NT5CC256M16CP-DII - 4Gb DDR3L SDRAM 256Mx16 | Nanya
N.º de pieza: NT5CC256M16CP-DII ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $2.97 | $2,97 |
| 10 | $2.85 | $28,50 |
| 100 | $2.65 | $265,00 |
| 500 | $2.45 | $1.225,00 |
| 1.000 | $2.3 | $2.300,00 |
NT5CC256M16CP-DII Descripción general
DDR3L (Double Data Rate 3 Low Voltage) SDRAM is a type of synchronous dynamic random-access memory that operates at a lower voltage (1.35V) compared to standard DDR3 (1.5V), reducing power consumption by up to 20% while maintaining similar performance. It is part of the DDR3 memory family, which uses double data rate signaling to transfer data on both edges of the clock, and is widely used in computing and embedded systems.
Key features include a 256Mx16 organization, 800MHz clock frequency (1600Mbps data rate), 1.35V nominal voltage, and industrial temperature grade. The device supports 8192 refresh cycles and features on-die termination (ODT) for improved signal integrity. The TFBGA-96 package with 0.8mm pitch enables compact PCB designs, and the halogen-free, RoHS-compliant construction meets modern environmental standards.
The NT5CC256M16CP-DII utilizes Nanya's 70nm DDR3 A-die process technology, offering a balance of performance and power efficiency. The 1.35V DDR3L parts are backward compatible with 1.5V DDR3 systems, providing design flexibility. The industrial temperature grade ensures reliable operation from -40°C to +95°C, making it suitable for harsh environments.
Typical applications include networking equipment (routers, switches), industrial automation controllers, embedded computing modules, and automotive infotainment systems. The high density and low power consumption make it ideal for memory-intensive applications where space and thermal budgets are constrained.
When designing with this device, ensure proper decoupling capacitors near the power pins and follow the PCB layout guidelines in the datasheet to maintain signal integrity at DDR3-1600 speeds. The ODT feature should be configured via mode registers to match the system's memory topology.
Alternativas directas para NT5CC256M16CP-DII — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con NT5CC256M16CP-DII (mismo factor de forma y huella) — difiere en Package, Supply Voltage, Data Rate, Burst Length, CAS Latency (CL).
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
NT5CC256M16DP-DI
✅ Sustitución directa✓ En stock
$6.5 / unidad
Ver hoja de datos →NT5CC256M16ER-DII
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
NT5CC256M16CP-DI
✅ Sustitución directa✓ En stock
$2.9 / unidad
Ver hoja de datos →MT41K256M16TW-107
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$14.1 / unidad
Ver hoja de datos →K4B4G1646E-BYMA
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$14.3182 / unidad
Ver hoja de datos →IS43TR16512B-125KBLI
✅ Sustitución directa ⚠️ Especificaciones sin verificar📋 Alternativa de referencia (no en el catálogo)
NT5CC256M16CP-DII Valores máximos y características eléctricas
| Tipo de memoria | DDR3L SDRAM |
| Organización de memoria | 256M x 16 |
| Total Density | 4Gb |
| Clock Frequency | 800 MHz |
| Velocidad de datos | 1600 Mbps |
| Tensión de alimentación | 1.35 V |
| Temperature Grade | Industrial |
| Encapsulado | TFBGA-96 (9x13 mm, 0.8 mm pitch) |
| Number of Terminals | 96 |
| Refresh Cycles | 8192 |
| Access Time | 0.225 ns |
| Technology | CMOS |
| RoHS | Compliant |
| Sin halógenos | Yes |
| Rango de temperatura de funcionamiento | -40°C to +95°C |
Configuración de pines de NT5CC256M16CP-DII
| Pin A1 | VDD — Power supply |
| Pin A2 | DQ0 — Data input/output 0 |
| Pin A3 | DQ1 — Data input/output 1 |
| Pin A4 | VSS — Ground |
| Pin A5 | DQ2 — Data input/output 2 |
| Pin A6 | DQ3 — Data input/output 3 |
| Pin A7 | VDD — Power supply |
| Pin A8 | DQ4 — Data input/output 4 |
| Pin A9 | DQ5 — Data input/output 5 |
| Pin A10 | VSS — Ground |
| Pin A11 | DQ6 — Data input/output 6 |
| Pin A12 | DQ7 — Data input/output 7 |
Aplicaciones típicas
NT5CC256M16CP-DII es adecuado para 6 aplicacións: Networking Equipment, Industrial Automation, Embedded Computing, Automotive Infotainment, Data Center Storage, Medical Devices.
Networking Equipment
The NT5CC256M16CP-DII provides high-density, low-power memory for routers and switches. Its 4Gb density and 1600Mbps data rate support high-throughput packet processing, while the 1.35V operation reduces power consumption in always-on network devices. The industrial temperature grade ensures reliable operation in uncontrolled environments like telecom cabinets.
Recomendado
Industrial Automation
In industrial controllers and PLCs, the NT5CC256M16CP-DII offers reliable memory with industrial temperature rating. The 256Mx16 organization provides ample storage for control algorithms and data logging. Its low voltage and high density enable compact, energy-efficient designs for factory floor equipment that must operate 24/7 in harsh conditions.
Recomendado
Embedded Computing
For embedded computing modules, the NT5CC256M16CP-DII delivers high memory bandwidth in a small TFBGA-96 package. The 1600Mbps data rate supports demanding applications like real-time data processing and edge computing. The 1.35V supply reduces thermal load, making it suitable for fanless designs in space-constrained systems.
Recomendado
Automotive Infotainment
The NT5CC256M16CP-DII is suitable for automotive infotainment systems that require high-density memory for navigation, multimedia, and connectivity. Its industrial temperature grade covers automotive cabin environments, and the low power consumption helps meet vehicle energy budgets. The 4Gb density supports complex user interfaces and multiple applications simultaneously.
Recomendado
Data Center Storage
In data center storage controllers, the NT5CC256M16CP-DII provides high-density, low-power memory for caching and buffering. The 1600Mbps data rate enables fast data transfers, while the 1.35V operation reduces power consumption in large-scale deployments. The industrial temperature grade ensures reliability in server rooms with variable cooling.
Recomendado
Medical Devices
The NT5CC256M16CP-DII is used in medical imaging and monitoring equipment that require reliable, high-density memory. Its industrial temperature grade supports operation in clinical environments, and the low power consumption is beneficial for portable devices. The 4Gb density allows storage of large image datasets and patient records.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para NT5CC256M16CP-DII — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | NT5CC256M16DP-DI | NT5CC256M16ER-DII | MT41K256M16TW-107 |
|---|---|---|---|---|
| Package | TFBGA-96 | TFBGA-96 | TFBGA-96 | FBGA-96 |
| Brand | Nanya Technology | Nanya Technology | Nanya Technology | Micron Technology |
| Density | 4Gb | 4Gb | 4Gb | 4Gb |
| Organization | 256M x 16 | 256M x 16 | 256M x 16 | 256M x 16 |
| Supply Voltage | 1.35 V | 1.35 V | 1.35 V | 1.35 V |
| RoHS | Compliant | Compliant | Compliant | Compliant |
Diferenciadores clave
- Industrial temperature grade (frente a NT5CC256M16CP-DI)
- Low voltage operation (frente a MT41K256M16TW-107)
- Halogen-free and RoHS compliant (frente a K4B4G1646E-BYMA)
Notas de diseño
For DDR3L-1600 operation, maintain controlled impedance for data and address lines (typically 40-60 ohms single-ended). Keep trace lengths matched within 50 mils for data byte lanes and within 100 mils for address/command. Place decoupling capacitors (0.1uF and 1uF) close to each VDD and VDDQ pin to minimize power supply noise.
The industrial temperature grade allows operation up to 95°C case temperature. Ensure adequate airflow or heatsinking in high-ambient environments. The 1.35V supply reduces power dissipation compared to 1.5V DDR3, but at 1600Mbps data rates, the device can still generate significant heat. Monitor junction temperature in dense layouts.
Use on-die termination (ODT) to improve signal integrity on the data bus. Configure RTT_Nom via mode register MR1 to match the system's memory topology. For point-to-point connections, a 40-ohm ODT is typical. For multi-rank systems, adjust ODT and drive strength settings to minimize reflections and crosstalk.
Información de cumplimiento
RoHS compliant and halogen-free per datasheets.com and EEWORLD listings. AEC-Q100 not applicable for DRAM.
