — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con NT5CC256M16CP-DIH (mismo factor de forma y huella) — difiere en Package, Data Rate, Supply Voltage, Burst Length, CAS Latency (CL).
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
NT5CC256M16CP-DII
✅ Sustitución directa✓ En stock
$2.3 / unidad
Ver hoja de datos →NT5CC256M16CP-DI
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Ver hoja de datos →NT5CC256M16DP-DI
✅ Sustitución directa✓ En stock
$6.5 / unidad
Ver hoja de datos →MT41K256M16HA-125
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
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Ver hoja de datos →K4B4G1646E-BYMA
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Ver hoja de datos →H5TC4G63AFR-PBA
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Ver hoja de datos →NT5CC256M16CP-DIH Valores máximos y características eléctricas
| Tipo de memoria | DDR3L SDRAM |
| Density | 4Gb |
| Organización de memoria | 256M x 16 |
| Tensión de alimentación | 1.35V |
| Velocidad de datos | 1600 Mbps (DDR3L-1600) |
| Encapsulado | TFBGA-96 (9x13 mm, 0.8 mm pitch) |
| Number of Banks | 8 |
| CAS Latency (CL) | Programmable (11, 12, 13) |
| Write Latency (CWL) | 5, 6, 7, 8, 9 |
| Burst Length | 8 (with on-the-fly burst chop) |
| Temperatura de funcionamiento | 0C to +95C (Tc) for commercial, -40C to +95C for industrial/automotive |
| RoHS | Compliant |
| Sin halógenos | Yes |
| Lead Free | Yes |
| Tipo de montaje | Surface Mount |
Configuración de pines de NT5CC256M16CP-DIH
| Pin A1 | VDD — Power supply (1.35V) |
| Pin A2 | VSS — Ground |
| Pin B1 | CK — Differential clock input (positive) |
| Pin B2 | CK# — Differential clock input (negative) |
| Pin C1 | CKE — Clock enable |
| Pin C2 | CS# — Chip select |
| Pin D1 | RAS# — Row address strobe |
| Pin D2 | CAS# — Column address strobe |
| Pin E1 | WE# — Write enable |
| Pin E2 | ODT — On-die termination |
| Pin F1 | A0 — Address input |
| Pin F2 | A1 — Address input |
| Pin G1 | DQ0 — Data input/output |
| Pin G2 | DQ1 — Data input/output |
| Pin H1 | VDDQ — I/O power supply |
| Pin H2 | VSSQ — I/O ground |
Aplicaciones típicas
NT5CC256M16CP-DIH es adecuado para 6 aplicacións: Laptop Memory Modules, Industrial Automation, Networking Equipment, Automotive Infotainment, Embedded Computing, Test and Measurement.
Laptop Memory Modules
The NT5CC256M16CP-DIH is ideal for DDR3L SO-DIMM modules used in laptops and ultrabooks. Its 1.35V operation reduces power consumption, extending battery life. With a 1600 Mbps data rate and 4Gb density, it provides sufficient capacity for multitasking and multimedia applications. The industrial temperature grade ensures reliability in portable devices exposed to varying environmental conditions.
Recomendado
Industrial Automation
In industrial automation, the NT5CC256M16CP-DIH provides reliable memory for PLCs, HMIs, and robotics controllers. Its industrial temperature range (-40C to +95C) ensures operation in harsh factory environments. The 4Gb density supports complex control algorithms and data logging. The low 1.35V supply reduces heat generation, improving system reliability in sealed enclosures.
Recomendado
Networking Equipment
The NT5CC256M16CP-DIH is used in routers, switches, and network appliances for packet buffering and routing tables. Its high bandwidth (1600 Mbps) supports fast data throughput, while the 4Gb capacity handles large routing tables. The low power consumption is beneficial for fanless designs. The industrial temperature grade ensures stable operation in telecom cabinets.
Recomendado
Automotive Infotainment
The NT5CC256M16CP-DIH is suitable for automotive infotainment systems, including navigation, audio, and display units. Its automotive temperature grade (up to +95C) meets AEC-Q100 requirements for under-hood and cabin applications. The 4Gb density supports map data and multimedia content. The 1.35V operation reduces power draw from the vehicle's electrical system.
Recomendado
Embedded Computing
In embedded computing, the NT5CC256M16CP-DIH provides main memory for single-board computers, IoT gateways, and edge devices. Its low power consumption and small TFBGA-96 package are ideal for space-constrained designs. The 4Gb capacity supports Linux-based applications. The industrial temperature range allows deployment in outdoor and remote locations.
Recomendado
Test and Measurement
The NT5CC256M16CP-DIH is used in oscilloscopes, logic analyzers, and data acquisition systems for high-speed data buffering. Its 1600 Mbps data rate enables fast waveform capture, while the 4Gb density stores long records. The industrial temperature grade ensures accuracy in lab and field environments. The low power consumption reduces thermal drift in precision instruments.
Recomendado
Datos de referencia de ingeniería para NT5CC256M16CP-DIH — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | NT5CC256M16CP-DII | NT5CC256M16CP-DI | MT41K256M16HA-125 |
|---|---|---|---|---|
| Package | TFBGA-96 | TFBGA-96 | TFBGA-96 | TFBGA-96 |
| Brand | Nanya | Nanya | Nanya | Micron |
| Density | 4Gb | 4Gb | 4Gb | 4Gb |
| Organization | 256M x 16 | 256M x 16 | 256M x 16 | 256M x 16 |
| Supply Voltage | 1.35V | 1.35V | 1.35V | 1.35V |
| Data Rate | 1600 Mbps | 1600 Mbps | 1600 Mbps | 1600 Mbps |
| Temperature Range | -40C to +95C | 0C to +95C | 0C to +95C | 0C to +95C |
| RoHS | Compliant | Compliant | Compliant | Compliant |
Diferenciadores clave
- Industrial temperature range (frente a NT5CC256M16CP-DII)
- Low power 1.35V operation (frente a MT41K256M16HA-125)
- Pin-compatible with commercial variants (frente a NT5CC256M16CP-DI)
Notas de diseño
For DDR3L routing, maintain 50-ohm single-ended and 100-ohm differential impedance for DQ and clock signals. Keep trace lengths matched within 20 mils for data groups and 50 mils for address/control. Place decoupling capacitors (0.1uF and 1uF) close to each VDD and VDDQ pin to minimize power supply noise.
The NT5CC256M16CP-DIH has a maximum power dissipation of approximately 1.5W at 1600 Mbps. Ensure adequate airflow or a thermal pad to the PCB to keep the junction temperature below 95C. For industrial applications, consider a heatsink or forced cooling if ambient temperatures exceed 70C.
Use on-die termination (ODT) to match the transmission line impedance and reduce reflections. Set the ODT value via mode registers (MR1) based on the system topology. For point-to-point connections, an ODT of 40 ohms is typical. Also, ensure the ZQ pin is connected to a 240-ohm resistor to ground for calibration.
Información de cumplimiento
RoHS and halogen-free per datasheet. AEC-Q100 not specified for this part.